Power conditioning module

• US 6,606,251 B1
• Filed: 02/07/2002
• Issued: 08/12/2003
• Est. Priority Date: 02/07/2002
• Status: Expired due to Fees

• Current Assignee: Cooligy Incorporated (Emerson Electric Company)
• Original Assignee: Cooligy Incorporated (Emerson Electric Company)
• Inventors: Santiago, Juan G., Goodson, Kenneth E., Kenny, Thomas William Jr., Everett, George Carl Jr.
• Primary Examiner(s): NGUYEN, MATTHEW VAN
• Application Number:
  US10/072,137
• Time in Patent Office: 551 Days
• Field of Search: 363/144, 363/146, 363/147, 361/679, 361/704, 361/718, 361/720, 361/728, 361/729, 361/736, 361/748, 361/760, 361/761, 361/764, 361/767, 204/450, 204/451, 204/453, 204/600, 204/601, 204/604
• US Class Current: 361/764
• CPC Class Codes: G06F 1/26 Power supply means, e.g. regulation thereof for memories G11C
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/0615 Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
• CPC Class Codes: H01L 2224/13025 the bump connector being disposed on a via connection of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

In one aspect, the present invention is a technique of, and a system for conditioning power for a consuming device. In this regard, a power conditioning module, affixed to an integrated circuit device, conditions power to be applied to the integrated circuit device. The power conditioning module includes a semiconductor substrate having a first interface and a second interface wherein the first interface opposes the second interface. The power conditioning module further includes a plurality of interface vias, to provide electrical connection between the first interface and the second interface, and a first set of pads, disposed on the first interface and a second set of pads disposed on the second interface. Each of the pads is connected to a corresponding one of the interface vias on either the first or second interface. The power conditioning module also includes electrical circuitry, disposed within semiconductor substrate, to condition the power to be applied to the integrated circuit device. The electrical circuitry may be disposed on the first interface, the second interface, or both interfaces. Moreover, the electrical circuitry includes at least one voltage regulator and at least one capacitor.

Claims

1. A power conditioning and thermal management module to couple to an integrated circuit device, the power conditioning and thermal management module comprises:

a power conditioning element having a first interface and a second interface wherein the first interface opposes the second interface, the power conditioning element includes;

a semiconductor substrate;

a plurality of interface vias to provide electrical connection between the first interface and the second interface of the power conditioning element; and

electrical circuitry, disposed in the semiconductor substrate, to condition the power to be applied to the integrated circuit device, wherein the electrical circuitry includes at least one voltage regulator and at least one capacitor; and

a thermal management element having a first interface and a second interface wherein the first interface opposes the second interface, the thermal management element, during operation, uses a fluid having a liquid phase to capture thermal energy, the thermal management element including;

a substrate, wherein the substrate includes at least a portion of a micro channel disposed therein and configured to permit a flow of the fluid therethrough;

a plurality of interface vias to provide electrical connection between the first interface and the second interface of the thermal management element; and

a pump, adapted to connect to the micro channel, to produce the flow of the fluid in the micro channel; and

wherein each of the plurality of interface vias of the thermal management element connect to a corresponding one of the plurality of interface vias of the power management element to provide electrical connection between the first interface of the power conditioning element and the second interface of the thermal management element.

2. The power conditioning and thermal management module of claim 1 further including:

a current sensor, disposed in the semiconductor substrate, to provide information which is representative of a current consumption of the integrated circuit; and

a controller, coupled to the current sensor, to receive the information which is representative of the current consumption of the integrated circuit and, in response thereto, to adjust the flow of the fluid in the micro channel.

3. The power conditioning and thermal management module of claim 2 wherein the controller is disposed in the semiconductor substrate.

4. The power conditioning and thermal management module of claim 2 wherein the controller, in response to the information which is representative of the current consumption, adjusts a rate of flow of fluid output by the pump.

5. The power conditioning and thermal management module of claim 1 further including:

a temperature sensor, disposed in the power conditioning and thermal management module, to provide information which is representative of the temperature of a region of the power conditioning and thermal management module;

a controller, coupled to the temperature sensor, to receive the information representative of the temperature and, in response thereto, to adjust the flow of the fluid in the micro channel.

6. The power conditioning and thermal management module of claim 5 wherein the region is in proximity to the location of the temperature sensor.

7. The power conditioning and thermal management module of claim 5 wherein the temperature sensor and the controller are disposed in the semiconductor substrate.

8. The power conditioning and thermal management module of claim 5 wherein the controller, in response to information representative of the temperature, provides a signal to control the pump.

9. The power conditioning and thermal management module of claim 5 wherein the controller, in response to information representative of the temperature, adjusts a rate of flow of fluid output by the pump.

10. The power conditioning and thermal management module of claim 5 further including a current sensor coupled to the controller to provide information which is representative of the current consumption of the integrated circuit, wherein the controller, in response to the information which is representative of the current consumption, adjusts the flow of the fluid in the micro channel.

11. The power conditioning and thermal management module of claim 10 wherein the controller, in response to information representative of the current consumption of the integrated circuit, adjusts a rate of flow of fluid output by the pump.

12. The power conditioning and thermal management module of claim 1 wherein the first interface of the thermal management element is physically bonded to the second interface of the power conditioning element.

13. The power conditioning and thermal management module of claim 12 wherein the electrical circuitry is disposed on the first interface of the power conditioning element.

14. The power conditioning and thermal management module of claim 13 further including:

at least one power pad disposed on the second interface of the thermal management element; and

at least one power via, wherein the power via is electrically connected to the power pad to provide electrical connection between the second interface of the thermal management element and at least one of the voltage regulator and capacitor.

15. The power conditioning and thermal management module of claim 14 wherein the power via is electrically connected to a power conduit disposed in the semiconductor substrate of the power management element and wherein the power conduit provides electrical connection between the power via and at least one of the voltage regulator and capacitor.

16. The power conditioning and thermal management module of claim 13 further including:

at least one power via disposed in the substrate of the thermal management element;

at least one power pad disposed on the second interface of the thermal management element, wherein the power pad is electrically connected to the power via to provide electrical connection between the second interface of the thermal management element and at least one of the voltage regulator and capacitor; and

at least one output power conduit, coupled to the electrical circuitry, to provide conditioned power to the integrated circuit device.

17. The power conditioning and thermal management module of claim 16 wherein the output power conduit connects to an input power pad disposed on the first interface of the power conditioning element wherein the input power pad corresponds to an input of the integrated circuit device.

18. The power conditioning and thermal management module of claim 12 wherein the electrical circuitry is disposed on the second interface of the power conditioning element.

19. The power conditioning and thermal management module of claim 18 further including:

at least one ground pad disposed on the second interface of the thermal management element; and

at least one ground via, wherein the ground via is electrically connected to the ground pad to provide electrical connection between the second interface of the thermal management element and at least one of the voltage regulator and capacitor.

20. The power conditioning and thermal management module of claim 19 wherein the ground via is electrically connected to a ground conduit disposed in the semiconductor substrate of the power conditioning element and wherein the ground conduit is electrically connected to least one of the voltage regulator and capacitor.

21. The power conditioning and thermal management module of claim 20 further including:

at least one power via disposed in the substrate of the thermal management element;

at least one power pad, disposed on the second interface of the thermal management element, wherein the power pad is electrically connected to the power via to provide electrical connection between the second interface of the thermal management element and at least one of the voltage regulator and capacitor; and

at least one output power conduit, coupled to the electrical circuitry, to provide conditioned power to the integrated circuit device.

22. The power conditioning and thermal management module of claim 21 wherein the output power conduit connects to an input power pad disposed on the first interface of the power conditioning element wherein the input power pad corresponds to the power input of the integrated circuit device.

23. A power conditioning and thermal management module to couple to an integrated circuit device, the power conditioning and thermal management module having a first interface and a second interface wherein the first interface opposes the second interface, the power conditioning and thermal management module comprises:

a semiconductor substrate;

a plurality of interface vias to provide electrical connection between the first interface and the second interface;

a first plurality of pads disposed on the first interface, each of the first plurality of pads is connected to a corresponding one of the interface vias on the first interface;

a second plurality of pads disposed on the second interface, each of the second plurality of pads is connected to a corresponding one of the interface vias on the second interface; and

electrical circuitry, disposed in the semiconductor substrate, to condition the power to be applied to the integrated circuit device, wherein the electrical circuitry includes at least one voltage regulator and at least one capacitor;

a micro channel structure, including at least one micro channel disposed in the semiconductor substrate, to capture thermal energy.

24. The power conditioning and thermal management module of claim 23 further including:

a current sensor, disposed in the semiconductor substrate, to provide information which is representative of the current consumption of the integrated circuit; and

a controller, coupled to the current sensor, to receive the information which is representative of the current consumption of the integrated circuit and, in response thereto, to adjust a rate of capture of thermal energy by the micro channel structure.

25. The power conditioning and thermal management module of claim 23 further including:

a pump, adapted to connect to the micro channel structure, to produce the flow of the fluid in the micro channel structure;

a current sensor, disposed in the semiconductor substrate, to provide information which is representative of a current consumption; and

a controller, coupled to the current sensor, to receive the information which is representative of the current consumption and, in response thereto, to adjust a rate of flow of fluid output by the pump.

26. The power conditioning and thermal management module of claim 25 further including:

a temperature sensor, disposed in the power conditioning and thermal management module, to provide information which is representative of a temperature;

wherein the controller is coupled to the temperature sensor and receives the information representative of the temperature.

27. The power conditioning and thermal management module of claim 26 wherein the controller, in response to the information representative of the temperature, adjusts the flow of the fluid in the micro channel structure.

28. The power conditioning and thermal management module of claim 26 wherein the controller, in response to the information representative of the temperature, adjusts a rate of flow of fluid output by the pump.

29. The power conditioning and thermal management module of claim 26 wherein the temperature sensor and the controller are disposed in the semiconductor substrate.

30. The power conditioning and thermal management module of claim 23 wherein the electrical circuitry is disposed on the second interface.

31. The power conditioning and thermal management module of claim 30 further including:

at least one power conduit disposed in the semiconductor substrate; and

at least one power pad, disposed on the second interface, wherein the power pad is electrically connected to the power conduit to provide electrical connection between the second interface and at least one of the voltage regulator and capacitor.

32. The power conditioning and thermal management module of claim 30 further including:

at least one output power pad disposed on the first interface; and

at least one output power via, wherein the output power via is coupled to the electrical circuitry and the output power pad.

33. The power conditioning and thermal management module of claim 32 wherein the output power pad corresponds to an input of the integrated circuit device.

34. The power conditioning and thermal management module of claim 23 wherein the micro channel structure is disposed on the first interface and wherein the power conditioning and thermal management module further includes a pump to provide a fluid, having a liquid phase, to the at least one micro channel.

35. The power conditioning and thermal management module of claim 23 wherein the electrical circuitry is disposed on the first interface.

36. The power conditioning and thermal management module of claim 35 further including:

at least one power pad disposed on the second interface; and

at least one power via, wherein the power pad is electrically connected to the power via to provide electrical connection between the second interface and at least one of the voltage regulator and capacitor.

37. The power conditioning and thermal management module of claim 36 wherein the power via is electrically connected to a power conduit disposed in the semiconductor substrate and wherein the power conduit provides electrical connection between the power pad and at least one of the voltage regulator and capacitor.

38. The power conditioning and thermal management module of claim 37 further including at least one output power conduit, coupled to the electrical circuitry, to provide conditioned power to the integrated circuit device.

39. The power conditioning and thermal management module of claim 38 wherein the output power conduit connects to an input power pad disposed on the first interface of the power conditioning element wherein the input power pad corresponds to the power input of the integrated circuit device.