Using micro heat pipes as heat exchanger unit for notebook applications

• US 6,595,270 B2
• Filed: 06/29/2001
• Issued: 07/22/2003
• Est. Priority Date: 06/29/2001
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Walters, Joseph D., Machiroutu, Sridhar V.
• Primary Examiner(s): Bennett, Henry
• Assistant Examiner(s): MCKINNON, TERRELL L
• Application Number:
  US09/895,308
• Publication Number:
  US 20030000682A1
• Time in Patent Office: 753 Days
• Field of Search: 165/80.4, 165/104.26, 165/104.33, 165/185, 298/900.32, 361/700, 174/15.2, 257/715, 257/716
• US Class Current: 165/104.26
• CPC Class Codes: F28D 15/0241 the tubes being flexible
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 2015/0225 Microheat pipes
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A system including a plurality of micro heat pipes is used to transfer heat from a die. A die attach block is coupled with the die. The plurality of micro heat pipes (MHPs) are attached to the die attach block to enable the MHPs to be in close contact with the die to absorb heat generated by the die.

Claims

1. A system, comprising:

multiple micro heat pipes (MHPs) each having a first end and a second end, a central flexible section having wicking internal surface carrying a liquid, the first end placed in contact with a die to transfer heat generated by the die to a heat exchanger using the liquid; and

a thermal attach block coupled to the die, wherein the first end of each of the multiple MHPs is attached to the thermal attach block to enable the first end to be placed in contact with the die.

2. The system of claim 1, wherein the first end is an evaporation end and the second end is a condensation end, both of metallic material.

3. The system of claim 2, wherein the condensation end is attached to the heat exchanger.

4. The system of claim 2, wherein the condensation end is the heat exchanger by applying airflow to the condensation end.

5. A system, comprising:

a die;

a die attach block coupled to the die; and

a plurality of micro heat pipes (MHPs) attached to the die attach block to enable the MHPs to be in close contact with the die to absorb heat generated by the die, each of the MHPs comprising a condensation end and an evaporation end, wherein the evaporation end is attached to the die attach block to be in close contact with the die.

6. The system of claim 5, wherein each of the MHPs has a cross section having a length of up to 1 mm.

7. The system of claim 5, wherein each of the MHPs further comprises a central insulated section made of flexible material, the central insulated section having an internal surface in a shape to provide capillary action.

8. The system of claim 5, wherein the evaporation end and the condensation end are metallic.

9. The system of claim 8, wherein the condensation end of the MHP is attached to a heat exchanger.

10. The system of claim 8, wherein the condensation end of the MHP is used as a heat exchanger by applying air flow to the condensation end.

11. The system of claim 5, wherein being in close contact with the die includes being in direct contact with the die.

12. A system, comprising:

means for placing multiple micro heat pipes (MHPs) to be in contact with a die to absorb heat from the die, each of the MHPs having a first end, a second end, and a central flexible section having wicking internal surface carrying a liquid, the first end placed in contact with a die to absorb the heat using the liquid.

13. The system of claim 12, wherein the first end and the second end are metallic.

14. The system of claim 13, wherein the second end is attached to a heat exchanger.

15. The system of claim 13, wherein the second end is used as a heat exchanger by applying airflow to the second end.

16. A method, comprising:

attaching evaporation ends of a plurality of micro heat pipes (MHPs) to a thermal attach block coupled to a die in a system, wherein the evaporation ends are positioned based on amounts of heat generated by different areas of the die.

17. The method of claim 16, wherein each of the MHPs has a cross section of up to 1 millimeter.

18. The method of claim 16, wherein each of the MHPs comprises a condensation end in addition to the evaporation end.

19. The method of claim 18, wherein each of the MHPs further comprises a central insulated section made of flexible material, the central insulated section having a capillary wicking internal surface.

20. The method of claim 19, wherein the evaporation end and the condensation end are metallic.

21. The method of claim 20, wherein the condensation end of each of the MHPs is attached to a heat exchanger.

22. The method of claim 20, wherein the condensation end of each of the MHPs is used as a heat exchanger by applying air flow to the condensation end.

23. The method of claim 16, wherein the evaporation ends are vertically attached to the thermal attach block.

24. The method of claim 16, wherein the evaporations ends are horizontally attached to the thermal attach block.