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Optoelectronic package with controlled fiber standoff

  • US 6,595,699 B1
  • Filed: 08/03/2001
  • Issued: 07/22/2003
  • Est. Priority Date: 08/03/2001
  • Status: Active Grant
First Claim
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1. An optoelectronic package comprising:

  • a substrate;

    a photonic device carried by the substrate, the photonic device having a top surface that includes an active facet thereon;

    an optical support structure attached to the substrate, the optical support structure having a relatively higher portion and a relatively lower portion;

    an optically clear cap that covers the active facet of the photonic device, the optically clear cap being contained by the optical support structure; and

    an optical fiber in optical communication with the active facet on the photonic device, the optical fiber having a distal tip that is substantially perpendicular to a longitudinal axis of the optical fiber; and

    wherein the relatively higher and lower portions of the optical support structure are arranged to position the distal tip of the optical fiber at a desired standoff distance from the photonic device with a small angle of inclination relative to the top surface of the photonic device.

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