Overload resistant differential pressure sensor

• US 6,598,482 B2
• Filed: 06/14/2002
• Issued: 07/29/2003
• Est. Priority Date: 06/23/2001
• Status: Expired due to Fees

• Current Assignee: ABB Patent GmbH (ABB Limited)
• Original Assignee: ABB Patent GmbH (ABB Limited)
• Inventors: Scholz, Wolfgang, Krippner, Peter, Vogel, Albrecht
• Primary Examiner(s): Lefkowitz, Edward
• Assistant Examiner(s): Ellington, Alandra
• Application Number:
  US10/172,131
• Publication Number:
  US 20020194918A1
• Time in Patent Office: 410 Days
• Field of Search: 737/00, 737/15--22, 737/06, 737/56
• US Class Current: 73/716
• CPC Class Codes: G01L 13/026 involving double diaphragm
• CPC Class Codes: G01L 19/0618 Overload protection
• CPC Class Codes: G01L 19/0627 Protection against aggressive medium in general

Abstract

A differential pressure sensor has a first and a second measuring chamber. Each measuring chamber is limited by a rigid carrier plate and a diaphragm plate, which is formed in the region of the measuring chamber as a pressure-sensitive measuring diaphragm. To design the differential pressure sensor to be resistant to overloading, the carrier plate is arranged between a first and a second diaphragm plate and has congruent concave depressions on opposite sides in the plane of the plate. The depressions are connected to one another by a decentered duct, penetrating the carrier plate perpendicularly to the plane of the plates. In the region of the measuring chambers, the diaphragm plates are formed congruently in relation to the depressions as pressure-sensitive measuring diaphragms. The measuring chambers and the duct are filled with an incompressible fluid.

Claims

1. A differential pressure sensor comprising:

a rigid carrier plate arranged between first and second diaphragm plates, said carrier plate having congruent concave depressions on opposite sides of said carrier plate;

a decentered duct penetrating said carrier plate perpendicularly to the plane of said first and second diaphragm plates, said duct hydraulically coupling said depressions to each other;

first and second measuring chambers, each of said chambers limited by said carrier plate and an associated one of said first and said second diaphragm plates;

said first and said second diaphragm plates in the region of said associated one of said first and said second measuring chambers are each formed congruently as pressure sensitive measuring diaphragms in relation to an associated one of concave depressions in said carrier plate; and

an incompressible fluid filling said first and second measuring chambers and said duct.

2. The differential pressure sensor of claim 1 wherein said carrier plate consists of glass.

3. The differential pressure sensor of claim 1 wherein said first and second diaphragm plates consist of silicon.

4. The differential pressure sensor of claim 1 wherein said first and second diaphragm plates are anodically bonded to the carrier plate.

5. The differential pressure sensor of claim 1 wherein the surfaces of said first and second diaphragm plates facing away from said carrier plate are coated with diamond.

6. The differential pressure sensor of claim 1 wherein the surfaces of said first and second diaphragm plates facing away from the carrier plate are coated with silicon nitride.

7. The differential pressure sensor of claim 1 wherein the surfaces of said first and second diaphragm plates facing away from the carrier plate are coated with a corrosion-resistant metal.

8. The differential pressure sensor of claim 1 wherein the surfaces of said first and second measuring diaphragms facing said carrier plate and the surfaces of said concave depressions are conductively coated in such a way that they are isolated from one another.

9. The differential pressure sensor of claim 8 wherein said conductive coating consists of gold.

10. The differential pressure sensor of claim 8 wherein said conductive coating of the surfaces of said first and second measuring diaphragms is formed by a local doping of silicon.

11. The differential pressure sensor of claim 1 wherein mutually isolated piezoresistive conductor tracks are arranged on the surfaces of said first and second measuring diaphragms facing said carrier plate.

12. The differential pressure sensor of claim 11 wherein said piezoresistive conductor tracks are formed by a local doping of silicon.

13. A method for making a differential pressure sensor with first and second measuring chambers comprising:

a. providing congruent concave depressions on opposite sides of a rigid carrier plate in the plane of said carrier plate;

b. arranging said carrier plate between first and second diaphragm plates, said first and second diaphragm plates formed congruently in the region of an associated one of said concave depressions as first and second pressure sensitive measuring diaphragms;

c. hydraulically coupling said concave depressions to each other by a decentered duct which penetrates said carrier plate perpendicularly to the plane of said first and second diaphragm plates; and

d. filling said measuring chamber and said duct with an incompressible fluid.

14. The method of claim 13 further comprising anodically bonding said first and second diaphragm plates to said carrier plate.

15. The method of claim 13 further comprising coating with diamond the surfaces of said first and second diaphragm plates facing away from said carrier plate.

16. The method of claim 13 further comprising coating with silicon nitride the surfaces of said first and second diaphragm plates facing away from said carrier plate.

17. The method of claim 13 further comprising conductively coating the surfaces of said first and second diaphragm plates facing said carrier plate and the surfaces of said concave depressions in such a way that they are isolated from one another.

18. The method of claim 13 further comprising arranging mutually isolated piezoresistive conductor tracks on the surfaces of said first and second measuring diaphragms facing said carrier plate.

19. The method of claim 18 further comprising forming said piezoresistive conductor tracks by a local doping of silicon.