Method of fabricating epidermal abrasion device
First Claim
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1. A method of forming an epidermal abrasion device mold, comprising:
- depositing in succession a first metal and a second metal on an epidermal abrasion device; and
separating said epidermal abrasion device from said mold material to yield a mold.
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Abstract
A method of forming an injection molded epidermal abrasion device includes depositing mold material on an epidermal abrasion device. The epidermal abrasion device is separated from the mold material to yield a mold. An epidermal abrasion device is then formed within the mold. The epidermal abrasion device may include a matrix of isotropically etched structures having isotropically etched sidewalls positioned between wide bases and narrow tips, each isotropically etched structure having a vertical height of at least 20 μm. The matrix of isotropically etched structures may define a matrix of pyramids.
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Citations
14 Claims
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1. A method of forming an epidermal abrasion device mold, comprising:
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depositing in succession a first metal and a second metal on an epidermal abrasion device; and
separating said epidermal abrasion device from said mold material to yield a mold.
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2. A method of forming an epidermal abrasion device mold, comprising:
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depositing a first metal in the form of tungsten on an epidermal abrasion device and a second metal in the form of nickel on said tungsten; and
separating said epidermal abrasion device from said mold material to yield a mold.
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3. A method of forming an epidermal abrasion device mold, comprising:
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depositing mold material on an epidermal abrasion device; and
separating said epidermal abrasion device from said mold material to yield a mold, wherein said separating includes dissolving said epidermal abrasion device.
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4. A method of forming an injection molded epidermal abrasion device, comprising:
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depositing mold material on an epidermal abrasion device;
separating said epidermal abrasion device from said mold material to yield a mold; and
forming an epidermal abrasion device within said mold, wherein the epidermal abrasion device formed within said mold is suitable for abrading a person'"'"'s epidermis to facilitate transdermal drug delivery. - View Dependent Claims (5, 6, 7)
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8. A method of forming an injection molded epidermal abrasion device, comprising:
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depositing in succession a first metal and a second metal on said epidermal abrasion device;
separating said epidermal abrasion device from said mold material to yield a mold; and
forming an epidermal abrasion device within said mold.
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9. A method of forming an injection molded epidermal abrasion device, comprising:
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depositing a first metal in the form of tungsten on said epidermal abrasion device and a second metal in the form of nickel on said tungsten;
separating said epidermal abrasion device from said mold material to yield a mold; and
forming an epidermal abrasion device within said mold. - View Dependent Claims (10, 11)
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12. A method of forming an injection molded epidermal abrasion device, comprising:
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depositing mold material on an epidermal abrasion device;
separating said epidermal abrasion device from said mold material to yield a mold, wherein said separating includes dissolving said epidermal abrasion device; and
forming an epidermal abrasion device within said mold. - View Dependent Claims (13, 14)
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Specification