Circuit and method for controlling power and performance based on operating environment

• US 6,601,179 B1
• Filed: 05/07/1999
• Issued: 07/29/2003
• Est. Priority Date: 05/02/1997
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Jackson, Robert T., Nachtsheim, Stephen P., Ma, Taufik T.
• Primary Examiner(s): Jean, Frantz B
• Application Number:
  US09/307,324
• Time in Patent Office: 1,544 Days
• Field of Search: 713/300, 713/310, 713/320, 713/322, 713/324, 713/340, 713/500, 713/501, 375/347, 709/222, 327/142, 340/870.19, 380/4, 361/686, 710/300, 710/302, 710/303, 710/304, 710/301
• US Class Current: 713/322
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: G06F 1/26 Power supply means, e.g. regulation thereof for memories G11C
• CPC Class Codes: G06F 1/3203 Power management, i.e. event-based initiation of a power-saving mode
• CPC Class Codes: G06F 1/324 by lowering clock frequency
• CPC Class Codes: G06F 1/3296 by lowering the supply or operating voltage
• CPC Class Codes: H02J 7/0063 with circuits adapted for supplying loads from the battery
• CPC Class Codes: Y02D 10/00 Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

A power control circuit and corresponding technique for controlling the reduction or augmentation of operating frequency and/or supply voltage utilized by an electronic device. Such control is based on the operating environment of the hardware product employing the electronic device by determining whether the hardware product is interconnected to an external source having at least one enhanced cooling mechanism. As a result, the hardware product is able to operate at full frequency and voltage during certain situations and to operate at a reduced frequency and/or voltage during other situations.

Claims

1. A method comprising:

determining whether a hardware product is coupled to a power supply brick by a flexible thermal-electrical cable, the power supply brick including circuitry that converts alternating current (AC) power into direct current (DC) power and an enhanced cooling mechanism; and

adjusting at least an operating frequency of an electronic device implemented within the hardware product from a first operating frequency to a second operating frequency in response to determining that the hardware product Is coupled to the power supply brick having the enhanced cooling mechanism, the second operating frequency corresponding to a power state from one of at least three power states for the electronic device.

2. The method of claim 1, wherein the act of adjusting includes increasing the operating frequency to the second operating frequency, being higher than the first operating frequency, in response to determining that the hardware product is coupled to the power supply brick having the enhanced cooling mechanism.

3. The method of claim 2, wherein the act of adjusting further includes adjusting a supply voltage of the electronic device from a first voltage level to a second voltage level prior to increasing the operating frequency to the second operating frequency.

4. The method of claim 3, wherein the first voltage level is equivalent to the second voltage level, provided the first voltage level and the second voltage level are capable of operating in connection with the second operating frequency.

5. The method of claim 1, wherein the operating frequency is decreased through throttling a clocking signal, normally used to produce the first operating frequency, to produce the second operating frequency.

6. The method of claim 1, wherein the act of adjusting includes decreasing the operating frequency to the second operating frequency, being less than the first operating frequency, in response to determining that the hardware product is decoupled from the enhanced cooling mechanism.

7. The method of claim 6, wherein the act of adjusting further includes adjusting a supply voltage of the electronic device from a first voltage level to a second voltage level after decreasing the operating frequency to the second operating frequency.

8. The method of claim 7, wherein the second voltage level is less than the first voltage level in order to optimize power reduction.

9. The method of claim 1, wherein the hardware product is a portable computer.

10. The method of claim 9, wherein the enhanced cooling mechanism includes a heat transfer element to engage with a heat transfer element located in the hardware product.

11. The method of claim 1, wherein the hardware product is a camcorder.

12. The method of claim 1, wherein the enhanced cooling mechanism is an air cooling duct system including a fan and a first heat exchange duct to be connected to a second heat exchange duct of the hardware product.

13. The method of claim 12, wherein the heat exchange duct of the hardware product is coupled to a heat transfer element that conveys heat from the electronic device to air in the second heat exchange duct.

14. The method of claim 12, wherein the fan of the air cooling duct system causes increased airflow through the first and second heat exchange ducts.

15. The method of claim 1, wherein the enhanced cooling mechanism is a heat sink, a fan situated proximate to the heat sink to cool the heat sink, and a flexible heat pipe having a first end coupled to the heat sink and a second end for coupling to a heat pipe in the hardware product that conveys heat away from the electronic device.

16. The method of claim 1, wherein determining whether a hardware product is coupled to an enhanced cooling mechanism by comparing a predetermined interlock mechanism value with a status of bus ratio and status of supply voltage in the hardware product.

20. The method of claim 7, wherein the determining includes checking whether the hardware product is currently powered by one or more batteries.

17. A method comprising:

determining whether a hardware product is coupled to a power supply brick by a flexible thermal-electrical cable, the power supply brick including circuitry that converts alternating current (AC) power into direct current (DC) power and an enhanced cooling mechanism; and

adjusting a power state of an electronic device implemented within the hardware product from a first power state to a second power state in response to determining that the hardware product is coupled to the power supply brick having the enhanced cooling mechanism, the second power state being one of at least three power states for the electronic device.

18. The method of claim 17, wherein the adjusting to the second power state includes applying a voltage to the electronic device at a voltage -level greater than a voltage level associated with the first power state.

19. The method of claim 17, wherein the adjusting to the second power state further includes increasing a clocking signal from a first operating frequency at the first power state to a second operating frequency at the second power state being greater than the first operating frequency of the first power state.

21. The method of claim 17, wherein the adjusting to the second power state includes applying a voltage to the electronic device at a voltage level less than or equal to a voltage level associated with the first power state.

22. The method of claim 17, wherein the enhanced cooling mechanism is a heat sink, a fan situated proximate to the heat sink to cool the heat sink, and a flexible heat pipe having a first end coupled to the heat sink and a second end for coupling to a heat pipe in the hardware product that conveys heat away from the electronic device.

23. The method of claim 17, wherein determining whether a hardware product is coupled to an enhanced cooling mechanism by comparing a predetermined interlock mechanism value with a status of bus ratio and status of supply voltage in the hardware product.

24. A circuit adapted to alter performance of an electronic device implemented within a hardware product, the circuit comprising:

a control circuit to adjust a power state; and

a power state transition circuit coupled to the control circuit, the power state transition circuit to detect a change in an operating environment of the hardware product in response to the hardware product being coupled to a power brick by a flexible thermal-electrical cable, the power brick including circuitry that converts alternating current (AC) power into direct current (DC) power and an enhanced cooling mechanism.

25. The circuit of claim 24, wherein the hardware product is a portable computer.

26. The circuit of claim 25, wherein the enhanced cooling mechanism includes a heat transfer element to engage with a heat transfer element located in the hardware product.

27. The circuit of claim 24, wherein the hardware product is a camcorder.

28. The circuit of claim 24, wherein the enhanced cooling mechanism is an air cooling duct system including a fan and a first heat exchange duct to be connected to a second heat exchange duct of the hardware product.

29. The circuit of claim 28, wherein the heat exchange duct of the hardware product is coupled to a heat transfer element that conveys heat from the electronic device to air in the second heat exchange duct.

30. The circuit of claim 28, wherein the fan of the air cooling duct system causes increased airflow through the first and second heat exchange ducts.

31. The circuit of claim 28, wherein the enhanced cooling mechanism is a heat sink, a fan situated proximate to the heat sink to cool the heat sink, and a flexible heat pipe having a first end coupled to the heat sink and a second end for coupling to a heat pipe in the hardware product that conveys heat away from the electronic device.

32. The method of claim 24, wherein detecting a change in an operating environment of the hardware product by comparing a predetermined interlock mechanism value with a status of bus ratio and status of supply voltage in the hardware product.

33. A computer comprising:

a processor implemented in a hardware product; and

a control circuit coupled to the processor, the control circuit to adjust a power state of the processor in response to detecting that the hardware product is coupled to a removable enhanced cooling a mechanism by a flexible thermal-electrical cable, the control circuit comparing a predetermined interlock mechanism value with a status of bus ratio and status of supply voltage in the hardware product to adjust the power state to one of at least three power states for the processor.

34. The computer of claim 33, wherein the detecting includes the processor being supplied with a voltage by a power supply brick..

35. A hardware product comprising:

an electronic device configured to operate in one of at least two power states;

a receptacle on an exterior surface of a casing that encloses the electronic device, the receptacle including a plurality of electrical connectors and a thermal connector;

a power supply brick including circuitry that converts alternating current (AC) power into direct current (DC) power and an enhanced cooling mechanism;

a thermal-electrical cable that flexibly couples the power supply brick and the receptacle, the thermal-electrical cable including a plurality of electrical conductors and a flexible thermal conductor; and

,

a power state transition circuit coupled to the electronic device to select one of the at least two power states responsive to coupling of the power supply brick to the receptacle.

36. The hardware product of claim 35, wherein the power state transition circuit detects a change in an operating environment of the hardware product by comparing a predetermined interlock mechanism value with a status of bus ratio and status of supply voltage in the hardware product.

37. The hardware product of claim 35, wherein the power state transition circuit detects the electronic device being powered by one or more batteries.

38. The hardware product of claim 35, wherein the power state transition circuit detects the electronic device being supplied with a voltage by the power supply brick.

39. The hardware product of claim 35, wherein the enhanced cooling mechanism further comprises a fan.

40. The hardware product of claim 39, wherein the flexible thermal conductor is a heat pipe.

41. The hardware product of claim 35, wherein the enhanced cooling mechanism further comprises an active heat dissipation mechanism.