Leadless flip chip carrier design and structure

• US 6,611,055 B1
• Filed: 06/08/2001
• Issued: 08/26/2003
• Est. Priority Date: 11/15/2000
• Status: Active Grant

• Current Assignee: Skyworks Solutions Incorporated
• Original Assignee: Skyworks Solutions Incorporated
• Inventors: Hashemi, Hassan S.
• Primary Examiner(s): Wilson, Allan R.
• Assistant Examiner(s): NGUYEN, JOSEPH H
• Application Number:
  US09/877,912
• Time in Patent Office: 809 Days
• Field of Search: 257/778, 257/779, 257/782, 257/706, 257/707, 257/777, 257/737, 257/738
• US Class Current: 257/706
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05684 Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16237 the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/17519 including bump connectors providing primarily thermal dissipation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/64 Impedance arrangements
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15313 : being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01L 2924/351 : Thermal stress

Abstract

One disclosed embodiment comprises a substrate having a top surface for receiving a semiconductor die with a number of solder bumps on its active surface. The disclosed embodiment further comprises a printed circuit board attached to a bottom surface of the substrate. Another disclosed embodiment comprises at least one via in the substrate. The at least one via provides an electrical and thermal connection between a signal pad of the die and the printed circuit board. The at least one via provides an electrical connection between a substrate signal pad and the printed circuit board. The substrate signal pad is connected to the signal pad of the die by a signal solder bump. The at least one via also provides an electrical connection between the signal pad of the die and a land that is electrically connected to the printed circuit board.

Claims

1. A structure comprising:

a substrate having a top surface for receiving a die having a plurality of solder bumps on an active surface of said die;

a heat spreader situated on a bottom surface of said substrate;

a printed circuit board attached to said bottom surface of said substrate, said heat spreader attached to a top surface of said printed circuit board;

a first via and a second via in said substrate;

said first via providing an electrical connection between a signal pad of said die and said printed circuit board, said second via providing a thermal connection between said die and said heat spreader.

2. The structure of claim 1 wherein said die is a semiconductor die.

3. The structure of claim 1 wherein said substrate comprises organic material.

4. The structure of claim 3 wherein said organic material is selected from the group consisting of polytetrafluoroethylene material and FR4 laminate material.

5. The structure of claim 1 wherein said substrate comprises a ceramic material.

6. The structure of claim 1 wherein said first via provides an electrical connection between a substrate signal pad and said printed circuit board, wherein said substrate signal pad is electrically connected to said signal pad of said die.

7. The structure of claim 6 wherein said first via abuts said substrate signal pad.

8. The structure of claim 6 wherein said substrate signal pad is electrically connected to said signal pad of said die by a signal solder bump.

9. The structure of claim 1 wherein said first via provides an electrical connection between said signal pad of said die and a land, said land being electrically connected to said printed circuit board.

10. The structure of claim 9 wherein said first via abuts said land.

11. The structure of claim 1 wherein said first via provides an electrical connection between a substrate signal pad and a land, wherein said substrate signal pad is electrically connected to said signal pad of said die, and wherein said land is electrically connected to said printed circuit board.

12. The structure of claim 11 wherein said first via abuts said substrate signal pad and said land.

13. The structure of claim 11 wherein said substrate signal pad is electrically connected to said signal pad of said die by a signal solder bump.

14. The structure of claim 12 wherein said substrate signal pad is electrically connected to said signal pad of said die by a signal solder bump.

15. The structure of claim 1 wherein said first via comprises copper.

16. The structure of claim 1 wherein said first via comprises a thermally conductive material.