Electronic material composition, electronic parts and use of electronic material composition

• US 6,596,200 B1
• Filed: 06/30/2000
• Issued: 07/22/2003
• Est. Priority Date: 06/30/1999
• Status: Expired due to Fees

• Current Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Original Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Inventors: Ito, Mitsuyoshi, Ogawa, Hideki, Iri, Kinya
• Primary Examiner(s): Kopec, Mark
• Application Number:
  US09/608,621
• Time in Patent Office: 1,117 Days
• Field of Search: 252/511, 252/512, 252/62.54, 252/62.55, 336/15, 336/20, 336/73, 336/221, 338/270, 338/302, 528/109, 528/381, 525/535, 174/110.AR, 174/257
• US Class Current: 252/512
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01C 7/005 Polymer thick films
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/285 Permanent coating compositions
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 9/0083 comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers H05K9/0086 takes precedence

Abstract

Provided is an electronic material composition which is capable of forming a cured film exhibiting a desired glass transition temperature, a desired stiffness modulus in a rubbery state and a desired extensibility at low temperatures. Also provided is an electronic component comprising a molded body, a packed body, a covering body, an electrode or a joining body, all being formed of the aforementioned electronic material composition. Also provided is a method of using the aforementioned electronic material composition, which is featured in that the electronic material composition is applied in a semi-cured state, and after the application thereof, completely cured.

Claims

1. A composition comprising at least a curable polysulfide-based polymer and a powdery electronic material, and exhibiting the following physical properties (a) and (b) after being cured to form a cured body;

(a) temperature characteristic in relative to stiffness modulus, which is featured in that a glass transition temperature in a process of shifting the cured body from a glassy state to a rubbery state due to the change of stiffness modulus in relative to temperature is in the range of −

50 to 50°

C.; and

(b) stiffness modulus in said rubbery state which is in the range of 10⁵ Pa to 10⁷ Pa.

5. The composition according to any one of claims 1 to 4, wherein the polysulfide-based polymer contains a polysulfide rubber skeleton (—

S—

S—

).

6. The composition according to claim 5, wherein the polysulfide-based polymer is polysulfide.

7. The composition according to claim 6, wherein the composition is adapted for use for forming an electronic component and formulated into a raw material for forming a body selected from the group consisting of a molded body, a packed body, a covering body, an electrode and a joining body.

8. The composition according to claim 5, wherein the polysulfide-based polymer is polysulfide-modified epoxy polymer which is a reaction product between polysulfide and an epoxy compound.

9. The composition according to claim 8, wherein the composition is adapted for use for forming an electronic component and formulated into a raw material for forming a body selected from the group consisting of a molded body, a packed body, a covering body, an electrode and a joining body.

10. The composition according to claim 5, wherein the composition is adapted for use for forming an electronic component and formulated into a raw material for forming a body selected from the group consisting of a molded body, a packed body, a covering body, an electrode and a joining body.

11. The composition according to any one of claims 1 to 4, wherein said powdery electronic material is at least one selected from the group consisting of a magnetic material and conductive material.

12. The composition according to claim 11, wherein said magnetic material is powdery ferrite.

13. The composition according to claim 11, wherein said conductive material is a metallic powder.

14. The composition according to claim 13, wherein said metallic powder is selected from the group consisting of silver powder and copper powder.

15. The composition according to any one of claims 1 to 4, wherein the composition is adapted for use for forming an electronic component and formulated into a raw material for forming a body selected from the group consisting of a molded body, a packed body, a covering body, an electrode and a joining body.

2. A composition comprising at least a curable polysulfide-based polymer and a powdery electronic material, and exhibiting the following physical properties (a), (b) and (c) after being cured to form a cured body;

(a) temperature characteristic in relative to stiffness modulus, which is featured in that a glass transition temperature in a process of shifting the cured body from a glassy state to a rubbery state due to the change of stiffness modulus in relative to temperature is in the range of −

50 to 50°

C.;

(b) stiffness modulus in said rubbery state which is in the range of 10⁵ Pa to 10⁷ Pa; and

(c) extensibility which cannot be destroyed even if said cured body is subjected to a shear deformation of 5% at a temperature of −

50°

C.

3. A composition comprising at least powdery electronic material and a curable polysulfide-based polymer, and exhibiting the following physical properties (d) and (e) after being cured to form a cured body;

(d) temperature characteristic in relative to stiffness modulus, which is featured in that a glass transition temperature in a process of shifting the cured body from a glassy state to a rubbery state due to the change of stiffness modulus in relative to temperature is in the range of −

50 to 50°

C.; and

(e) stiffness modulus in said rubbery state which is in the range of 10⁶ Pa to 10⁸ Pa.

4. A composition comprising at least powdery electronic material and a curable polysulfide-based polymer, and exhibiting the following physical properties (d), (e) and (f) after being cured to form a cured body;

(d) temperature characteristic in relative to stiffness modulus, which is featured in that a glass transition temperature in a process of shifting the cured body from a glassy state to a rubbery state due to the change of stiffness modulus in relative to temperature is in the range of −

50 to 50°

C.;

(e) stiffness modulus in said rubbery state which is in the range of 10⁶ Pa to 10⁸ Pa; and

(f) extensibility which cannot be destroyed even if said cured body is subjected to a shear deformation of 2% at a temperature of −

50°

C.

16. An electronic component comprising

a body selected from the group consisting of a molded body, a packed body, a covering body, an electrode and a joining body, said body comprising a composition comprising at least a curable polysulfide-based polymer and a powdery electronic material, and exhibiting the following physical properties:

(1)(a) and (b);

or (2)(a), (b) and (c);

or (3)(d) and (e);

or (4)(d), (e) and (f) after being cured to form a cured body;

(a) temperature characteristic in relative to stiffness modulus, which is featured in that a glass transition temperature in a process of shifting the cured body from a glassy state to a rubbery state due to the change of stiffness modulus in relative to temperature is in the range of −

50 to 50°

C.;

(b) stiffness modulus in said rubbery state which is in the range of 10⁵ Pa to 10⁷ Pa;

(c) extensibility which cannot be destroyed even if said cured body is subjected to a shear deformation of 5% at a temperature of −

50°

C.;

(d) temperature characteristic in relative to stiffness modulus, which is featured in that a glass transition temperature in a process of shifting the cured body from a glassy state to a rubbery state due to the change of stiffness modulus in relative to temperature is in the range of −

50 to 50°

C.;

(e) stiffness modulus in said rubbery state which is in the range of 10⁶ Pa to 10⁸ Pa; and

(f) extensibility which cannot be destroyed even if said cured body is subjected to a shear deformation of 2% at a temperature of −

50°

C.

17. The electronic component according to claim 16, wherein the molded body is a core of wound chip coil which can be obtained by means of molding, and the electronic component is a wound chip coil having said core.

18. The electronic component according to claim 16, wherein the covering body is an external packaging covering the winding of wound chip coil, and the electronic component is a wound chip coil having said external packaging.

19. The electronic component according to claim 16, wherein the covering body is an electromagnetic shielding covering body for a casing, and the electronic component is a casing for an electromagnetic component having said electromagnetic shielding covering body.

20. The electronic component according to claim 16, wherein the covering body is a cable sheath for preventing radiant noise, and the electronic component is a radiant noise-free cable having said cable sheath for preventing radiant noise.

21. The electronic component according to claim 16, wherein the covering body is an external packaging body for packaging mounted components on a printed wiring board, and the electronic component is a printed wiring board having said external packaging.

22. The electronic component according to claim 16, wherein the packed body is obtained by making use of an electromagnetic shielding caulking material as a filler for filling a gap between the electromagnetic shielding boards, panels or tiles, which are designed to form an electromagnetic shielding wall, and the electronic component is an electromagnetic shielding wall having said packed body.

23. The electronic component according to claim 16, wherein the electrode is an external electrode of a chip type electronic component, and the electronic component is a chip type electronic component having said electrode.

24. The electronic component according to claim 16, wherein the joining body is a conductive connecting body for connecting an external electrode of chip component with a soldering land of a printed wiring board, and the electronic component is a printed wiring board having said conductive connecting body.

25. The electronic component according to claim 16, wherein the joining body is an interface connecting body for connecting a pair of members with each other through the interface thereof, each member exhibiting a different irreversible expansion coefficient or shrinkage factor from the other as they are heat-treated, and the electronic component is a composite electronic component wherein said members are connected with each other via said interface connecting body and heat-treated.

26. The electronic component according to claim 16, wherein the joining body is designed to connect a plurality of members, each member exhibiting a different linear expansion coefficient from one another, and the electronic component is an electronic component having said plurality of members which are connected through said joining body.

27. The electronic component according to claim 16, wherein said polysulfide-based polymer is polysulfide.

28. The electronic component according to claim 27, wherein the molded body is a core of wound chip coil which can be obtained by means of molding, and the electronic component is a wound chip coil having said core.

29. The electronic component according to claim 27, wherein the covering body is an external packaging covering the winding of wound chip coil, and the electronic component is a wound chip coil having said external packaging.

30. The electronic component according to claim 27, wherein the covering body is an electromagnetic shielding covering body for a casing, and the electronic component is a casing for an electromagnetic component having said electromagnetic shielding covering body.

31. The electronic component according to claim 27, wherein the covering body is a cable sheath for preventing radiant noise, and the electronic component is a radiant noise-free cable having said cable sheath for preventing radiant noise.

32. The electronic component according to claim 27, wherein the covering body is an external packaging body for packaging mounted components on a printed wiring board, and the electronic component is a printed wiring board having said external packaging.

33. The electronic component according to claim 27, wherein the packed body is obtained by making use of an electromagnetic shielding caulking material as a filler for filling a gap between the electromagnetic shielding boards, panels or tiles which are designed to form an electromagnetic shielding wall, and the electronic component is an electromagnetic shielding wall having said packed body.

34. The electronic component according to claim 27, wherein the electrode is an external electrode of a chip type electronic component, and the electronic component is a chip type electronic component having said electrode.

35. The electronic component according to claim 27, wherein the joining body is a conductive connecting body for connecting an external electrode of chip component with a soldering land of a printed wiring board, and the electronic component is a printed wiring board having said conductive connecting body.

36. The electronic component according to claim 27, wherein the joining body is an interface connecting body for connecting a pair of members with each other through the interface thereof, each member exhibiting a different irreversible expansion coefficient or shrinkage factor from the other as they are heat-treated, and the electronic component is a composite electronic component wherein said members are connected with each other via said interface connecting body and heat-treated.

37. The electronic component according to claim 27, wherein the joining body is designed to connect a plurality of members, each member exhibiting a different linear expansion coefficient from one another, and the electronic component is an electronic component having said plurality of members which are connected through said joining body.

38. The electronic component according to claim 16, wherein polysulfide-based polymer is polysulfide-modified epoxy polymer which is a reaction product between polysulfide and an epoxy compound.

39. The electronic component according to claim 38, wherein the molded body is a core of wound chip coil which can be obtained by means of molding, and the electronic component is a wound chip coil having said core.

40. The electronic component according to claim 38, wherein the covering body is an external packaging covering the winding of wound chip coil, and the electronic component is a wound chip coil having said external packaging.

41. The electronic component according to claim 38, wherein the covering body is an electromagnetic shielding covering body for a casing, and the electronic component is a casing for an electromagnetic component having said electromagnetic shielding covering body.

42. The electronic component according to claim 38, wherein the covering body is a cable sheath for preventing radiant noise, and the electronic component is a radiant noise-free cable having said cable sheath for preventing radiant noise.

43. The electronic component according to claim 38, wherein the covering body is an external packaging body for packaging mounted components on a printed wiring board, and the electronic component is a printed wiring board having said external packaging.

44. The electronic component according to claim 38, wherein the packed body is obtained by making use of an electromagnetic shielding caulking material as a filler for filling a gap between the electromagnetic shielding boards, panels or tiles, which are designed to form an electromagnetic shielding wall, and the electronic component is an electromagnetic shielding wall having said packed body.

45. The electronic component according to claim 38, wherein the electrode is an external electrode of a chip type electronic component, and the electronic component is a chip type electronic component having said electrode.

46. The electronic component according to claim 38, wherein the joining body is a conductive connecting body for connecting an external electrode of chip component with a soldering land of a printed wiring board, and the electronic component is a printed wiring board having said conductive connecting body.

47. The electronic component according to claim 38, wherein the joining body is an interface connecting body for connecting a pair of members with each other through the interface thereof, each member exhibiting a different irreversible expansion coefficient or shrinkage factor from the other as they are heat-treated, and the electronic component is a composite electronic component wherein said members are connected with each other via said interface connecting body and heat-treated.

48. The electronic component according to claim 38, wherein the joining body is designed to connect a plurality of members, each member exhibiting a different linear expansion coefficient from one another, and the electronic component is an electronic component having said plurality of members which are connected through said joining body.

49. An electronic component according to claim 16, wherein said composition exhibits physical properties (a) and (b).

50. An electronic component according to claim 16, wherein said composition exhibits physical properties (a), (b) and (c).

51. An electronic component according to claim 16, wherein said composition exhibits physical properties (d) and (e).

52. An electronic component according to claim 16, wherein said composition exhibits physical properties (d), (e) and (f).

53. A method of using an electronic material composition, which comprises the steps of;

forming an electronic component having a semi-cured state of a molded body, a packed body, a covering body, an electrode or a joining body by making use of a composition comprising at least a curable polysulfide-based polymer and a powdery electronic material, and exhibiting the following physical properties;

(1)(a) and (b);

or (2)(a), (b) and (c);

or (3)(d) and (e);

or (4)(d), (e) and (f), after being cured to form a cured body;

(a) temperature characteristic in relative to stiffness modulus, which is featured in that a glass transition temperature in a process of shifting the cured body from a glassy state to a rubbery state due to the change of stiffness modulus in relative to temperature is in the range of −

50 to 50°

C.;

(b) stiffness modulus in said rubbery state which is in the range of 10⁵ Pa to 10⁷ Pa;

(c) extensibility which cannot be destroyed even if said cured body is subjected to a shear deformation of 5% at a temperature of −

50°

C.;

(d) temperature characteristic in relative to stiffness modulus, which is featured in that a glass transition temperature in a process of shifting the cured body from a glassy state to a rubbery state due to the change of stiffness modulus in relative to temperature is in the range of −

50 to 50°

C.;

(e) stiffness modulus in said rubbery state which is in the range of 10⁶ Pa to 10⁸ Pa; and

(f) extensibility which cannot be destroyed even if said cured body is subjected to a shear deformation of 2% at a temperature of −

50°

C.; and

completely curing the molded body, the packed body, the covering body, the electrode or the joining body to obtain the electronic component having a cured state of the molded body, the packed body, the covering body, the electrode or the joining body.

54. The method of using an electronic material composition according to claim 53, wherein said polysulfide-based polymer is polysulfide.

55. The method of using an electronic material composition according to claim 53, wherein said polysulfide-based polymer is polysulfide-modified epoxy polymer which is a reaction product between polysulfide and an epoxy compound.

56. The method according to claim 53, wherein said composition exhibits physical properties (a) and (b).

57. The method according to claim 53, wherein said composition exhibits physical properties (a), (b) and (c).

58. The method according to claim 53, wherein said composition exhibits physical properties (d) and (e).

59. The method according to claim 53, wherein said composition exhibits physical properties (d), (e) and (f).