Process for mounting device and optical transmission apparatus

• US 6,599,769 B2
• Filed: 06/29/2001
• Issued: 07/29/2003
• Est. Priority Date: 06/30/2000
• Status: Expired due to Fees

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Kondo, Takayuki, Shimoda, Tatsuya, Sato, Atsushi
• Primary Examiner(s): Pham, Long
• Application Number:
  US09/895,824
• Publication Number:
  US 20020055200A1
• Time in Patent Office: 760 Days
• Field of Search: 438/107, 438/118, 438/26, 438/28, 257/618, 257/622, 257/623
• US Class Current: 438/28
• CPC Class Codes: G02B 6/29361 Interference filters, e.g. multilayer coatings, thin film filters, dichroic splitters or mirrors based on multilayers, WDM filters
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/10158 at the passive surface
• CPC Class Codes: H01S 5/02326 Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
• CPC Class Codes: H01S 5/0262 Photo-diodes, e.g. transceiver devices, bidirectional devices H01S5/0265 takes precedence
• CPC Class Codes: H01S 5/183 having only vertical cavities, e.g. vertical cavity surface-emitting lasers [VCSEL]
• CPC Class Codes: H01S 5/423 having a vertical cavity

Abstract

An optical transmission apparatus applicable to an optical interconnection apparatus for interconnection between stacked IC chips, and a process of mounting elements for manufacturing such an apparatus are disclosed. For example, light emitting elements (2a, 2b), each having a surface emitting laser of a different wavelength, are respectively formed on trapezoidal microstructures (7a, 7b) having different sizes, and light receiving elements (3a, 3b), each having a filter for receiving light in the wavelength range of each light emitting element, are respectively formed on trapezoidal microstructures (8a, 8b) having different sizes. On substrates (4a to 4c) having concave portions (5a, 5b, 6a, 6b) which have forms identical to those of the microstructures and are formed at positions where the light emitting and receiving elements are provided, a slurry including the microstructures is made to flow, thereby each microstructure is fit into the corresponding concave portion due to gravity.

Claims

1. A process of mounting elements, comprising the steps of:

forming concave portions having different sizes at predetermined positions on a surface of a base;

forming microstructures on which elements having different functions are provided, the microstructures having different sizes corresponding to the sizes of the concave portions;

putting the microstructures into fluids to create a plurality of slurries, each slurry containing one size of the microstructures; and

fitting the microstructures into the concave portions by making the plurality of slurries consecutively flow over the surface of the base in order of the size of the microstructure contained in the slurries from largest to smallest.

2. The process as claimed in claim 1, wherein:

the elements having different functions further comprise light emitting elements, each light emitting element emitting light of a different wavelength; and

the step of filling the microstructures into the concave portions includes mounting the light emitting elements at said predetermined positions on the surface of the base.

3. The process as claimed in claim 1, wherein:

the elements having different functions further comprise light receiving elements, each light receiving element receiving light of a different wavelength; and

the step of fitting the microstructures into the concave portions includes mounting the light receiving elements at said predetermined positions on the surface of the base.

4. The process as claimed in claim 3, wherein:

the light receiving elements further comprise photodiodes, each photodiode having a light receiving surface on which a band-pass filter is provided.

5. The process as claimed in claim 1, wherein:

the elements having different functions are selected from the group consisting of light emitting elements and light receiving elements, each light emitting element emitting light of a different wavelength, and each light receiving element receiving light of a different wavelength; and

the step of fitting the microstructures into the concave portions includes mounting the selected elements at said predetermined positions on the surface of the base.

6. The process as claimed in claim 5, wherein the light receiving elements further comprise photodiodes, each photodiode having a light receiving surface on which a band-pass filter is provided.

7. The process as claimed in claim 5, wherein:

said step of forming concave portions further comprises forming said concave portions having different sizes at predetermined positions on the surfaces of a plurality of bases, each base having the elements having different functions mounted thereon;

the elements mounted on said plurality of bases including both the light emitting elements and the light receiving elements; and

the method further comprises the step of;

stacking said plurality of bases so that the light emitting elements respectively face the light receiving elements which receive light emitted from the corresponding light emitting elements.