Method for the connection and repair of flex and other circuits

• US 6,601,292 B2
• Filed: 06/26/2001
• Issued: 08/05/2003
• Est. Priority Date: 09/01/1999
• Status: Expired due to Fees

• Current Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Original Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Inventors: Trublowski, John, Baker, Jay DeAvis, Li, Delin, Achari, Achyuta, Nation, Brenda Joyce
• Primary Examiner(s): Vo, Peter
• Assistant Examiner(s): Nguyen, Donghai D.
• Application Number:
  US09/891,697
• Publication Number:
  US 20010035301A1
• Time in Patent Office: 770 Days
• Field of Search: 294/020.1, 294/020.3, 294/020.8, 294/020.9, 295/921, 298/29, 298/30, 298/31, 298/32, 294/12, 294/17, 298/52, 298/54, 174/254, 174/250, 174/261, 174/262, 174/117.F, 174/117.FF, 361/749, 361/750, 361/751, 361/777, 361/778, 361/789, 361/803, 439/493, 439/67, 439/150, 439/60, 439/724.1
• US Class Current: 29/829
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 2201/053 Tails
• CPC Class Codes: H05K 2201/09127 PCB or component having an integral separable or breakable part
• CPC Class Codes: H05K 2201/09409 Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
• CPC Class Codes: H05K 2201/09709 Staggered pads, lands or terminals; Parallel conductors in different planes
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 2203/175 Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/225 Correcting or repairing of printed circuits H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/4973 Replacing of defective part
• CPC Class Codes: Y10T 29/49732 by attaching repair preform, e.g., remaking, restoring, or patching

Abstract

A method for making and repairing connections between first and second circuits, such as flex circuits. An article 10 includes: a flexible dielectric substrate 12 having first and second edges 14/16, and a plurality of conductive circuit traces 18 arranged on or within the substrate, wherein each of the traces extends from proximate the first edge 14 to proximate the second edge 16. Each of the circuit traces 18 includes: a first connection feature 20 disposed proximate the first edge 14; a second connection feature 22 disposed proximate the second edge 16; and at least one third connection feature 24 disposed between the first and second edges 14/16. Each of the first, second, and third connection features 20/22/24 is a plated through hole, a plated blind via, or a mounting pad. This article 10 may be used to connect together the first and second circuits 50/60 using the first and second connection features 20/22, such as by soldering. If either of the two circuits needs to be subsequently detached (e.g., because of a component failure), the article 10 may be cut so as to present a set of third connection features 24 to which a new replacement circuit may be connected.

Claims

1. A method for the repair of electrical circuits, comprising the steps of:

(a) providing an electrical assembly which includes;

(i) first and second electrical circuits having respective first and second edges thereof, wherein each electrical circuit has a plurality of circuit traces thereon or therewithin terminating proximate the respective first or second edge;

(ii) an interconnecting member comprising a flexible dielectric substrate having third and fourth edges and a plurality of circuit traces arranged on or within the substrate, wherein each trace extends from proximate the third edge to proximate the fourth edge, wherein each circuit trace includes first and second connection features thereof disposed proximate the third and fourth edges, respectively, and at least one third connection features thereof disposed between the third and fourth edges, wherein each of the connection features is a plated through hole, a plated blind via, or a mounting pad;

(iii) wherein the first and second electrical circuits are arranged with the first and second edges thereof overlapping the third and fourth edges of the interconnecting member, respectively, with the circuit traces of the first and second electrical circuits being mechanically and electrically connected to corresponding circuit traces of the interconnecting member at the first and second connection features, respectively;

(b) cutting the interconnecting member thereacross between the first connection features and the third connection features, thereby severing the first electrical circuit from the interconnecting member and thereby presenting a fifth edge of the interconnecting member proximate the third connection features;

(c) providing a third electrical circuit similar to the first electrical circuit and a second interconnecting member comprising a flexible dielectric substrate having seventh and eighth edges and a plurality of circuit traces arranged on or within the substrate, wherein each trace extends from proximate the seventh edge to proximate the eighth edge, wherein each circuit trace includes fourth and fifth connection features thereof disposed proximate the seventh and eighth edges, respectively, and at least one sixth connection features thereof disposed between the seventh and eighth edges, wherein each of the connection features is a plated through hole, a plated blind via, or a mounting pad;

(d) arranging the second interconnecting member and the third electrical circuit such that a sixth edge of the third electrical circuit contactedly overlaps the seventh edge of the second interconnecting member and the eighth edge contactedly overlaps the fifth edge of the interconnecting member; and

(e) mechanically and electrically connecting circuit traces of the third electrical circuit with corresponding circuit traces on the second interconnecting member at the fourth connection features, and the circuit traces of the second interconnecting member with corresponding circuit traces on the interconnecting member at the third and fifth connection features.

2. A method according to claim 1 wherein said first, second and third connection features of the interconnecting member and said fourth, fifth, and sixth connection features of the second interconnection member are generally evenly distributed along the circuit traces of the interconnecting member and the second connecting member.

3. A method according to claim 1, wherein each of the first, second, third, fourth, fifth and sixth connection features is aligned, with respect to all corresponding other of the first, second, third, fourth, fifth and sixth connection features, along a generally straight line running transverse to the length of the circuit traces.

4. A method according to claim 1, wherein each of the first, second, third, fourth, fifth and sixth connection features is aligned, with respect to all corresponding other of the first, second, third, fourth, fifth and sixth connection features, along a generally zigzagged line running transverse to the length of the circuit traces.

5. A method according to claim 1, wherein the substrate of the interconnecting member and the second interconnecting member is made of polyester, polyimide, or polyetherimide, and the circuit traces of the interconnecting member and the second interconnecting member are made of copper, carbon, aluminum, solder, or conductive ink.

6. A method according to claim 1, further comprising the steps

(f) cutting the second interconnecting member thereacross between the fifth connection features and the sixth connection features, thereby severing the second electrical circuit from the second interconnecting member and thereby presenting a ninth edge of the second interconnecting member proximate the third connection features;

(g) providing a fourth electrical circuit similar to the second electrical circuit and a third interconnecting member comprising a flexible dielectric substrate having eleventh and twelfth edges and a plurality of circuit traces arranged on or within the substrate, wherein each trace extends from proximate the eleventh edge to proximate the twelfth edge, wherein each circuit trace includes seventh and eighth connection features thereof disposed proximate the eleventh and twelfth edges, respectively, and at least one ninth connection features thereof disposed between the eleventh and twelfth edges, wherein each of the connection features is a plated through hole, a plated blind via, or a mounting pad;

(h) arranging the third interconnecting member and the fourth electrical circuit such that a tenth edge of the fourth electrical circuit contactedly overlaps the twelfth edge of the third interconnecting member and the eleventh edge contactedly overlaps the ninth edge of the second interconnecting member; and

(i) mechanically and electrically connecting circuit traces of the fourth electrical circuit with corresponding circuit traces on the third interconnecting member at the eighth connection features, and the circuit traces of the third interconnecting member with corresponding circuit traces on the second interconnecting member at the sixth and seventh connection features.

7. A method according to claim 1, wherein each of the third connection features are exposed on at least one surface of the interconnecting member, and wherein a piece of flexible tape is positioned over the third connection features, further comprising the step of:

removing the flexible tape prior to the step of arranging the second interconnecting member and the third electrical circuit.

8. A method for the repair of electrical circuits, comprising the steps of:

(a) providing an electrical assembly which includes;

(i) first and second electrical circuits having respective first and second edges thereof, wherein each electrical circuit has a plurality of circuit traces thereon or therewithin terminating proximate the respective first or second edge;

(ii) an interconnecting member comprising a flexible dielectric substrate having third and fourth edges and a plurality of circuit traces arranged on or within the substrate, wherein each trace extends from proximate the third edge to proximate the fourth edge, wherein each circuit trace includes first and second connection features thereof disposed proximate the third and fourth edges, respectively, and third and fourth connection features thereof disposed between the third and fourth edges, wherein each of the connection features is a plated through hole, a plated blind via, or a mounting pad;

(iii) wherein the first and second electrical circuits are arranged with the first and second edges thereof overlapping the third and fourth edges of the interconnecting member, respectively, with the circuit traces of the first and second electrical circuits being mechanically and electrically connected to corresponding circuit traces of the interconnecting member at the first and second connection features, respectively;

(b) cutting the interconnecting member there across between the first connection features and the third connection features, thereby severing the first electrical circuit from the interconnecting member and thereby presenting a fifth edge of the interconnecting member proximate the third connection features;

(c) arranging a third electrical circuit similar to the first electrical circuit such that a sixth edge contactedly overlaps the fifth edge of the interconnecting member;

(d) mechanically and electrically connecting circuit traces of the third electrical circuit with corresponding circuit traces on the interconnecting member at the third connection features;

(e) cutting the interconnecting member thereacross between the second connection features and the fourth connection features, thereby severing the second electrical circuit from the interconnecting member and thereby presenting a seventh edge of the interconnecting member proximate the fourth connection features;

(f) arranging a fourth electrical circuit similar to the second electrical circuit such that an eighth edge thereof contactedly overlaps the seventh edge of the interconnecting member; and

(g) mechanically and electrically connecting circuit traces of the fourth electrical circuit with corresponding circuit traces on the interconnecting member at the fourth connection features.

9. A method according to claim 8, wherein each of the third and fourth connection features are exposed on at least one surface of the interconnecting member, and wherein a first piece of flexible tape is positioned over the third connection features and a second piece of flexible tape is positioned over the fourth connection features, further comprising the step of:

removing the first piece of flexible tape prior to the step of arranging the third electrical circuit; and

removing the second piece of flexible tape prior to the step of arranging the fourth electrical circuit.