Liquid crystal display device and method of manufacturing same
First Claim
1. An LCD (liquid crystal display) having a pad portion for contact with a drive integrated circuit, the LCD comprising:
- a substrate;
electrode pads on the substrate;
transparent electrodes on the electrode pads; and
semiconductor layer patterns disposed between the substrate and the transparent electrodes, and in contact with the transparent electrodes, wherein one of the transparent electrodes that is in contact with one of the semiconductor layer patterns covers entirely said one of the semiconductor layer patterns, and an upper surface of said one of the semiconductor layer patterns contacts said one of the transparent electrodes.
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Accused Products
Abstract
A liquid crystal display (LCD) device has improved adhesion between a tape carrier package and a liquid crystal panel and the LCD device includes an organic insulating layer for increasing the aperture ratio. The LCD includes electrode pads provided on a substrate, semiconductor patterns for preventing etching of the portions of the gate insulating layer that are in contact with the electrode pads, and transparent electrodes for protecting the electrode pads and in contact with the semiconductor patterns. The LCD eliminates the organic protective layer positioned around the pads, thereby strengthening the adhesion between the liquid crystal panel and the TCP.
16 Citations
36 Claims
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1. An LCD (liquid crystal display) having a pad portion for contact with a drive integrated circuit, the LCD comprising:
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a substrate;
electrode pads on the substrate;
transparent electrodes on the electrode pads; and
semiconductor layer patterns disposed between the substrate and the transparent electrodes, and in contact with the transparent electrodes, wherein one of the transparent electrodes that is in contact with one of the semiconductor layer patterns covers entirely said one of the semiconductor layer patterns, and an upper surface of said one of the semiconductor layer patterns contacts said one of the transparent electrodes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. An LCD (liquid crystal display) With a pad portion for contact with a drive integrated circuit, the LCD comprising:
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a substrate;
a pad area on the substrate and including a plurality of electrode pads on the substrate;
a plurality of transparent electrodes on the electrode pads; and
semiconductor layer patterns disposed at the pad area at least partially underneath the electrode pads and in contact with the transparent electrodes, wherein one of the transparent electrodes that is in contact with one of the semiconductor layer patterns covers entirely said one of the semiconductor layer patterns, and an upper surface of said one of the semiconductor layer patterns contacts said one of the transparent electrodes. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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18. An LCD (liquid crystal display) having a pad portion for contact with a drive integrated circuit, the LCD comprising:
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a glass substrate;
a gate insulating layer on the glass substrate;
electrode pads on the glass substrate;
transparent electrodes on the electrode pads and arranged to protect the electrode pads; and
semiconductor layer patterns on the gate insulating layer and arranged to prevent etching of a gate insulating layer that is in contact with the electrode pads, wherein the semiconductor layer patterns are in contact with the transparent electrodes, and one of the transparent electrodes that is in contact with one of the semiconductor layer patterns covers entirely said one of the semiconductor layer patterns and an upper surface of said one of the semiconductor layer patterns. contacts said one of the transparent electrodes. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26)
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27. A method for manufacturing an LCD (liquid crystal display) having a pad portion for contact with a drive integrated circuit, the method comprising the steps of:
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providing a glass substrate;
forming gate pads on the glass substrate;
overlaying a gate insulating layer on the entire surface of the glass substrate and forming holes exposing the gate pads by patterning the gate insulating layer;
forming data pads on the gate insulating layer;
disposing semiconductor layer patterns on the gate insulating layer to provide first ones of the semiconductor layer patterns at least partially beneath the data pads and to provide second ones of the semiconductor layer patterns at least partially overlapped with the gate pads; and
forming transparent electrodes on the data and gate pads for protecting the data and gate pads, wherein one of the transparent electrodes is in contact with and covers entirely one of the semiconductor layer patterns. - View Dependent Claims (28, 29, 30, 31)
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32. A method of forming pad portions in a display device for contact with a drive integrated circuit of the display device, the method comprising the steps of:
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forming a gate pad portion on a substrate at a peripheral portion of a display panel part of the display device; and
forming a data pad portion on the substrate at the peripheral portion of the display panel part, wherein the step of forming the gate pad portion includes the steps of, forming a gate pad on the substrate, forming sequentially a first gate insulating layer and a first semiconductor layer pattern on the substrate and over portions of the gate pad so as to define a contact hole therethrough, and covering entirely the first semiconductor layer pattern, the first gate insulating layer and the contact hole with a first transparent electrode layer so that the first transparent electrode layer contacts the first semiconductor layer pattern. - View Dependent Claims (33, 34, 35, 36)
forming a second gate insulating layer on the substrate, forming a second semiconductor layer pattern on the second gate insulating layer, forming a data pad on the second gate insulating layer and over portions of the second semiconductor layer pattern, and covering entirely the second semiconductor layer pattern and the data pad with a second transparent electrode layer.
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34. The method of claim 33, wherein the first semiconductor layer pattern is in a substantially ring-shaped configuration and the second semiconductor layer pattern includes a substantially ring-shaped portion.
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35. The method of claim 34, wherein the second transparent electrode layer is in contact with the second semiconductor layer pattern.
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36. The method according to claim 32, wherein the step performing the gate pad portion further includes the steps of:
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forming another gate pad on the substrate;
forming another gate insulating layer and another semiconductor layer pattern over portions of said another gate pad so as to define another contact hole therethrough; and
covering entirely said another semiconductor layer pattern, said another gate insulating layer and said another contact hole with another transparent electrode layer so that said another transparent electrode layer contacts said another semiconductor layer pattern, wherein said semiconductor layer patterns and said gate insulating layers are absent from an area between said first transparent electrode and said another transparent electrode.
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Specification