Bonding electrochemical cell components

• US 6,602,631 B1
• Filed: 01/26/1999
• Issued: 08/05/2003
• Est. Priority Date: 01/26/1999
• Status: Expired due to Fees

• Current Assignee: Lynntech Power Systems Limited
• Original Assignee: Lynntech Power Systems Limited
• Inventors: Cisar, Alan J., Murphy, Oliver J., Clarke, Eric T.
• Primary Examiner(s): Kalafut, Stephen
• Assistant Examiner(s): ALEJANDRO, RAYMOND
• Application Number:
  US09/237,428
• Time in Patent Office: 1,652 Days
• Field of Search: 429/34, 429/38, 429/39, 429/30, 429/17, 429/210, 429/18, 429/36
• US Class Current: 429/452
• CPC Class Codes: H01M 8/0206 Metals or alloys
• CPC Class Codes: H01M 8/0223 Composites
• CPC Class Codes: H01M 8/0228 in the form of layered or coated products
• CPC Class Codes: H01M 8/023 Porous and characterised by the material
• CPC Class Codes: H01M 8/0263 having meandering or serpentine paths
• CPC Class Codes: H01M 8/0267 having heating or cooling means, e.g. heaters or coolant flow channels
• CPC Class Codes: H01M 8/0273 with sealing or supporting means in the form of a frame
• CPC Class Codes: H01M 8/028 Sealing means characterised by their material
• CPC Class Codes: H01M 8/2404 Processes or apparatus for grouping fuel cells
• CPC Class Codes: H01M 8/242 comprising framed electrodes or intermediary frame-like gaskets H01M8/2425, H01M8/244 take precedence
• CPC Class Codes: H01M 8/2483 characterised by internal manifolds
• CPC Class Codes: Y02E 60/50 Fuel cells
• CPC Class Codes: Y10T 29/49114 including adhesively bonding
• CPC Class Codes: Y10T 29/49115 including coating or impregnating

Abstract

The invention provides a method for preparing subassemblies for an electrochemical cell or a stack of electrochemical cells, particularly a stack of fuel cells for the direct generation of electricity. The method includes bonding together two or more electrochemical cell components, such as plates, frames, flow fields, shims, gaskets, membranes and the like, to form subassemblies used to make an electrochemical cell stack. The bonding can be accomplished using either polymeric bonds (i.e., adhesives) where polymer and/or metal components are involved or metallurgical bonds (i.e., solder) where metal components are involved. The bonding provides tightly sealed cells and lower electronic contact resistances between components.

Claims

1. A fluid cooled bipolar plate assembly comprising:

two electronically conducting fluid impermeable plates;

an electronically conducting cooling fluid permeable flow field bonded in electronic communication between the two electronically conducting plates; and

a frame disposed around a perimeter of the cooling fluid permeable flow field and bonded between the two electronically conducting plates, wherein the frame has channels for providing fluid communication between the cooling fluid permeable flow field and a fluid source.

2. The assembly of claim 1, further comprising an electronically conducting cathode flow field and an electronically conducting anode flow field bonded to opposing sides of the assembly.

3. The assembly of claim 1, wherein the assembly is bonded with an adhesive.

4. The assembly of claim 1, wherein the assembly is bonded with solder.

5. The assembly of claim 1, wherein the two fluid impermeable plates, the flow field, and the frame are made from stainless steel, titanium, aluminum, magnesium, nickel, nickel-plated aluminum, nickel-plated magnesium, copper-plated aluminum, copper-plated magnesium, gold-plated titanium or combinations thereof.

6. The assembly of claim 1, wherein the frame is selected from polycarbonate, polyethersulfone, polyetherimide, polyimide, or combinations thereof.

7. The assembly of claim 4, wherein the solder is selected from tin, silver, zinc, bismuth, lead, indium, and alloys thereof.

8. The assembly of claim 6, wherein the frame is adhesively bonded to the two fluid impermeable plates.

9. The assembly of claim 1, wherein the two fluid impermeable plates form gas barriers on opposing sides of the flow field.

10. The assembly of claim 1, wherein the two plates and the flow field are electronically conducting individually and as a unitary bonded assembly.

11. The assembly of claim 10, wherein the electronically conducting plates and flow field are metals.

12. The assembly of claim 1, further comprising an electronically conducting cathode flow field and an electronically conducting anode flow field bonded to opposing sides of the assembly.

13. The assembly of claim 12, wherein the cathode flow field and the anode flow field are metal.

14. The assembly of claim 12, wherein the two plates, the flow field, the cathode flow field, and the anode flow field are electronically conducting individually and as a unitary bonded assembly.

15. The assembly of claim 12, wherein the fluid permeable flow field, the cathode flow field, and the anode flow field are porous electrically conducting sheets selected from expanded metal mesh, woven metal mesh, metal foam, perforated metal sheet, conducting polymer foam, porous conductive carbon material, or combinations thereof.

16. The assembly of claim 12, further comprising a cathode cell frame disposed around a perimeter of the cathode flow field, an anode cell frame disposed around a perimeter of the anode flow field and wherein the cathode and anode cell frames have channels in fluid communication between the cathode flow field and the anode flow field, respectively, and fluid sources.

17. The assembly of claim 1, wherein the two fluid impermeable plates, the flow field, and the frame are bonded to each other to form gas tight bonds with either polymeric bonds or metallic bonds.

18. The assembly of claim 15, wherein the polymeric bonds or metallic bonds are stable under electrochemical cell stack operating conditions.

19. The assembly of claim 6, wherein the assembly has at least one interface selected from a polymer-to-metal interface, polymer-to-polymer interface, and metal-to-metal interface.

20. The assembly of claim 1, wherein the flow field allows passage of a cooling fluid between the two plates for cooling the electrochemical cell stack.

21. The assembly of claim 1, wherein the fluid cooled bipolar plate is capable of supporting current densities of about 0.8 Amps per square centimeter.

22. The assembly of claim 19, wherein the two electronically conducting plates, the electronically conducting fluid permeable flow field, and the frame are fabricated using a process selected from molding, casting, and stamping.

23. The assembly of claim 22, further comprising a cathode cell frame disposed around a perimeter of the cathode flow field, an anode cell frame disposed around a perimeter of the anode flow field, and wherein the cathode and anode cell frames have channels in fluid communication between the cathode flow field and anode flow field, respectively, and fluid sources.

37. The assembly of claim 1, wherein the two fluid impermeable plates and the cooling fluid permeable flow field are metal and are metallurgically bonded together by solder.

38. The assembly of claim 1, wherein the two fluid impermeable plates and the cooling fluid permeable flow field are metal and are metallurgically bonded together along metal-to-metal interfaces therebetween.

24. A bipolar plate for electrochemical cells, comprising:

two or more porous, electrically conducting sheets selected from expanded metal mesh, woven metal mesh, metal foam, conducting polymer foam, porous conductive carbon material or combinations thereof;

an electrically conducting gas barrier disposed in electrical contact between the sheets; and

a cell frame disposed around a periphery of any one of the two or more porous electrically conducting sheets, wherein the cell frame has at least one surface that is bonded to the gas barrier.

25. The bipolar plate of claim 24, wherein the cell frame includes channels in fluid communication between one of the two or more porous electrically conducting sheets and a fluid source.

26. The bipolar plate of claim 25, wherein the cell frame is metallic and is bonded to the gas barrier with a metallic bond.

27. The bipolar plate of claim 25, wherein the cell frame is polymeric and is bonded to the gas barrier with a polymeric bond.

28. The bipolar plate of claim 26, wherein the metallic bond is formed by soldering the cell frame to the gas barrier.

29. The bipolar plate of claim 27, wherein the polymeric bond is produced by an adhesive.

30. The bipolar plate of claim 24, wherein the metal sheet gas barrier and the two porous metal sheets are metallurgically bonded over an entire active area of the electrochemical cells.

31. The bipolar plate of claim 24, wherein the metal sheet gas barrier and the two porous metal sheets are metallurgically bonded by solder.

32. A bipolar plate for electrochemical cells, comprising:

two porous metal sheet flowfields;

a metal sheet gas barrier metallurgically bonded between the two porous metal sheet flowfields; and

a cell frame disposed around a periphery of one or more of the two porous metal sheet flowfields, wherein the cell frame has at least one surface that is bonded to the metal sheet gas barrier.

33. The bipolar plate of claim 32, wherein the metal sheet gas barrier and the two porous metal sheets are metallurgically bonded over an entire active area of the electrochemical cells.

34. The bipolar plate of claim 32, wherein the two porous metal sheet flowfields are continuous over the entire active area of the electrochemical cells.

35. The bipolar plate of claim 32, wherein the metal sheet gas barrier and the two porous metal sheets are metallurgically bonded by solder.

36. The bipolar plate of claim 32, wherein the metal sheet gas barrier and the two porous metal sheets are metallurgically bonded along metal-to-metal interfaces therebetween.

39. The bipolar plate of claim 32, wherein each cell frame includes channels in fluid communication between one of the two porous metal sheet flow fields and a fluid source.