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Active interposer technology for high performance CMOS packaging application

  • US 6,600,364 B1
  • Filed: 01/05/1999
  • Issued: 07/29/2003
  • Est. Priority Date: 01/05/1999
  • Status: Expired due to Term
First Claim
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1. An integrated circuit assembly, comprising:

  • an integrated circuit including a logic circuit and a memory circuit; and

    , an interposer that is connected to said integrated circuit mounted thereon, said interposer including (1) a power plane, a ground plane, and a dielectric material placed between said power plane and said ground plane to form a filtering capacitor, (2) a clock circuit to generate a clock signal that is transmitted to said memory circuit, and (3) a driver circuit to regenerate an output signal generated by the logic circuit.

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