×

High-density removable expansion module having I/O and second-level-removable expansion memory

  • US 6,599,147 B1
  • Filed: 11/12/1999
  • Issued: 07/29/2003
  • Est. Priority Date: 05/11/1999
  • Status: Expired due to Term
First Claim
Patent Images

1. An assembly for both interfacing with an external I/O subsystem and for receiving a removable expansion module of a first type, said module having first and second major sides, two minor sides, and an insertion end, said assembly comprising:

  • a) a printed circuit board (PCB);

    b) an I/O connector mounted on said PCB for electrical coupling between said PCB and said external I/O subsystem, said I/O connector further serving as a first brace for guiding and positioning said first major side of said module;

    c) a riser mounted on said PCB, said riser having module contacts for electrical coupling between said PCB and said module, said riser further serving as a second brace for guiding and positioning said first major side of said module;

    d) a bus connector mounted on said PCB;

    e) circuitry mounted on said PCB; and

    f) an outer frame having a shape conformed to fit said PCB, said I/O connector, and said bus connector; and

    wherein said assembly implements a removable expansion module of a second type, said module of said first type being at least partially insertable into said module of said second type.

View all claims
  • 9 Assignments
Timeline View
Assignment View
    ×
    ×