Method and apparatus for performing run-to-run control in a batch manufacturing environment

• US 6,607,926 B1
• Filed: 08/10/1999
• Issued: 08/19/2003
• Est. Priority Date: 08/10/1999
• Status: Expired due to Term

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Campbell, William J., Toprac, Anthony J., Bode, Christopher A.
• Primary Examiner(s): PERT, EVAN T
• Application Number:
  US09/371,665
• Time in Patent Office: 1,470 Days
• Field of Search: 438/5, 438/7, 438/8, 438/9, 438/14, 438/16, 438/401, 250/492.22, 700/121, 702/81, 702/82, 702/83, 702/84
• US Class Current: 438/7
• CPC Class Codes: G03F 7/70633 Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

The present invention provides for a method and an apparatus for controlling manufacturing processes using a hierarchical system. A first lot of semiconductor devices is processed using a first set of control input parameters. The first set of control input parameters is stored in one of a plurality of hierarchical levels, the first set of control input parameters being available for processing of a second lot of semiconductor devices. Process data is acquired from the processing of the first lot of semiconductor devices. A second set of control input parameters is determined for a subsequent lot of semiconductor devices based upon the acquired process data. The second set of control input parameters is stored in one of a plurality of hierarchical levels, the first and second sets of control input settings being available for processing of a third lot of semiconductor devices.

Claims

1. A method for controlling a manufacturing process using a hierarchical system, comprising:

processing a first lot of semiconductor devices using a first set of control input parameters;

storing said first set of control input parameters in one of a plurality of hierarchical levels, said first set of control input parameters being available for processing of a second lot of semiconductor devices;

acquiring process data from said processing of said first lot of semiconductor devices;

determining a second set of control input parameters for a subsequent lot of semiconductor devices based upon said acquired process data; and

storing said second set of control input parameters in one of a plurality of hierarchical levels, said first and second sets of control input settings being available for processing of a third lot of semiconductor devices.

2. The method described in claim 1, wherein processing said lots of semiconductor devices based upon said sets of control input parameters further comprises processing semiconductor wafers.

3. The method described in claim 2, wherein processing semiconductor wafers further comprises using an exposure tool.

4. The method described in claim 3, wherein processing semiconductor wafers using said exposure tool further comprises using an advanced process control framework.

5. The method described in claim 1, wherein processing said lots of semiconductor devices based upon said sets of control input parameters further comprises processing semiconductor devices based upon control input parameters defined by a control thread.

6. The method described in claim 1, wherein processing said lots of semiconductor devices based upon said sets of control input parameters further comprises processing semiconductor tools based upon control input parameters that comprise an x-translation signal, a y-translation signal, an x-expansion wafer scale signal, a y-expansion wafer scale signal, a reticle magnification signal, and a reticle rotation signal.

7. The method described in claim 1, wherein storing said sets of control input parameters in one of a plurality of hierarchical levels further comprises storing said first set of control input parameters in a hierarchical level that is defined by a process tool type.

8. The method described in claim 1, wherein storing said sets of control input parameters in one of a plurality of hierarchical levels further comprises storing said first set of control input parameters in a hierarchical level that is defined by a particular lot of semiconductor wafers.

9. The method described in claim 1, wherein storing said sets of control input parameters in one of a plurality of hierarchical levels further comprises storing said first set of control input parameters in a hierarchical level that is defined by a particular manufacturing process.

10. The method described in claim 1, wherein acquiring process data from said processing of said first lot of semiconductor device s further comprises accessing metrology relating to the processing of said first lot of semiconductor devices.

11. The method described in claim 1, wherein determining a second set of control input parameters for a subsequent lot of semiconductor devices further comprises using data stored in said plurality of hierarchical levels to determine said second set of control input parameters.

12. The method described in claim 1, wherein determining a second set of control input parameters for a subsequent lot of semiconductor devices further comprises:

determining a lowest relevant hierarchical level;

using a set of default control parameters in response to a determination that said lowest relevant hierarchical level is not found;

acquiring data from said lowest relevant hierarchical level; and

determining a set of new control input parameters using data acquired from said lowest relevant hierarchical level.

13. The method described in claim 12, wherein determining a lowest relevant hierarchical level further comprises determining a hierarchical level that contains data of a previous process that is similar to a current process.

14. An apparatus for controlling manufacturing processes using a hierarchical system, comprising:

means for processing a first lot of semiconductor devices using a first set of control input parameters;

means for storing said first set of control input parameters in one of a plurality of hierarchical levels, said first set of control input parameters being available for processing a second lot of semiconductor devices;

means for acquiring process data from said processing of said first lot of semiconductor devices;

means for determining a second set of control input parameters for a subsequent lot of semiconductor devices based upon said acquired process data; and

means for storing said second set of control input parameters in one of a plurality of hierarchical levels, said first and second sets of control input settings being available for processing of a third lot of semiconductor devices.

15. A computer readable program storage device encoded with instructions that, when executed by a computer, performs a method for controlling manufacturing processes using a hierarchical system, comprising:

processing a first lot of semiconductor devices using a first set of control input parameters;

storing said first set of control input parameters in one of a plurality of hierarchical levels, said first set of control input parameters being available for processing of a second lot of semiconductor devices;

acquiring process data from said processing of said first lot of semiconductor devices;

determining a second set of control input parameters for a subsequent lot of semiconductor devices based upon said acquired process data; and

storing said second set of control input parameters in one of a plurality of hierarchical levels, said first and second sets of control input settings being available for processing of a third lot of semiconductor devices.

16. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 15, wherein processing said lots of semiconductor devices based upon said sets of control input parameters further comprises processing semiconductor wafers.

17. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 16, wherein processing semiconductor wafers further comprises using an exposure tool.

18. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 17, wherein processing semiconductor wafers using said exposure tool further comprises using an advanced process control framework.

19. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 15, wherein processing said lots of semiconductor devices based upon said sets of control input parameters further comprises processing semiconductor devices based upon control input parameters defined by a control thread.

20. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 15, wherein processing said lots of semiconductor devices based upon said sets of control input parameters further comprises processing semiconductor devices based upon control input parameters that comprise an x-translation signal, a y-translation signal, an x-expansion wafer scale signal, a y-expansion wafer scale signal, a reticle magnification signal, and a reticle rotation signal.

21. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 15, wherein storing said sets of control input parameters in one of a plurality of hierarchical levels further comprises storing said first set of control input parameters in a hierarchical level that is defined by a process tool type.

22. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 15, wherein storing said sets of control input parameters in one of a plurality of hierarchical levels further comprises storing said first set of control input parameters in a hierarchical level that is defined by a particular lot of semiconductor wafers.

23. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 15, wherein storing said sets of control input parameters in one of a plurality of hierarchical levels further comprises storing said first set of control input parameters in a hierarchical level that is defined by a particular manufacturing process.

24. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 15, wherein acquiring process data from said processing of said first lot of semiconductor devices further comprises accessing metrology relating to the processing of said first lot of semiconductor devices.

25. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 15, wherein determining a second set of control input parameters for a subsequent lot of semiconductor devices further comprises using data stored in said plurality of hierarchical levels to determine said second set of control input parameters.

26. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 15, wherein determining a second set of control input parameters for a subsequent lot of semiconductor devices further comprises:

determining a lowest relevant hierarchical level;

using a set of default control parameters in response to a determination that said lowest relevant hierarchical level is not found;

acquiring data from said lowest relevant hierarchical level; and

determining a set of new control input parameters using data acquired from said lowest relevant hierarchical level.

27. The computer readable program storage device encoded with instructions that, when executed by a computer, performs the method described in claim 26, wherein determining a lowest relevant hierarchical level further comprises determining a hierarchical level that contains data of a previous process that is similar to a current process.