Endovascular thin film devices and methods for treating and preventing stroke

• US 6,605,111 B2
• Filed: 02/22/2001
• Issued: 08/12/2003
• Est. Priority Date: 06/04/1998
• Status: Expired due to Term

• Current Assignee: New York University
• Original Assignee: New York University
• Inventors: Bose, Arani, Nelson, Peter Kim
• Primary Examiner(s): Milano, Michael J.
• Assistant Examiner(s): Roberts, P
• Application Number:
  US09/789,531
• Publication Number:
  US 20030060782A1
• Time in Patent Office: 901 Days
• Field of Search: 623/1.13, 623/1.15, 623/1.35, 623/1.18, 623/1.19, 623/23.7, 623/1.11, 623/1.12, 606/196, 606/159, 606/151-158, 606/198, 340/10.1, 340/10.3
• US Class Current: 623/1.18
• CPC Class Codes: A61B 17/12022 Occluding by internal devices, e.g. balloons or releasable wires plugging an opening in the wall of an organ A61B17/0057; occluders for the cervical canal A61F6/146; vas deferens occluders A61F6/20
• CPC Class Codes: A61B 17/12113 within an aneurysm
• CPC Class Codes: A61B 17/12118 for positioning in conjunction with a stent
• CPC Class Codes: A61B 17/1214 Coils or wires
• CPC Class Codes: A61B 17/12172 having a pre-set deployed three-dimensional shape methods of manufacturing A61B2017/00526
• CPC Class Codes: A61B 17/12186 liquid materials adapted to be injected
• CPC Class Codes: A61B 17/1219 expandable in contact with liquids
• CPC Class Codes: A61B 2017/00831 Material properties
• CPC Class Codes: A61B 2017/00995 having a thin film
• CPC Class Codes: A61F 2/06 Blood vessels
• CPC Class Codes: A61F 2/82 Devices providing patency to, or preventing collapsing of, tubular structures of the body, e.g. stents stent-grafts for tubular structures of the body other than blood vessels A61F2/04; stent-grafts for blood vessels A61F2/07; instruments specially adapted for placement or removal of stents or stent-grafts A61F2/95; for closing wounds, or holding wounds closed A61B17/04 - A61B17/115; dilators A61M29/00
• CPC Class Codes: A61F 2/88 the wire-like elements formed as helical or spiral coils forming a net-like or mesh-like structure A61F2/90
• CPC Class Codes: A61F 2002/30062 (bio)absorbable, biodegradable, bioerodable, (bio)resorbable, resorptive
• CPC Class Codes: A61F 2002/823 Stents, different from stent-grafts, adapted to cover an aneurysm
• CPC Class Codes: A61F 2210/0004 bioabsorbable
• CPC Class Codes: A61F 2230/005 Rosette-shaped, e.g. star-shaped
• CPC Class Codes: A61F 2230/0071 spherical
• CPC Class Codes: A61F 2230/0095 Saddle-shaped

Abstract

Devices for excluding aneurysms and treating atherosclerotic disease, for intra-aneurysmal occlusion; and devices for preventing distal emboli. The devices are generally pliable and collapsible thin film devices which can be delivered via a microcatheter into the desired location where they are deployed and undergo either a shape memory phase transformation or in situ polymerization to assume the stable configuration of a permanent endoluminal prosthesis. Prior to being caused to assume their final shape, the devices remain soft, collapsible and pliable to ensure atraumatic delivery through the vascular system. Upon reaching the endoluminal defect in the vessel, the device is extruded from the microcatheter. Devices are also provided for retrieving clots.

Claims

1. A fenestrated endovascular device made consisting of a sputtered nickel titanium alloy having a thickness of from about 0.5 to about 150 microns wherein the device has:

a. a martensitic state;

b. an austenitic state in which the device assumes a preformed, expanded shape, and

c. a thin-film transition temperature at which the device undergoes a transition from its martensitic state to its austentitic state.

2. The device according to claim 1, wherein the alloy has a thickness of from about 2 to about 50 microns.

3. The device according to claim 1, wherein the alloy has an amorphous, chaotic, and disordered microcrystalline structure.

4. The device according to claim 1 wherein the transition temperature is less than about 35°

and greater than about 25°

C.

5. The device according to claim 4, wherein the transition phase temperature is from about 30-35°

C.