Induction heating apparatus

• US 6,608,291 B1
• Filed: 03/19/2001
• Issued: 08/19/2003
• Est. Priority Date: 03/20/2000
• Status: Expired due to Fees

• Current Assignee: Colvin, James B., Roberto A. Collins
• Original Assignee: Colvin, James B., Roberto A. Collins
• Inventors: Colvin, James B., Collins, Roberto A.
• Primary Examiner(s): Walberg, Teresa
• Assistant Examiner(s): Van, Quang T
• Application Number:
  US09/811,857
• Time in Patent Office: 883 Days
• Field of Search: 219/662, 219/663, 219/660, 219/661, 219/626, 219/665, 219/666, 219/627, 219/629, 219/552, 219/603, 330/264, 994/22
• US Class Current: 219/662
• CPC Class Codes: H05B 6/06 Control, e.g. of temperature, of power

Abstract

A portable induction heating system which utilizes a broadband high frequency high-power, low output impedance power generator formed from switching MOSFET devices. A voltage-controlled oscillator (VCO) or microprocessor-controlled signal generator drives a power output stage under feedback control so as to effectuate resonance at a high frequency in an induction coil assembly connected to the power generator. The power generator is operable with a switching regulator that can supply a fixed DC voltage, e.g., 12 to 48 V or a variable setpoint. The induction coil assembly includes a capacitive circuit portion connected to a conductive coil that can couple magnetic field to a susceptor. A microcontroller is provided for inputting operating parameters such as power, frequency, duty cycle and duration, and is operable to auto-tune the VCO output under feedback control by sweeping frequency at startup as well as by controlling drift during operation under a changing load.

Claims

1. An induction heating apparatus, comprising:

a solid state power generator capable of driving a variable impedance, said generator operating with a switching regulator for generating current at a high frequency;

an induction coil assembly connected to said solid state power generator, said induction coil assembly including a capacitive circuit portion coupled to a conductive coil, wherein said conductive coil operates responsive to said high frequency current to generate a magnetic field for inductively coupling with a susceptor, thereby substantially rapidly heating said susceptor'"'"'s material;

said solid state power generator including a power output stage driven under feedback control so as to effectuate resonance in said induction coil assembly at around said high frequency; and

said power output stage including a pre-driver circuit portion coupled to a driver circuit portion, wherein said pre-driver circuit portion comprises a plurality of buffer circuits disposed in parallel, each buffer circuit operating to drive a transformer coupled to a field effect transistor (FET) device, and said transformer and said FET device forming at least a part of said driver circuit portion.

2. The induction heating apparatus as set forth in claim 1, wherein said switching regulator is comprised of a direct current (DC) voltage supply operable from about 10 VDC to several hundreds volts.

3. The induction heating apparatus as set worth in claim, 1, wherein said driver portion operates to drive said induction coil assembly through a plurality of n-channel metal oxide semiconductor (NMOS) FET devices coupled thereto.

4. The induction heating apparatus as set forth in claim 1, wherein said driver circuit portion comprises at least an NMOS device coupled to a p-channel MOS (PMOS) device in a complementary MOS (CMOS) circuit arrangement, and further wherein gates of said NMOS and said PMOS are provided with a DC offset.

5. The induction heating apparatus as set forth in claim 1, wherein said driver portion operates to drive said induction coil assembly through a plurality of FET devices that are comprised of a bank of NMOS devices and a bank of PMOS devices.

6. The induction heating apparatus as set forth in claim 1, further comprising a current sensor, a temperature sensor, and a phase comparator for effectuating feedback control of a voltage-controlled oscillator (VCO) via a microcontroller, said VCO forming a part of said solid state power generator.

7. The induction heating apparatus as set forth in claim 6, wherein said microcontroller is provided with a user interface selected from the group consisting of a keyboard, a display, and a pointing device.

8. The induction heating apparatus as set forth in claim 1, wherein said conductive coil is selected from the group consisting of a pancake coil, a circular coil, a square coil, a helical coil, a hair pin coil, a rectangular coil, an ear muff coil, a ferrite core coil, a cooled core coil, a toroid coil, and an oval coil.

9. The induction heating apparatus as set forth in claim 8 wherein said conductive coil is comprised of at least one turn of a copper wire.

10. The induction heating apparatus as set forth in claim 8, wherein said conductive coil is comprised of at least one turn of a hollow copper tube.

11. The induction heating apparatus as set forth in claim 10, wherein said conductive coil is cooled by circulating a coolant through said hollow copper tube.

12. The induction heating apparatus as set forth in claim 1, wherein said induction coil assembly is connected to said solid state power generator through a twisted pair ribbon connector having a plurality or conductive wires.

13. The induction heating apparatus as set forth in claim 1, wherein said induction coil assembly is connected to said solid state power generator through a coaxial cable connector.

14. A system for heating a component by inductively coupling to said component, comprising:

power generator means for generating current with a frequency at least at around 0.5 MHz;

an induction coil assembly coupled to said power generator means via connection means, wherein said induction coil assembly is resonantly operable at said frequency to couple to said component for Generating heat thereat;

said power generator means including a power output stage driven under feedback control so as to effectuate resonance in said induction coil assembly at around said frequency;

said power output stage including a pre-driver circuit portion coupled to a driver circuit portion wherein said pre-driver circuit portion comprises a plurality of buffer circuits disposed in parallel, each buffer circuit operating to drive a transformer coupled to a field effect transistor (FET) device, and said transformer and said FEN device forming at least a part of said driver circuit portion; and

feedback control means for controlling said current'"'"'s frequency so as to maintain resonance of said induction coil assembly during operation therefor.

15. The system for heating a component by inductively coupling to said component as set forth in claim 14, wherein said power generator means is operable with a direct current (DC) voltage supply from about 10 VDC to several hundred volts.

16. The system for heating a component by inductively coupling to said component as set forth in claim 15, wherein said power generator means includes at least one of a voltage-controlled oscillator (VCO) and a microprocessor-controlled signal generator for driving said power output stage coupled to said induction coil assembly via said connection means.

17. The system for heating a component by inductively coupling to said component as set forth in claim 14, wherein said induction coil assembly includes at least one of a capacitor portion and a resistor portion coupled to a conductive coil.

18. The system for heating a component by inductively coupling to said component as set forth in claim 17, wherein said conductive coil is selected from the group consisting of a pancake coil, a circular coil, a square coil, a helical coil, a hair pin coil, a rectangular coil, an ear muff coil, a ferrite core coil, a cooled core coil, and an oval coil.

19. The system for heating a component by inductively coupling to said component as set forth in claim 17, wherein said conductive coil is comprised of a hollow copper tube, and further wherein said component comprises a specific conductive portion of a semiconductor device.

20. The system for heating a component by inductively coupling to said component as set forth in claim 14, wherein said connection means comprises a twisted pair ribbon connector manipulable by a robotic arm.

21. A system for heating a component by inductively coupling to said component, comprising:

a solid state power generator operable without a matching transformer for generating current with a selectable frequency, said solid state cower generator including a power output stage driven under feedback control, said power output stage including a pre-driver circuit portion coupled to a driver circuit portion, wherein said pre-driver circuit portion comprises a plurality of buffer circuits disposed in parallel, each buffer circuit operating to drive a transformer coupled to a field effect transistor (FET) device, and said transformer and said FET device forming at least a part of said driver circuit portion;

an induction coil assembly coupled to said solid state power generator via connection means, wherein said induction coil assembly is resonantly operable at said selectable frequency to couple to said component for generating heat thereat; and

feedback control means for controlling said current'"'"'s frequency so as to maintain resonance of said induction coil assembly during operation thereof.

22. The system for heating a component by inductively coupling to said component as set forth in claim 21, wherein said solid state power generator is operable with a direct current (DC) voltage supply from about 10 VDC to several hundred volts.

23. The system for heating a component by inductively coupling to said component as set forth in claim 22, wherein said solid state power generator includes at least one of a voltage-controlled oscillator (VCO) and a microprocessor-controlled signal generator for driving said power output stage coupled to said induction coil assembly via said connection means.

24. The system for heating a component by inductively coupling to said component as set forth in claim 21, wherein said induction coil assembly includes at least one of a capacitor portion and a resistor portion coupled to a conductive coil.

25. The system for heating a component by inductively coupling to said component as set forth in claim 24, wherein said conductive coil is selected from the group consisting of a pancake coil, a circular coil, a square coil, a helical coil, a hair pin coil, a rectangular coil, an ear muff coil, a ferrite core coil, a cooled core coil, and an oval coil.

26. The system for heating a component,by inductively coupling to said component as set forth in claim 24, wherein said conductive coil is comprised of a hollow copper tube, and further wherein said component comprises a specific conductive portion of a semiconductor device.

27. The system for heating a component by inductively coupling to said component as set forth in claim 24, wherein said connection means comprises a twisted pair ribbon connector.

28. The system for heating a component by inductively coupling to said component as set forth in claim 21, wherein said selectable frequency is at least around 500 KHz.