Method for fabricating electronic circuit device, semiconductor device and electronic circuit device including bump bonding
First Claim
1. A method for fabricating an electric circuit device wherein a semiconductor device having a plurality of bumps formed in an approximate polygonal shape or in a straight line arrangement is mounted on a mounting board having electrodes, comprising steps of:
- aligning the bumps with the electrodes and placing the semiconductor device on the mounting board and while making the bumps and the electrodes contact closely, applying ultrasonic vibration to the semiconductor device in a direction not parallel with any side of the approximate polygon formed by the arranged bumps or in a direction not parallel with the straight line formed by the arranged bumps.
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Accused Products
Abstract
A method for fabricating an electric circuit device able to ensure bonding strength and bond bumps without occurrence of cratering or other mechanical damages.
The method for fabricating an electric circuit device wherein a semiconductor device having a plurality of bumps formed in an approximate polygonal shape or others on a semiconductor chip so as to be connected with the circuit pattern of a semiconductor chip is mounted on a mounting board including electrodes formed on a board made of glass-epoxy based or other materials, comprises steps of, first, aligning the bumps with the electrodes and placing the semiconductor device on the mounting board, then while pressing from the upside of the semiconductor device to make the bumps and electrodes contact closely, applying ultrasonic vibration to the semiconductor device with the application direction Dv to be the direction of a diagonal of the semiconductor chip or a direction not parallel with any side of the approximate polygon formed by the arranged bumps, and fusing the bumps and electrodes by the generated heat.
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Citations
7 Claims
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1. A method for fabricating an electric circuit device wherein a semiconductor device having a plurality of bumps formed in an approximate polygonal shape or in a straight line arrangement is mounted on a mounting board having electrodes, comprising steps of:
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aligning the bumps with the electrodes and placing the semiconductor device on the mounting board and while making the bumps and the electrodes contact closely, applying ultrasonic vibration to the semiconductor device in a direction not parallel with any side of the approximate polygon formed by the arranged bumps or in a direction not parallel with the straight line formed by the arranged bumps. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification