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Micromachined optical mechanical modulator based transmitter/receiver module

  • US 6,602,427 B1
  • Filed: 08/28/2000
  • Issued: 08/05/2003
  • Est. Priority Date: 08/28/2000
  • Status: Expired due to Fees
First Claim
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1. A method for manufacturing a micromachined Fabry-Perot cavity based optical mechanical modulator consisting of a top membrane and its supporting beams, a bottom membrane, a middle supporting frame, a middle air gap, and a conic hole for receiving an optical fiber, comprising the steps of:

  • forming a p-type silicon cone surrounded by a n-type diffusion silicon layer in a p-type single crystalline silicon substrate;

    depositing a bottom un-doped polysilicon layer on the surface of said p-type single crystalline silicon substrate and thereafter forming a plurality of small heavily doped regions in said bottom layer which partially cover said underlying p-type silicon cone;

    depositing a middle un-doped polysilicon layer on the surface of said bottom un-doped polysilicon layer, and then doping a portion of the middle un-doped polysilicon layer to create a large central heavily doped region partially covering said underlying small heavily doped regions and a plurality of small un-doped regions that are scattered therein and stand on the surface of said underlying un-doped polysilicon layer;

    depositing a top un-doped polysilicon layer on the surface of said middle un-doped polysilicon layer;

    creating a plurality of openings in said top un-doped polysilicon layer so as to partially expose said underlying heavily doped region of said middle un-doped polysilicon layer and define an un-released polysilicon membrane and its supporting polysilicon beams from said top un-doped polysilicon layer;

    performing anodization in HF solution to turn all said heavily doped polysilicon into porous polysilicon and the p-type silicon of said p-type silicon cone into porous single crystalline silicon;

    thinning said single crystalline silicon substrate from its back side to reveal said porous single crystalline silicon;

    bonding a rigid plate with a throughout hole onto the back side of said thinned single crystalline silicon substrate so as to align said throughout hole with said revealed porous single crystalline silicon;

    removing said porous polysilicon and said porous single crystalline silicon in diluted alkali solution for the partial release of said top polysilicon membrane and its supporting polysilicon beams, for the final release of a bottom polysilicon membrane, and for forming a conic hole in said single crystalline silicon substrate;

    depositing an anti-reflective layer on the back surface of said bottom polysilicon membrane and removing the un-doped polysilicon disposed on the top of said a plurality of small un-doped regions of said middle un-doped polysilicon layer and the un-doped polysilicon disposed in said a plurality of small un-doped regions of said middle un-doped polysilicon layer by dry etching for the final release of said polysilicon membrane and its supporting polysilicon beams.

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