Semiconductor integrated circuit and designing method thereof

US 6,600,181 B2
Filed: 06/19/2001
Issued: 07/29/2003
Est. Priority Date: 06/21/2000
Status: Expired due to Fees

First Claim

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1. A semiconductor integrated circuit having an inductance, comprising:

a semiconductor internal circuit having a first power supply line and a second power supply line;

first and second terminals for a first power supply fed to said semiconductor internal circuit and third and fourth terminals for a second power supply;

a first inductor connected between said first power supply line of said internal circuit and said first terminal and having a predetermined inductance;

a second inductor connected between said first power supply line of said internal circuit and said second terminal and having an inductance substantially equal to said predetermined inductance of said first inductor;

a third inductor connected between said second power supply line of said internal circuit and said third terminal and having an inductance smaller than said predetermined inductance; and

a fourth inductor connected between said second power supply line of said internal circuit and said fourth terminal and having an inductance smaller than said predetermined inductance.

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Abstract

A semiconductor integrated circuit has a semiconductor internal circuit having a first power supply line and a second power supply line, wiring layers connected to a plurality of terminals of a first power supply and each having a predetermined inductance, and wiring layers connected to a plurality of terminals of a second power supply and each having a smaller inductance. Each of the former wiring layers has an inductor making a loop around the internal circuit.

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9 Claims

1. A semiconductor integrated circuit having an inductance, comprising:
- a semiconductor internal circuit having a first power supply line and a second power supply line;
  
  first and second terminals for a first power supply fed to said semiconductor internal circuit and third and fourth terminals for a second power supply;
  
  a first inductor connected between said first power supply line of said internal circuit and said first terminal and having a predetermined inductance;
  
  a second inductor connected between said first power supply line of said internal circuit and said second terminal and having an inductance substantially equal to said predetermined inductance of said first inductor;
  
  a third inductor connected between said second power supply line of said internal circuit and said third terminal and having an inductance smaller than said predetermined inductance; and
  
  a fourth inductor connected between said second power supply line of said internal circuit and said fourth terminal and having an inductance smaller than said predetermined inductance.
- View Dependent Claims (2, 3, 4, 5, 6)
- - 2. A semiconductor integrated circuit according to claim 1, wherein said first inductor makes a loop around said internal circuit by at least ¾
    - turns and said second inductor makes a loop around said internal circuit by at least ¾
      
      turns in the same direction as the looping direction of said first inductor.
  - 3. A semiconductor integrated circuit according to claim 1, wherein each of said first and second inductors takes a U-shape form around said internal circuit.
  - 4. A semiconductor integrated circuit according to claim 3, wherein said first and second inductors have portions, respectively, that are adjacent and parallel with each other around said internal circuit.
  - 5. A semiconductor integrated circuit according to claim 1, wherein each of said first and second inductors has a conductor connected thereto by way of a plurality of through-holes passing through an insulating layer to overlap each of said first and second inductors.
  - 6. A semiconductor integrated circuit according to claim 1, wherein when the source resistance existing between said first and second power supply lines is Rchip, the source capacitance is Cchip, the voltage of an external power supply connected to said first terminal is VCCO and the source voltage applied to a semiconductor chip is Vchip and then when the sum of currents flowing in the semiconductor chip is Imac, the time average of Imac is Imac(ω
    - =0), the maximum permissible value of source current noise level In at frequency ω
      
      is Imax(ω
      
      ) and the permissible value of drop level of voltage V of the internal circuit is Δ
      
      V, the inductance of said inductor and the capacitance of the source capacitor are so selected as to satisfy the following two inequalities;
      
      $\frac{\sqrt{{(\frac{Imac (ω)}{Imax (ω)} \cdot \frac{VCC0}{Vchip0})}^{2} ({(ω CchipRchip)}^{2} + 1) - {(ω CchipRchip)}^{2}} + 1}{ω^{2} Cchip} - Lboard \leq Lchip$ $LchipImac (ω = 0) \cdot \frac{VCC0}{Vchip0} \sqrt{\frac{Lboard + Lchip}{Cchip}} \cdot \exp (- \frac{G}{\sqrt{4 - G^{2}}} a \tan (\frac{(1 - G^{2}) \sqrt{4 - G^{2}}}{2 G})) (\frac{2}{\sqrt{4 - 5 G^{2} + 6 G^{4} - G^{6}}}) \leq Δ V$

7. A semiconductor integrated circuit comprising:
- a plurality of first power supply pads;
  
  a plurality of second power supply pads;
  
  a first power supply line for supplying a first power supply voltage applied to said plurality of first power supply pads to an internal circuit;
  
  a second power supply line for supplying a second power supply voltage applied to said plurality of second power supply pads to said internal circuit; and
  
  a plurality of inductors each connected between each of said plurality of first power supply pads and said first power supply line and each arranged to make a loop around said internal circuit so that said plurality of inductors have mutually substantially equal impedances reaching nodes at which said internal circuit connects to said first power supply line;
  
  wherein wiring conductors constituting said plurality of inductors are each formed to make a loop around a semiconductor chip and are connected between corresponding power supply pads and said first power supply line such that currents flow through said individual wiring conductors in the same direction; and
  
  wherein the wiring conductor constituting each of said inductors is formed to make a loop by ¾
  
  or more turns around an area in which said internal circuit of the semiconductor chip is formed.

8. A semiconductor integrated circuit comprising:
- a plurality of first power supply pads;
  
  a plurality of second power supply pads;
  
  a first power supply line for supplying a first power supply voltage applied to said plurality of first power supply pads to an internal circuit;
  
  a second power supply line for supplying a second power supply voltage applied to said plurality of second power supply pads to said internal circuit; and
  
  a plurality of inductors each connected between each of said plurality of first power supply pads and said first power supply line and each arranged to make a loop around said internal circuit so that said plurality of inductors may have mutually substantially equal impedances reaching nodes at which said internal circuit connects to said first power supply line;
  
  wherein a wiring layer constituting said first power supply line serves as one electrode of a capacitor and a conductive layer serving as the other electrode of the capacitor is formed to oppose the one electrode through an insulating film;
  
  wherein said insulating film between the one electrode and the other electrode is provided with a conductive layer formed separately from the conductive layers constituting these electrodes to decrease the distance between the one electrode and the other electrode; and
  
  wherein said insulating film between the one electrode and the other electrode is provided with a conductive layer formed separately from the conductive layers constituting these electrodes and having irregularities to decrease the distance between the one electrode and the other electrode and increase a substantial opposing area.
- View Dependent Claims (9)
- - 9. A semiconductor integrated circuit according to claim 8, wherein when the source resistance existing between said first and second power supply lines is Rchip, the source capacitance is Cchip, the voltage of an external power supply connected to said plurality of first power supply pads is VCC0 and the source voltage applied to the semiconductor chip is Vchip, and when the sum of currents flowing in the semiconductor chip is Imac, the time average of Imac is Imac(ω
    - =0), the maximum permissible value of source current noise level In at frequency ω
      
      is Imax(ω
      
      ) and the permissible value of drop level of voltage V of the internal circuit is Δ
      
      V, the inductance of each of said inductors and the capacitance of said source capacitance are so selected as to satisfy the following two inequalities;
      
      $\frac{\sqrt{{(\frac{Imac (ω)}{Imax (ω)} \cdot \frac{VCC0}{Vchip0})}^{2} ({(ω CchipRchip)}^{2} + 1) - {(ω CchipRchip)}^{2}} + 1}{ω^{2} Cchip} - Lboard \leq Lchip$ $LchipImac (ω = 0) \cdot \frac{VCC0}{Vchip0} \sqrt{\frac{Lboard + Lchip}{Cchip}} \cdot \exp (- \frac{G}{\sqrt{4 - G^{2}}} a \tan (\frac{(1 - G^{2}) \sqrt{4 - G^{2}}}{2 G})) (\frac{2}{\sqrt{4 - 5 G^{2} + 6 G^{4} - G^{6}}}) \leq Δ V$

Specification

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Current Assignee
Renesas Technology Corporation (Renesas Electronics Corporation)
Original Assignee
Hitachi, Ltd.
Inventors
Yokomizo, Goichi, Otake, Shigenori, Kamohara, Shiro
Primary Examiner(s)
Nelms, David
Assistant Examiner(s)
Nhu, David

Application Number

US09/883,318
Publication Number

US 20020011606A1
Time in Patent Office

770 Days
Field of Search

257/277, 257/312, 257/531, 257/532, 257/777, 257/778
US Class Current

257/277
CPC Class Codes

H01L 23/3114   the device being a chip sca...

H01L 23/5227   Inductive arrangements or e...

H01L 23/5286   Arrangements of power or gr...

H01L 23/66   High-frequency adaptations

H01L 28/10   Inductors

H01L 2924/00   Indexing scheme for arrange...

H01L 2924/0002   Not covered by any one of g...

H01L 2924/19041   being a capacitor

H01L 2924/3011   Impedance

Semiconductor integrated circuit and designing method thereof

First Claim

2 Assignments

0 Petitions

Accused Products

Abstract

15 Citations

9 Claims

Specification

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Semiconductor integrated circuit and designing method thereof

First Claim

2 Assignments

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0 Petitions

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Accused Products

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Abstract

15 Citations

9 Claims

Specification

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Solutions

Use Cases

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