Exposure method and apparatus

• US 6,608,681 B2
• Filed: 07/02/2002
• Issued: 08/19/2003
• Est. Priority Date: 12/25/1992
• Status: Expired due to Fees

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Tanaka, Yasuaki, Nishi, Kenji, Murakami, Seiro
• Primary Examiner(s): Font, Frank G.
• Assistant Examiner(s): NATIVIDAD, PHILIP SANA
• Application Number:
  US10/186,687
• Publication Number:
  US 20020176082A1
• Time in Patent Office: 413 Days
• Field of Search: 356/399, 356/400, 356/401
• US Class Current: 356/400
• CPC Class Codes: G03F 7/70358 Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
• CPC Class Codes: G03F 9/7026 Focusing

Abstract

An apparatus for exposing a pattern, formed on a mask, on each of a plurality of partitioned areas on a photosensitive substrate by a step-and-repeat scheme includes a projection optical system for projecting the pattern of the mask on the photosensitive substrate, a substrate stage for holding the photosensitive substrate and two-dimensionally moving the photosensitive substrate within a plane perpendicular to the optical axis of the projection optical system, a detection unit for projecting a pattern image having a predetermined shape on the photosensitive substrate and photoelectrically detecting light reflected by the photosensitive substrate to detect a position at each of a plurality of points on the photosensitive substrate along the optical axis of the projection optical system, and a measurement unit for, when each of a plurality of measurement points in a partitioned area on which a pattern of the mask is to be exposed next coincides with or approaches the pattern image, detecting an offset amount between an imaging plane of the projection optical system and the next partitioned area along the optical axis during a stepping operation of the substrate stage, wherein the imaging plane and the next partitioned area are relatively moved along the optical axis in accordance with the measured offset amount before the pattern of the mask is exposed on the next partitioned area.

Claims

1. A scanning exposure apparatus in which a mask and a substrate are moved in respective scanning direction to expose the substrate during scanning exposure, comprising:

a projection system;

a detector which has a beam irradiation system and a beam receiving system to detect information on positional relationship between an image plane of the projection system and an exposure surface of the substrate at a plurality of measuring points during the scanning exposure, the plurality of measuring points being arranged within a projection area of the projection system; and

a controller, functionally associated with the detector, which adjusts relative inclination between the image plane and the exposure surface in a non-scanning direction perpendicular to the scanning direction of the substrate on the basis of the detected information during the scanning exposure.

2. A scanning exposure apparatus according to claim 1, wherein said plurality of measuring points are apart from each other in the direction perpendicular to the scanning direction of the substrate.

3. A scanning exposure apparatus according to claim 1, wherein the controller adjusts the relative inclination between the image plane and the exposure surface in the scanning direction of the substrate during the scanning exposure.

4. A scanning exposure apparatus according to claim 3, wherein a response speed of the adjustment with respect to the scanning direction is different from a response speed of the adjustment with respect to the non-scanning direction.

5. A scanning exposure apparatus according to claim 1, wherein the controller determines a response speed of the inclination adjustment in accordance with a scanning speed of the substrate.

6. A scanning exposure apparatus according to claim 1, wherein deviations between the image plane and the exposure surface are obtained based on the detected information, and the controller adjusts the relative inclination in accordance with a maximum value and a minimum value of the obtained deviations.

10. A scanning exposure method according to claim 2, wherein a response speed of the relative movement is determined in accordance with a scanning speed of the substrate.

7. A scanning exposure method in which a mask and a substrate are moved to expose a shot area on the substrate during scanning exposure, comprising:

changing, during the scanning exposure, measuring points to detect information on positional relationship between an image plane of a projection system and an exposure surface of the substrate; and

relatively moving the image plane and the exposure surface on the basis of the detected information during the scanning exposure.

8. A scanning exposure method according to claim 7, wherein the measuring points are changed in accordance with positional relation between a projection area formed via the projection system and the shot area on the substrate during the scanning exposure.

9. A scanning exposure method according to claim 7, wherein the relative movement includes an inclination adjustment between the image plane and the exposure surface, and a response speed of the inclination adjustment with respect to a scanning direction is different from a response speed of the inclination adjustment with respect to a non-scanning direction, the substrate being moved in the scanning direction during the scanning exposure and the non-scanning direction being perpendicular to the scanning direction.

11. A scanning exposure method according to claim 7, wherein deviations between the image plane and the exposure surface are obtained based on the detected information, and the relative movement between the image plane and the exposure surface is performed in accordance with a maximum value and a minimum value of the obtained deviations.

12. A scanning exposure method according to claim 7, further comprising:

irradiating an irradiation area with an exposure beam; and

inclining, during the scanning exposure, the substrate about a predetermined point as a rotational center within the irradiation area based on the detected information in order to relatively move the image plane and the exposure surface.

13. A scanning exposure method in which a mask and a substrate are moved in respective scanning directions to expose a shot area on the substrate during scanning exposure, comprising:

selecting a part of a plurality of measuring points to detect information on positional relationship between an image plane of a projection system and an exposure surface of the substrate, the plurality of measuring points being arranged along a direction perpendicular to the scanning direction of the substrate; and

relatively moving, during the scanning exposure, the image plane and the exposure surface on the basis of the information detected at the selected measuring points.

14. A scanning exposure method according to claim 13, wherein the relative movement includes an inclination adjustment between the image plane and the exposure surface, and a response speed of the inclination adjustment with respect to a scanning direction is different from a response speed of the inclination adjustment with respect to a non-scanning direction, the substrate being moved in the scanning direction during the scanning exposure and the non-scanning direction being perpendicular to the scanning direction.

15. A scanning exposure method according to claim 13, wherein a response speed of the relative movement is determined in accordance with a scanning speed of the substrate.

16. A scanning exposure method according to claim 13, wherein deviations between the image plane and the exposure surface are obtained based on the detected information, and the relative movement between the image plane and the exposure surface is performed in accordance with a maximum value and a minimum value of the obtained deviations.

17. A scanning exposure method according to claim 13, further comprising:

irradiating an irradiation area with an exposure beam; and

inclining, during the scanning exposure, the substrate about a predetermined point as a rotational center within the irradiation area based on the detected information in order to relatively move the image plane and the exposure surface.

18. A scanning exposure method comprising:

sequentially exposing shot areas on a substrate, each of the shot areas being exposed by moving a mask and the substrate synchronously; and

starting to detect information on positional relationship between an image plane of a projection system and an exposure surface of the substrate after completion of an exposure for one shot area, prior to the beginning of an exposure for next shot area.

19. A scanning exposure method according to claim 18, wherein the substrate is moved in a scanning direction to expose the one shot area, and moved in a non-scanning direction perpendicular to the scanning direction after finishing the exposure of the one shot area in order for the exposure of the next shot area, and wherein the detection of the information on the positional relationship is started after completion of the movement of the substrate in the non-scanning direction.