Surface mounting optoelectronic component and method for producing same

• US 6,610,563 B1
• Filed: 10/05/2000
• Issued: 08/26/2003
• Est. Priority Date: 12/15/1997
• Status: Expired due to Term

• Current Assignee: OSRAM GmbH (Ams-Osram AG), Siemens AG
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Brunner, Herbert, Waitl, Günter, Lutz, Robert
• Primary Examiner(s): Whitehead, Jr., Carl
• Assistant Examiner(s): Schillinger, Laura M
• Application Number:
  US09/581,585
• Time in Patent Office: 1,055 Days
• Field of Search: 438/780, 438/166, 438/161, 438/162, 438/163, 438/164, 438/165, 264/1.9, 264/553, 264/571, 264/272.15, 264/272.17, 264/1.1, 264/1.7, 385/74, 385/93, 385/59, 385/88, 385/129, 385/51, 385/49, 385/12, 385/94, 385/90, 428/30, 428/156, 428/850
• US Class Current: 438/166
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

A method for producing a surface mounting optoelectronic component having comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body with a transparent, curable casting compound, and placing the optical device onto the base body, so whereby the optical device comes into contact with the casting compound.

Claims

1. A method for producing a surface mounting optoelectronic component having a base body, an optoelectronic transmitter/receiver that is arranged in a recess of the base body, and an optical device that covers the recess, said method comprising the steps of:

preparing the base body with the optoelectronic transmitter/receiver arranged in the recess;

filling the recess of the prepared base body with a transparent hardenable casting compound;

then placing the optical device onto the as yet uncured casting compound; and

then curing the casting compound.

2. The method as claimed in claim 1, wherein the step of preparing the base body comprises the steps of:

coating a conductor strip with a thermoplast housing while simultaneously forming the recess of the base body into a top surface of the thermoplast housing, a portion of said conductor strip being situated inside the recess;

mounting the optoelectronic-transmitter/receiver on said portion of the conductor strip situated inside the recess; and

filling the recess of the base body with a transparent curable casting compound having thermal characteristics adapted to the thermoplast housing material.

3. The method as claimed in claim 1, wherein the recess of the base body is filled with the casting compound to a level such that, during the subsequent placement of the optical device, essentially no casting compound runs over an edge of the recess.

4. The method as claimed in claim 3, wherein the recess is filled with casting compound essentially to the edge of the recess such that, after the recess is filled with casting compound, a fillet develops owing to the surface tension of the casting compound;

and wherein the optical device has a shape in a region contacting the casting compound that no casting compound runs over the edge of the recess when the optical device is subsequently placed onto the casting compound.

5. The method as claimed in claim 1, wherein said optical device is placed from above, without pressure, onto one of the base body or at least one seating element attached to said base body within said recess.

6. The method as claimed in claim 1, wherein the casting compound is cured by the influence of heat.

7. The method as claimed in claim 1, further comprising the steps of:

prior to filling the recess, producing an optical device by one of casting, pressing, or injection processing;

then readying and transporting the optical device as bulk material of optical devices;

then automatically picking a respective optical device from the bulk material; and

then automatically positioning the picked optical device over the base body.

8. The method according to claim 1, further comprising:

bringing the optical device in contact with the casting compound in a region of the recess prior to curing the casting compound.

9. The method according to claim 1, wherein the optoelectronic component is configured as a surface-mount technology component.

10. A method for producing a surface mounting optoelectronic component having a base body, an optoelectronic transmitter/receiver that is arranged in a recess of the base body, and an optical device that covers the recess, said method comprising the steps of:

preparing the base body with the optoelectronic transmitter/receiver arranged in the recess;

then filling the recess of the prepared base body with a first transparent hardenable casting compound;

then readying a casting mold half and filling the mold half with a second transparent hardenable casting compound;

then at least partially curing at least one of the first casting compound in the recess of the base body and the second casting compound in the mold half;

then casting the optical device onto the base body by joining the base body and the mold half properly positioned, such that second casting compound in the mold half comes into contact with a surface of the first casting compound in the recess of the base body;

then curing at least one of the second and first casting compound; and

then removing the mold half from the base body with the cast-on optical device.

11. The method as claimed in claim 10, further comprising the steps of:

prior to joining the base body and the mold half, wetting the surface of the first casting compound.

12. The method as claimed in claim 11, wherein the step of wetting the surface of the first casting compound comprises the steps of:

turning the base body about a horizontal axis such that an opening of the recess is directed downwardly; and

at least superficially immersing the base body in liquid casting compound.

13. The method as claimed in claim 10, wherein the at least partial curing of the first casting compound is by heat treatment.

14. The method as claimed in claim 10, wherein the at least partial curing of the second casting compound is by heat treatment.

15. The method as claimed in claim 10, further comprising the steps of:

leading a number of base bodies on a first strip; and

leading a number of mold halves on a second strip,

wherein the first strip and the second strip are led in parallel at least during the step of casting the optical device onto the base body.

16. The method as claimed in claim 10, further comprising the steps of:

leading a number of base bodies on a first strip;

combining a number of mold halves in a group; and

connecting the group of mold halves, such that they can be detached, to a corresponding number of base bodies at least during the step of casting the optical device onto the base body.

17. The method as claimed in claim 10, wherein the base body and the mold half are joined at a temperature of approximately 80°

C.

18. The method as claimed in claim 10, wherein the second casting compound is cured at a temperature of approximately 150°

C.

19. The method as claimed in claim 10, wherein the mold half is removed from the base body at a temperature of approximately 80°

C.