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Method of producing an optically transparent substrate and method of producing a light-emitting semiconductor chip

  • US 6,607,931 B2
  • Filed: 02/26/2001
  • Issued: 08/19/2003
  • Est. Priority Date: 02/24/2000
  • Status: Expired due to Term
First Claim
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1. A method of producing a light-emitting semiconductor chip structure with an optically transparent substrate, the method which comprises:

  • providing a lattice-matched substrate;

    epitaxially growing a substrate layer on the lattice-matched substrate;

    connecting the substrate layer to an optically transparent layer at a side of the substrate layer facing away from the lattice-matched substrate by using a wafer-bonding process;

    removing the lattice-matched substrate from a composite formed of the substrate layer and the optically transparent layer; and

    then epitaxially growing a light-emitting semiconductor structure onto the substrate layer.

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