Method for fabricating electronic circuit device, semiconductor device and electronic circuit device including bump bonding

• US 6,602,733 B2
• Filed: 02/15/2001
• Issued: 08/05/2003
• Est. Priority Date: 02/18/2000
• Status: Expired due to Fees

• Current Assignee: Sony Corporation (Sony Group Corp.)
• Original Assignee: Sony Corporation (Sony Group Corp.)
• Inventors: Yamasaki, Hiroshi, Sekine, Junichi, Iwahashi, Shinji
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): POMPEY, RON EVERETT
• Application Number:
  US09/783,021
• Publication Number:
  US 20010051396A1
• Time in Patent Office: 901 Days
• Field of Search: 438/108, 438/109, 438/118, 438/119, 438/120, 438/123, 438/127, 438/614, 438/612, 438/613
• US Class Current: 438/108
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/06135 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 2224/757 Means for aligning
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Abstract

A method for fabricating an electric circuit device able to ensure bonding strength and bond bumps without occurrence of cratering or other mechanical damages.

The method for fabricating an electric circuit device wherein a semiconductor device having a plurality of bumps formed in an approximate polygonal shape or others on a semiconductor chip so as to be connected with the circuit pattern of a semiconductor chip is mounted on a mounting board including electrodes formed on a board made of glass-epoxy based or other materials, comprises steps of, first, aligning the bumps with the electrodes and placing the semiconductor device on the mounting board, then while pressing from the upside of the semiconductor device to make the bumps and electrodes contact closely, applying ultrasonic vibration to the semiconductor device with the application direction D_v to be the direction of a diagonal of the semiconductor chip or a direction not parallel with any side of the approximate polygon formed by the arranged bumps, and fusing the bumps and electrodes by the generated heat.

Claims

1. A method for fabricating an electric circuit device wherein a semiconductor device having a plurality of bumps formed in an approximate polygonal shape or in a straight line arrangement is mounted on a mounting board having electrodes, comprising steps of:

aligning the bumps with the electrodes and placing the semiconductor device on the mounting board and

while making the bumps and the electrodes contact closely, applying ultrasonic vibration to the semiconductor device in a direction not parallel with any side of the approximate polygon formed by the arranged bumps or in a direction not parallel with the straight line formed by the arranged bumps.

2. A method for fabricating an electric circuit device as set forth in claim 1, wherein said application direction of ultrasonic vibration on said semiconductor device is such a direction that the dragging force acting on each bump is uniformed during application of ultrasonic vibration.

3. A method for fabricating an electric circuit device as set forth in claim 2, wherein said application direction making the dragging force acting on each bump uniform is such a direction that the distance between two bumps along the application direction of ultrasonic vibration is longer than the minimum distance between two bumps.

4. A method for fabricating an electric circuit device as set forth in claim 1, wherein said bumps are arranged in an approximate rectangle on said semiconductor device, and said application direction of ultrasonic vibration on the semiconductor device is the direction of a diagonal of the semiconductor device.

5. A method for fabricating an electric circuit device as set forth in claim 1, wherein a mounting board comprising a board made of glass-epoxy-based or other materials and wires formed thereon is used as said mounting board.

6. A method for fabricating an electric circuit device as set forth in claim 1, wherein twisted vibration is used as the method of applying ultrasonic vibration to the semiconductor device in a direction not parallel with any side of the approximate polygon formed by the arranged bumps, or in a direction not parallel with the straight line formed by the arranged bumps.

7. A method for fabricating an electric circuit device as set forth in claim 1, wherein complex vibration including vibration in the normal direction of said mounting board superposed on said twisted vibration is used as the method of applying ultrasonic vibration to said semiconductor device.