Systems with high density packing of micromachines

• US 6,600,201 B2
• Filed: 08/03/2001
• Issued: 07/29/2003
• Est. Priority Date: 08/03/2001
• Status: Expired due to Fees

• Current Assignee: Nobex Corporation (Biocon Incorporated), Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Walmsley, Robert G., Hartwell, Peter G.
• Primary Examiner(s): Ho, Hoai
• Assistant Examiner(s): TRAN, MAI HUONG C
• Application Number:
  US09/923,000
• Publication Number:
  US 20030025168A1
• Time in Patent Office: 725 Days
• Field of Search: 438/52, 438/54, 257/415, 257/417, 257/499, 257/622
• US Class Current: 257/415
• CPC Class Codes: B81B 2201/038 Microengines and actuators not provided for in B81B2201/031 - B81B2201/037
• CPC Class Codes: B81B 7/04 Networks or arrays of similar microstructural devices

Abstract

Micromachine systems are provided. An embodiment of such a micromachine system includes a substrate that defines a trench. First and second microelectromechanical devices are arranged at least partially within the trench. Each of the microelectromechanical devices incorporates a first portion that is configured to move relative to the substrate. Methods also are provided.

Claims

1. A micromachine system comprising:

a substrate defining a trench;

a first microelectromechanical device arranged at least partially within said trench, said first microelectromechanical device including a first portion, said first portion being configured to move relative to said substrate; and

a second microelectromechanical device arranged at least partially within said trench and adjacent to said first microelectromechanical device, said second microelectromechanical device including a first portion, said first portion being configured to move relative to said substrate.

2. The micromachine system of claim 1, further comprising:

a first anchor fixed in position relative to said substrate, said first anchor being configured to maintain said first portion of said first microelectromechanical device at least partially within said trench; and

a second anchor fixed in position relative to said substrate, said second anchor being configured to maintain said first portion of said second microelectromechanical device at least partially within said trench.

3. The micromachine system of claim 1, further comprising:

means for maintaining said first portion of said first microelectromechanical device at least partially within said trench; and

means for maintaining said first portion of said second microelectromechanical device at least partially within said trench.

4. The micromachine system of claim 1, wherein said first portion of said first microelectromechanical device and said first portion of said second microelectromechanical device are configured to move independently of each other.

5. The micromachine system of claim 1, further comprising:

a separator disposed at least partially between said first microelectromechanical device and said second microelectromechanical device, said separator being adapted to prevent said first microelectromechanical device from contacting said second microelectromechanical device.

6. The micromachine system of claim 1, further comprising:

means for preventing said first microelectromechanical device from contacting said second microelectromechanical device.

7. The micromachine system of claim 2, wherein:

said first microelectromechanical device includes a first flexure, said first flexure having a first end affixed to said first anchor, said first flexure being affixed to said first portion of said first microelectromechanical device, said first flexure being adapted to deform such that said first portion of said first microelectromechanical device is capable of moving relative to said substrate; and

said second microelectromechanical device includes a first flexure, said first flexure of said second microelectromechanical device having a first end affixed to said second anchor, said first flexure of said second microelectromechanical device being affixed to said first portion of said second microelectromechanical device, said first flexure of said second microelectromechanical device being adapted to deform such that said first portion of said second microelectromechanical device is capable of moving relative to said substrate.

8. The micromachine system of claim 5, wherein said separator is a micro-fabricated beam.

9. The micromachine system of claim 7, wherein said first microelectromechanical device includes a second flexure, said second flexure having a first end affixed to said second anchor, said second flexure being affixed to said first portion of said first microelectromechanical device;

and

wherein said second microelectromechanical device includes a second flexure, said second flexure of said second microelectromechanical device having a first end affixed to said first anchor, said second flexure of said second microelectromechanical device being affixed to said first portion of said second microelectromechanical device.

10. The micromachine system of claim 7, further comprising:

a third microelectromechanical device arranged at least partially within said trench, said third microelectromechanical device including a first portion and a first flexure, said first portion of said third microelectromechanical device being configured to move relative to said substrate, said first flexure of said third microelectromechanical device having a first end affixed to said first anchor, said first flexure of said third microelectromechanical device being affixed to said first portion of said third microelectromechanical device, said first flexure of said third microelectromechanical device being adapted to deform such that said first portion of said third microelectromechanical device is capable of moving relative to said substrate.

11. The micromachine system of claim 8, further comprising:

a separator disposed at least partially between said first microelectromechanical device and said second microelectromechanical device, said separator being adapted to prevent said first microelectromechanical device from contacting said second microelectromechanical device, said separator being adapted to deform in response to contact by said first portion of said first microelectromechanical device and said first portion of said second microelectromechanical device.

12. The micromachine system of claim 8, wherein said first flexure of said first microelectromechanical device and said first flexure of said second microelectromechanical device are micro-fabricated beams.

13. The micromachine system of claim 10, further comprising:

a fourth microelectromechanical device arranged at least partially within said trench, said fourth microelectromechanical device including a first portion and a first flexure, said first portion of said fourth microelectromechanical device being configured to move relative to said substrate, said first flexure of said fourth microelectromechanical device having a first end affixed to said first anchor, said first flexure of said fourth microelectromechanical device being affixed to said first portion of said fourth microelectromechanical device, said first flexure of said fourth microelectromechanical device being adapted to deform such that said first portion of said fourth microelectromechanical device is capable of moving relative to said substrate.