Device and method for testing integrated circuit dice in an integrated circuit module

• US 6,605,956 B2
• Filed: 03/01/2001
• Issued: 08/12/2003
• Est. Priority Date: 12/22/1995
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Farnworth, Warren M, Wark, James M., Duesman, Kevin G., Nelson, Eric S.
• Primary Examiner(s): Decady, Albert
• Assistant Examiner(s): Lamarre, Guy
• Application Number:
  US09/797,368
• Publication Number:
  US 20010009029A1
• Time in Patent Office: 894 Days
• Field of Search: 714/718, 714/724, 714/725, 714/733-734, 714/738, 714/745, 714/30, 324/158.1, 324/763, 324/765, 365/200, 365/201, 365/189.09, 365/185.04, 365/22, 365/218, 708/230, 713/501, 713/503, 326/8, 326/38, 326/17, 326/44, 326/106, 326/39, 326/108
• US Class Current: 324/750.3
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/31701 Arrangements for setting the Unit Under Test [UUT] in a test mode
• CPC Class Codes: G01R 31/31719 Security aspects, e.g. preventing unauthorised access during test
• CPC Class Codes: G01R 31/318513 Test of Multi-Chip-Moduls
• CPC Class Codes: G11C 29/1201 comprising I/O circuitry
• CPC Class Codes: G11C 29/46 Test trigger logic
• CPC Class Codes: G11C 29/785 with redundancy programming schemes
• CPC Class Codes: G11C 29/80 with improved layout
• CPC Class Codes: G11C 29/808 using a flexible replacement scheme
• CPC Class Codes: H01L 22/22 Connection or disconnection of sub-entities or redundant parts of a device in response to a measurement testing and repair of stores after manufacture including at wafer scale G11C29/00; fuses per se H01L23/525
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H04J 2203/0062 Testing

Abstract

An IC module, such as a Multi-Chip Module (MCM), includes multiple IC dice, each having a test mode enable bond pad, such as an output enable pad. A fuse incorporated into the MCM'"'"'s substrate connects each die'"'"'s test mode enable bond pad to one of the MCM'"'"'s no-connection (N/C) pins, and a resistor incorporated into the substrate connects the test mode enable bond pads to one of the MCM'"'"'s ground pins. By applying a supply voltage to the test mode enable bond pads through the N/C pin, a test mode is initiated in the dice. Once testing is complete, the fuse may be blown, and a ground voltage applied to the test mode enable bond pads through the ground pins so the resistor disables the test mode in the dice and initiates an operational mode. As a result, dice packaged in IC modules may be tested after packaging. A method for performing such testing once the test mode has been initiated and for repairing any failing elements found during testing includes providing test signals to the dice, receiving response signals from the dice, evaluating the response signals to identify any failing elements in the dice, programming the failing elements'"'"' addresses into anti-fuses in the dice with a programming voltage, confirming that the addresses are programmed by determining the resistance of the anti-fuses, re-testing the dice, receiving response signals from the retested dice, and evaluating the response signals to confirm all repairs.

Claims

1. A switching apparatus for switching first and second voltages to a function circuit in at least one integrated circuit die having at least one external communication terminal, the at least one integrated circuit die being provided in a module having a module terminal for receiving the first voltage from circuitry external to the module, the switching apparatus comprising.

a switching circuit connected to the at least one external communication terminal between the module terminal and the function circuit to selectively isolate the function circuit from the module terminal and to conduct the first voltage to the function circuit, the switching circuit comprising a programmable circuit;

and

an impedance circuit to conduct the second voltage to the function circuit upon isolation of the function circuit from the module terminal and to support a voltage differential between the first voltage at the function circuit and the second voltage.

2. The switching apparatus of claim 1, wherein the switching circuit comprises a programmable circuit to programmable isolate the function circuit.

3. The apparatus of claim 2, wherein the programmable circuit includes a programmable element selected from a group comprising a metal fuse, a polysilicon fuse, and a flash memory cell.

4. The apparatus of claim 3, wherein the programmable element is interposed between one of the function circuit, the module terminal, and the at least one external communication terminal.

5. The apparatus of claim 1, wherein the switching circuit comprises a switchable element selected from a group comprising an NMOS transistor and a PMOS transistor.

6. The apparatus of claim 1, wherein the at least one integrated circuit die includes the switching circuit connected between the at least one external communication terminal and the function circuit.

7. The apparatus of claim 1, wherein the module includes a substrate having the at least one integrated circuit die attached thereto, the substrate including the switching circuit connected between the module terminal and the at least one external communication terminal.

8. An integrated circuit die comprising:

a die connection terminal to receive a first mode initiating signal from circuitry external to the integrated circuit die;

a function circuit responsive to the first mode initiating signal by entering a first mode and responsive to a second mode initiating signal by entering a second mode;

a switching circuit connected between the die connection terminal and the function circuit to selectively isolate the function circuit from the die connection terminal and to conduct the first mode initiating signal to the function circuit, the switching circuit comprising a programmable circuit; and

an impedance circuit connected to the function circuit to conduct the second mode initiating signal to the function circuit upon the function circuit being isolated from the die connection terminal and to support a voltage differential between the first mode initiating signal at the function circuit and the second mode initiating signal.

9. An integrated circuit module comprising:

a first terminal and second terminal for receiving respectively a first voltage and a second voltage from circuitry external to the integrated circuit module;

a plurality of integrated circuit dice, each integrated circuit die including;

an external communication terminal; and

a function circuit coupled to the external communication terminal responsive to the first voltage by entering a first mode and to be responsive to the second voltage by entering a second mode, the second mode being different than the first mode;

a switching apparatus connected between the first terminal and the external communication terminal of each integrated circuit die of the plurality of integrated circuit dice to selectively isolate the function circuit from the first terminal and to conduct the first voltage to the function circuit, the switching apparatus comprising a programmable circuit; and

an impedance apparatus connected between the second terminal and each external communication terminal of each integrated circuit die of the plurality of integrated circuit dice to conduct the second voltage to the function circuit upon isolating the function circuit from the first terminal and to support a voltage differential between the first voltage at the function circuit and the second voltage at the second terminal.

10. The integrated circuit module of claim 9, wherein the switching apparatus includes at least one switching circuit selected from a group comprising a fuse, a transistor, and a flash memory cell.

11. An integrated circuit module substrate attached to at least one integrated circuit die and having an external communication terminal, the at least one integrated circuit die entering a test mode in response to receiving a test operation signal through its external communication terminal and entering an operational mode in response to receiving a regular operation signal through its external communication terminal, the integrated circuit module substrate comprising:

a test terminal to receive a test operation signal from circuitry external to the integrated circuit module substrate;

an operational terminal to receive the regular operation signal from circuitry external to the integrated circuit module substrate;

a switching circuit for connection between the test terminal and the external communication terminal of the at least one integrated circuit die to selectively isolate the external communication terminal from the test terminal and to conduct the test operation signal to the external communication terminal; and

an impedance circuit for connection between the operational terminal and the external communication terminal of the integrated circuit die to conduct the regular operation signal to the external communication terminal upon isolation of the external communication terminal from the test terminal and to support a voltage differential between the test operation signal at the external communication terminal and the regular operation signal at the operational terminal.

12. An integrated circuit module comprising:

at least one terminal to receive a first voltage and a second voltage from circuitry external to the module;

at least one integrated circuit die, each integrated circuit die including;

one or more function circuits, each function circuit responsive to the first voltage by entering a first mode and responsive to the second voltage by entering a second mode; and

a plurality of external communication terminals, a first portion of the external communication terminals coupled to the one or more function circuits and a second portion of the external communication terminals receiving the second voltage when the one or more function circuits are in the first mode; and

a conduction circuit coupled between the one or more terminals and each first portion of the plurality of external communication terminals of the at least one integrated circuit die and isolated from each second portion of the plurality of external communication terminals of the at least one integrated circuit die to conduct the first voltage and the second voltage to each circuit of the one or more function circuits of the at least one integrated circuit die in the respective first and second modes, said conduction circuit including a switching circuit.

13. An integrated circuit module substrate attached to one or more integrated circuit dice, each integrated circuit die having a plurality of external communication terminals, the integrated circuit module substrate comprising:

one or more terminals for receiving a first voltage and a second voltage from circuitry external to the integrated circuit module substrate; and

a dedicated conduction circuit for connection between the one or more terminals and the plurality of external communication terminals of each integrated circuit die of the one or more integrated circuit dice for conducting the first voltage and the second voltage to the plurality of external communication terminals of each die of the one or more integrated circuit dice, said dedicated conduction circuit comprising a switching circuit.

14. A method for initiating a first mode and a second mode in a function circuit in each of one or more integrated circuit dice in an integrated circuit module having a module terminal, the function circuit being of the type to enter the first and second modes in response to receiving respective first mode initiate and second mode initiate signals, each integrated circuit die of the one or more integrated circuit dice including one or more external communication terminals to receive the first mode initiate signal, the method comprising:

receiving the first mode initiate signal at the module terminal;

conducting the first mode initiate signal to external communication terminals for receiving the first mode initiate signal and from those external communication terminals to the function circuit for initiating the first mode therein, said conducting the first mode initiate signal at least includes connecting the module terminal to the function circuit through one of the external communication terminals for receiving the first mode initiate signal;

discontinuing conducting the first mode initiate signal to the function circuit; and

conducting the second mode initiate signal to the function circuit for initiating the second mode therein.

15. The method of claim 14, wherein the conducting the first mode initiate signal comprises:

connecting and disconnecting the module terminal to the function circuit through one of the external communication terminals for receiving the first mode initiate signal; and

supporting a difference in voltages between the first mode initiate signal at the function circuit and the second mode initiate signal.

16. The method of claim 15, wherein the disconnecting of the first mode initiate signal to the function circuit comprises disconnecting the function circuit from the module terminal.

17. The method of claim 16, wherein the disconnecting the function circuit from the module terminal comprises programming a programmable element selected from a group comprising a fuse, an anti-fuse, and a flash memory cell.