Nanoscopic thermoelectric refrigerators

• US 6,598,403 B1
• Filed: 04/11/2002
• Issued: 07/29/2003
• Est. Priority Date: 04/11/2002
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Ghoshal, Uttam Shyamalindu
• Primary Examiner(s): Doerrler, William C.
• Assistant Examiner(s): SHULMAN, MARK S
• Application Number:
  US10/121,497
• Time in Patent Office: 474 Days
• Field of Search: 62/32, 62/33, 62/36, 62/37, 62/39
• US Class Current: 62/3.2
• CPC Class Codes: F25B 21/02 using Peltier effect; using Nernst-Ettinghausen effect
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H10N 10/17 characterised by the structure or configuration of the cell or thermocouple forming the device
• CPC Class Codes: Y10S 977/833 Thermal property of nanomaterial, e.g. thermally conducting/insulating or exhibiting peltier or seebeck effect

Abstract

A thermoelectric cooling system integrating quantum cold point connections with lateral thermoelectric element formation. A preferred system has an n-type and p-type thermoelectric element, each connected to a common conducting section. The thermoelectric elements are each tapered at the end where they contact the common conducting section. The thermoelectric elements preferably all occupy substantially the same plane as each other and as the common conducting section.

Claims

1. A thermoelectric cooling system, comprising:

first and second thermoelectric elements formed over a substrate, the first and second thermoelectric elements each connected to a first conducting section;

a second conducting section connected to the first thermoelectric element;

a third conducting section connected to the second thermoelectric element;

wherein the first thermoelectric element has a smaller surface contact area with the first conducting section than it has with the second conducting section;

wherein the second thermoelectric element has a smaller surface contact area with the first conducting section than it has with the third conducting section; and

wherein the first and second thermoelectric elements are formed in substantially the same plane as the first, second, and third conducting sections occupy.

2. The cooling system of claim 1, wherein the thermoelectric cooling system is disposed on an integrated circuit to cool a region of the circuit.

3. The cooling system of claim 1, wherein the thermoelectric cooling system forms a cooling unit, and wherein a plurality of cooling units are configured to collectively cool a region.

4. A thermoelectric cooling system, comprising:

an n-type thermoelectric element and a p-type thermoelectric element each coupled to a first conducting section;

a second conducting section connected to the n-type element;

a third conducting section connected to the p-type element;

wherein the n-type element, the p-type element, and the first, second, and third conducting sections substantially occupy the same plane.

5. The thermoelectric cooling system of claim 4, wherein the thermoelectric cooling system is disposed on an integrated circuit to cool a region of the circuit.

6. The thermoelectric cooling system of claim 4, wherein the thermoelectric cooling system forms a cooling unit, and wherein a plurality of cooling units are configured to collectively cool a region.

7. The thermoelectric cooling system of claim 4, further comprising third and fourth thermoelectric elements each coupled to the first conducting section, wherein the n-type thermoelectric element, the p-type thermoelectric element, the third and fourth thermoelectric elements, and the first conducting section are all coplanar.

8. The thermoelectric cooling system of claim 4, wherein the n-type and p-type thermoelectric elements are substantially tapered to points where they couple to the first conducting section.

9. The thermoelectric cooling system of claim 4, wherein the n-type and p-type thermoelectric elements couple to the first conducting section using nanowires.

10. The thermoelectric cooling system of claim 4, wherein-the first conducting section comprises a first central island, and wherein the thermoelectric cooling system comprises a plurality of central islands, each of the central islands of the plurality having at least two thermoelectric elements connected thereto.

11. A thermoelectric cooling system, comprising:

a plurality of thermoelectric elements, each element of the plurality having a connection to a common conducting section;

wherein the plurality of elements and the common conducting section substantially occupy the same plane.

12. The thermoelectric cooling system of claim 11, wherein each of the thermoelectric elements of the plurality has a narrowed end where it contacts the common conducting section.

13. The thermoelectric cooling system of claim 11, wherein the thermoelectric cooling system is disposed on an integrated circuit to cool a region of the circuit.

14. The thermoelectric cooling system of claim 11, wherein the thermoelectric cooling system forms a cooling unit, and wherein a plurality of cooling units are configured to collectively cool a region.

15. A method of forming a thermoelectric cooling system, comprising the steps of:

forming a substrate, the substrate having an insulating layer thereon;

forming a conducting layer above the insulating layer to form a multi-layer structure;

in a first region, removing a first part of the multi-layer structure from the substrate such that the first region is bounded by a first section of the multi-layer structure and a second section of the multi-layer structure;

in a second region, removing a second part of the multi-layer structure from the substrate such that the second region is bounded by the second section of the multi-layer structure and a third section of the multi-layer structure;

forming between the conducting layer of the first section of the multi-layer structure and the conducting layer of the second section of the multi-layer structure a first thermoelectric element;

forming between the conducting layer of the second section of the multi-layer structure and the conducting layer of the third section of the multi-layer structure a second thermoelectric element.

16. The method of claim 15, wherein the first thermoelectric element has a smaller area of contact with the second conducting layer of the second section of the multi-layer structure than it does with the conducting layer of the first section of the multi-layer structure;

and

wherein the second thermoelectric element has a smaller area of contact with the second conducting layer of the second section of the multi-layer structure than it does with the conducting layer of the third section of the multi-layer structure.

17. The method of claim 15, wherein the steps of forming the first and second thermoelectric elements include electroplating.

18. The method of claim 15, wherein the thermoelectric cooling system is disposed on an integrated circuit to cool a region of the circuit.

19. The method of claim 15, wherein the thermoelectric cooling system forms a cooling unit, and wherein a plurality of cooling units are configured to collectively cool a region.

20. A thermoelectric cooling system, comprising:

means for forming a substrate, the substrate having an insulating layer thereon;

means for forming a conducting layer above the insulating layer to form a multi-layer structure;

in a first region, means for removing a first part of the multi-layer structure from the substrate such that the first region is bounded by a first section of the multi-layer structure and a second section of the multi-layer structure;

in a second region, means for removing a second part of the multi-layer structure from the substrate such that the second region is bounded by the second section of the multi-layer structure and a third section of the multi-layer structure;

means for forming between the conducting layer of the first section of the multi-layer structure and the conducting layer of the second section of the multi-layer structure a first thermoelectric element;

means for forming between the conducting layer of the second section of the multi-layer structure and the conducting layer of the third section of the multi-layer structure a second thermoelectric element.

21. The thermoelectric cooling system of claim 20, wherein the first thermoelectric element has a smaller area of contact with the second conducting layer of the second section of the multi-layer structure than it does with the conducting layer of the first section of the multi-layer structure;

and

wherein the second thermoelectric element has a smaller area of contact with the second conducting layer of the second section of the multi-layer structure than it does with the conducting layer of the third section of the multi-layer structure.

22. The thermoelectric cooling system of claim 20, wherein the cooling system is disposed on an integrated circuit to cool a region of the circuit.

23. The thermoelectric cooling system of claim 20, wherein the thermoelectric cooling system forms a cooling unit, and wherein a plurality of cooling units are configured to collectively cool a region.

24. A thermoelectric cooling system, comprising:

a first row of n-type thermoelectric elements, each connected to a first conducting section;

a first row of p-type thermoelectric elements, each connected to the first conducting section;

a second conducting section connected to each of the n-type elements;

a third conducting section connected to each of the p-type elements;

wherein the first row of n-type elements and the first row of p-type elements form an array of thermoelectric coolers which collectively cool the first conducting section when a current is applied to the cooling system;

wherein the first row of n-type elements and the first row of p-type elements occupy substantially the same plane as the first conducting section.

25. The thermoelectric cooling system of claim 24, wherein at least one of the plurality of n-type elements has a smaller surface contact area with the first conducting section than with the second conducting section;

and

wherein at least one of the plurality of p-type elements has a smaller surface contact area with the first conducting section than with the third conducting section.

26. The thermoelectric cooling system of claim 24, wherein the thermoelectric cooling system is disposed on an integrated circuit to cool a region of the circuit.

27. The thermoelectric cooling system of claim 24, wherein the thermoelectric cooling system forms a cooling unit, and wherein a plurality of cooling units are configured to collectively cool a region.