Printed circuit board electrical interconnects

• US 6,603,079 B2
• Filed: 02/05/1999
• Issued: 08/05/2003
• Est. Priority Date: 02/05/1999
• Status: Expired due to Fees

• Current Assignee: Macs Technology Inc. (Micro-Star International Co., Ltd.)
• Original Assignee: Macs Technology Inc. (Micro-Star International Co., Ltd.)
• Inventors: Biron, Richard M.
• Primary Examiner(s): Paladini, Albert W.
• Assistant Examiner(s): NORRIS, JEREMY C
• Application Number:
  US09/244,801
• Publication Number:
  US 20010042636A1
• Time in Patent Office: 1,642 Days
• Field of Search: 439/493, 439/67, 361/789, 361/803, 361/749, 361/750, 361/757, 174/254, 174/255, 174/117.FF, 174/72.A, 174/261, 174/262-266
• US Class Current: 174/254
• CPC Class Codes: H05K 1/148 Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
• CPC Class Codes: H05K 2201/0352 Differences between the conductors of different layers of a multilayer
• CPC Class Codes: H05K 2201/0394 Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 3/061 Etching masks
• CPC Class Codes: H05K 3/4092 Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: H05K 3/427 initial plating of through-holes in metal-clad substrates
• CPC Class Codes: H05K 3/4691 Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Abstract

A device used in the formation of interconnected printed circuit boards and the like, the device comprising a rigid dielectric layer; a window in the dielectric layer; and at least two interconnects. Each of the at least two interconnects has a first segment bonded to the dielectric layer on a first side of the window, and a second segment bonded to the dielectric layer on a second side of the window. A portion of the each of the at least two interconnects located between the first and second segments extends across the window between the first and second sides of the window. The interconnects do not cover the entire window.

Claims

1. A device comprising:

a rigid dielectric layer;

a window in the dielectric layer; and

at least two interconnects;

wherein

each of the at least two interconnects has a first segment bonded to the dielectric layer on a first side of the window, and a second segment bonded to the dielectric layer on a second side of the window;

a portion of each of the at least two interconnects located between the first and second segments extends across the window between the first and second sides of the window;

the at least two interconnects do not cover the entire window, and

the device comprises at least two through holes extending through a first of the at least two interconnects and the dielectric layer, wherein one of the at least two through holes extends through the first segment of the first interconnect, and the second through hole extends through the second segment of the first interconnect.

2. The device of claim 1 wherein each through hole comprises a layer of conductive plating which is bonded to at least a portion of the sides of the through hole where it passes through the dielectric layer, and to an upper surface of the first interconnect, the upper surface being opposite a lower surface of the first interconnect which is bonded to the dielectric layer.

3. The device of claim 2 wherein the first and second segments are laminated onto the dielectric layer.

4. The device of claim 3 wherein the at least two interconnects comprise copper.

5. A device comprising:

a rigid dielectric layer;

a window in the dielectric layer; and

at least two interconnects;

wherein

each of the at least two interconnects has a first segment bonded to the dielectric layer on a first side of the window, and a second segment bonded to the dielectric layer on a second side of the window;

a portion of each of the at least two interconnects located between the first and second segments extends across the window between the first and second sides of the window;

the at least two interconnects do not cover the entire window;

each of the at least two interconnects has the same relationships to the window, dielectric layer, and through holes and the same characteristics as the first interconnect;

the dielectric layer comprises at least two segments forming at least two sides of the window; and

the at least two segments of the dielectric layer are coupled together only by the at least two interconnects.

6. The device of claim 5 further comprising at least two through holes extending through a first of the at least two interconnects and the dielectric layer, wherein one of the at least two through holes extends through the first segment of the first interconnect, and the second through hole extends through the second segment of the first interconnect.

7. The device of claim 6 wherein each through hole comprises a layer of conductive plating which is bonded to at least a portion of the sides of the through hole where it passes through the dielectric layer, and to an upper surface of the first interconnect, the upper surface being opposite a lower surface of the first interconnect which is bonded to the dielectric layer.

8. The device of claim 5 wherein the first and second segments of each of the at least two interconnects are laminated onto the dielectric layer.

9. The device of claim 5 wherein the at least two interconnects comprise a substance selected from the group consisting of:

copper;

beryllium copper;

nickel; and

brass.

10. The device of claim 5 wherein the at least two interconnects have a thickness which is greater than a thickness of at least one conductive trace formed upon the dielectric layer.