Method of making an electromagnetic interference shield device

• US 6,601,293 B1
• Filed: 04/18/2000
• Issued: 08/05/2003
• Est. Priority Date: 08/28/1998
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P.
• Primary Examiner(s): CHANG, RICK KILTAE
• Application Number:
  US09/551,416
• Time in Patent Office: 1,204 Days
• Field of Search: 298/32, 298/41, 298/46, 298/52, 438/209, 438/211, 438/212, 438/213, 438/214-224, 257/55, 257/701, 257/687, 257/691, 174/35.R, 174/255, 174/256, 174/257, 174/261, 174/262, 174/260, 174/52.4, 361/760-761, 361/764, 361/767, 361/772, 361/794, 361/784, 361/792
• US Class Current: 29/841
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10161 with a rectangular active surface
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49165 : by forming conductive walled aperture in base

Abstract

A method of packaging a device is disclosed. In one embodiment, a substrate including a common voltage plane and a mounting region is provided, with the device mounted to the mounting region. An electrically conductive dam structure is disposed on the surface of the substrate with the electrically conductive dam structure being electrically coupled to the common voltage plane and circumscribing a perimeter of the mounting region. An electrically insulating encapsulant at least partially fills a pocket defined by the substrate and the electrically conductive dam structure, the electrically insulating encapsulant contacting the electrically conductive dam structure. An electrically conductive encapsulant is provided that overlies the electrically insulating encapsulant, the electrically conductive encapsulant being coupled to the electrically conductive dam structure.

Claims

1. A method of packaging a device comprising:

providing a substrate including a common voltage plane and a mounting region, the device mounted to the mounting region;

providing an electrically conductive dam structure disposed on a surface of the substrate, the electrically conductive dam structure electrically coupled to the common voltage plane and circumscribing a perimeter of the mounting region;

providing an electrically insulating encapsulant at least partially filling a pocket defined by the substrate and the electrically conductive dam structure, the electrically insulating encapsulant contacting the electrically conductive dam structure; and

providing an electrically conductive encapsulant overlying the electrically insulating encapsulant, the electrically conductive encapsulant coupled to the electrically conductive dam structure;

curing the electrically conductive encapsulant, the electrically insulating encapsulant, and the electrically conductive dam structure;

floating a voltage on the common voltage plane.

2. The method of claim 1, wherein said providing the electrically conductive dam structure on the substrate comprises depositing an electrically conductive epoxy compound in a form of a dam structure on the substrate.

3. The method of claim 2, wherein said providing the electrically insulating encapsulant comprises depositing an insulating epoxy within the pocket defined by the device, the substrate and the electrically conductive dam structure.

4. The method of claim 1, wherein said providing the electrically insulating encapsulant includes constraining said electrically insulating encapsulant within said electrically conductive dam structure.

5. A method of making a package for a device, the method comprising:

providing a substrate having first and second opposed sides, with an electrically conductive plane disposed therebetween and an electrically conductive via extending from the first side to the electrically conductive plane;

mounting the device on the first side of the substrate and electrically connecting the device to the substrate;

applying an electrically conductive dam on the first side of the substrate so as to overlay the via, surround a portion of the first side of the substrate, and define a pocket, wherein the device is within the pocket; and

applying an electrically insulating encapsulant over the device and within the pocket;

applying an electrically conductive encapsulant onto the electrically insulating encapsulant, wherein the electrically conductive encapsulant is electrically connected to the electrically conductive dam.

6. The method of claim 5, wherein the electrically insulating encapsulant is applied so as to contact the electrically conductive dam.

7. The method of claim 6, wherein the substrate includes an electrically conductive path between the plane and the second side of the substrate, and further comprising mounting at least one solder ball on the second side of the substrate, wherein said solder ball is in electrical communication with the path.

8. The method of claim 5, wherein the electrically insulating encapsulant is applied so as to contact the electrically conductive dam.

9. The method of claim 8, wherein the device is mounted in a flip chip style.

10. The method of claim 8, further comprising electrically connecting at least one bond wire between the device and the substrate.