Thermal head and thermal head unit

• US 6,606,109 B1
• Filed: 04/06/2001
• Issued: 08/12/2003
• Est. Priority Date: 08/11/1998
• Status: Expired due to Fees

• Current Assignee: Seiko Instruments Incorporated (Seiko Group)
• Original Assignee: Seiko Instruments Incorporated (Seiko Group)
• Inventors: Shoji, Noriyoshi, Nakamura, Yuji, Takizawa, Osamu, Sambongi, Norimitsu, Ito, Taro, Yamaguchi, Yumiko
• Primary Examiner(s): TRAN, HUAN HUU
• Application Number:
  US09/762,556
• Time in Patent Office: 858 Days
• Field of Search: 347/200, 347/208
• US Class Current: 347/208
• CPC Class Codes: B41J 2/345 characterised by the arrangement of resistors or conductors

Abstract

A thermal head and a thermal head unit are provided, which can prevent density variation while suppressing the size of the thermal head to be small. In a thermal head (10) having a head chip (20) having one surface on which heat generating elements and segment and common electrodes connected to the heat generating elements are provided, and an IC chip (32) connected to the segment electrodes, the common electrode (27) provided to the head chip (20) is elongated in an array direction of the heat generating elements, and connections between the common electrode (27) and common electrode wirings (41) are provided at plural locations along the array direction.

Claims

1. A thermal head comprising:

a substrate;

a plurality of heat generating elements formed on the substrate and arranged in an array along a row;

a segment electrode formed on the substrate for each of the heat generating elements;

an individual common electrode formed on the substrate for each of the heat generating elements;

one or more semiconductor integrated circuits connected to a plurality of the segment electrodes, each integrated circuit for driving plural heat generating elements;

an elongated common electrode extending in the direction of the array of heat generating elements and being connected to each of the individual common electrodes; and

a plurality of common electrode wiring patterns for connecting the elongated common electrode to an external connection terminal, the common electrode wiring patterns being disposed at plural locations in the direction of the array of heat generating elements;

further comprising a circuit board on which the integrated circuits are provided; and

wherein a plurality of the common electrode wiring patterns are provided on the circuit board in the direction of the array for connecting the elongated common electrode to the external connection terminal.

2. A thermal head according to claim 1;

wherein the head chip is adhered to and partially overlaps the circuit board.

3. In a thermal head having a head chip on which are disposed a plurality of heat generating elements, a plurality of segment electrodes and a plurality of common electrodes connected to the heat generating elements, and a circuit board on which a plurality of semiconductor integrated circuits are provided each for driving plural heat generating elements, the improvement comprising:

the circuit board on which the semiconductor integrated circuits are mounted is joined to the head chip;

an elongated common electrode connected to each of the respective common electrodes is provided on the head chip, and common electrode wiring patterns are provided on the circuit board at plural locations along a direction of the elongated common electrode for connecting the elongated common electrode to an external connection terminal.

4. A thermal head according to claim 3;

wherein the semiconductor integrated circuits are spaced apart from each other along a row in the direction of the elongated common electrode; and

the common electrode wiring patterns for connecting the elongated common electrode to the external connection terminal are each provided on the circuit board between physical blocks defined by the semiconductor integrated circuits.

5. A thermal head according to claim 4;

wherein the common electrode wiring patterns for connecting the elongated common electrode to the external connection terminal are provided on selected semiconductor integrated circuits.

6. A thermal head according to claim 3;

wherein at least one common electrode wiring pattern for connecting the elongated common electrode to the external connection terminal is provided within a physical block defined by the semiconductor integrated circuit.

7. A thermal head according to claim 3;

wherein each of the common electrode wiring patterns is connected to the common electrode by a bonding wire.

8. A thermal head according to claim 7;

wherein the binding wires extend across the semiconductor integrated circuits.

9. A thermal head according to claim 7;

wherein the binding wires extend through the semiconductor integrated circuits.

10. A thermal head according to claim 7;

wherein an end of at least some of the bonding wires is connected to a common electrode wiring pattern at a location between semiconductor integrated circuits.

11. A thermal head according to claim 3;

wherein each of the common electrode wiring patterns for connecting the elongated common electrode to the external connection terminal is of a flip tip type.

12. A thermal head according to claim 3;

wherein each semiconductor integrated circuit is of a flip tip type, and is mounted to extend across the head chip and the circuit board.

13. A thermal head according to claim 3;

further comprising a support member for supporting the head chip and the circuit board.

14. A thermal head according to claim 3;

wherein the head chip partially overlaps the circuit board.

15. A thermal head comprising:

a head chip having a ceramic substrate, a plurality of heat generating elements formed on the ceramic substrate and arranged in a row, and individual electrodes formed on the ceramic substrate and connected to the heat generating elements;

a circuit board having an external connection terminal, and a plurality of IC chips each for driving a plurality of the heat generating elements by outputting print signals to selectively generate heat from selected heat generating elements at desired timings;

an elongated common electrode provided on the head chip extending in the direction of the row and being connected to individual electrodes of each of the heat generating elements; and

common electrode wiring patterns connected at first ends to an external connection terminal and at second ends to the elongated common electrode.

16. A thermal head according to claim 15;

wherein the head chip further comprises a glaze layer provided on the ceramic substrate and having projections arranged along the row at predetermined intervals and extending upward from the ceramic substrate at a predetermined distance from an edge of the ceramic substrate, an undercoat layer of a thermally insulative glass material provided on the glaze layer, and a protective layer provided on the heat generating elements;

wherein the respective heat generating elements are formed on the projections.

17. A thermal head according to claim 15;

wherein each of the heat generating elements comprises a pair of adjacent heat generating elements electrically connected at first ends, and the individual electrodes comprise an individual common electrode connected to a second end of one of the pair of heat generating elements and a segment electrode connected to a second end of the other one of the pair of heat generating elements.

18. A thermal head according to claim 15;

wherein the head chip is adhered to and partially overlaps the circuit board.