Diode-laser system for hyperpolarized He-3 and Xe-129 gas generation and other applications

• US 6,611,540 B1
• Filed: 07/29/1999
• Issued: 08/26/2003
• Est. Priority Date: 07/29/1999
• Status: Expired due to Term

• Current Assignee: Otward Maria Mueller
• Original Assignee: Otward Maria Mueller
• Inventors: Mueller, Otward Maria
• Primary Examiner(s): Scott, Jr., Leon
• Application Number:
  US09/363,479
• Time in Patent Office: 1,489 Days
• Field of Search: 372/34, 372/35, 372/36
• US Class Current: 372/35
• CPC Class Codes: A61B 5/0059 using light, e.g. diagnosis by transillumination, diascopy, fluorescence A61B5/0093, A61B5/1455, A61B5/02416 and A61B5/0261 take precedence
• CPC Class Codes: G01R 33/282 Means specially adapted for hyperpolarisation or for hyperpolarised contrast agents, e.g. for the generation of hyperpolarised gases using optical pumping cells, for storing hyperpolarised contrast agents or for the determination of the polarisation of a hyperpolarised contrast agent
• CPC Class Codes: H01S 3/0407 Liquid cooling, e.g. by water
• CPC Class Codes: H01S 3/042 for solid state lasers H01S3/0401 takes precedence
• CPC Class Codes: H01S 3/0941 of a laser diode
• CPC Class Codes: H01S 5/0243 Laser is immersed in the coolant, i.e. the whole laser chip is immersed in the liquid for cooling

Abstract

Commercially available diode lasers are operated immersed in liquid nitrogen (LN2, 77 K), in another cryo-fluid, or are cryo-cooled (77 K-250 K) by conduction in all high-power (>0.1 W) applications. The result is higher output power per diode chip area, higher conversion efficiency, lower cost per watt of laser power, longer lifetime, higher reliability, smaller thermal gradients inside the laser chip and therefore better thermal management due to the higher thermal conductivity of the semiconductor and substrate material. The cryo-diode lasers are driven by cryogenically cooled and integrated power electronics ciruitry using Cryo-MOSFETs or Cryo-CMOS ICs. Applications of the Cryo-Diode Laser/Cryo-Driver assembly include generation of hyperpolarized He-3 or Xe-129 gases for inert gas magnetic resonance imaging of the airways in human beings, metal and materials working and processing with laser tools, “pumping” solid-state lasers and many others. In high-power laser applications, the invention makes use of the “load shedding” capability of liquid nitrogen. The Cryo-Diode Laser/Cryo-Driver assembly can also be supplied with cooling fluid from an LN2 distribution system provided by a HTS cable. MLI is used for energy storage in laser pulse power applications.

Claims

1. A photon emitter comprising:

a semiconductor laser active medium having an enhanced laser output when said laser is operated at a reduced temperature below 300K;

a refrigeration means in a heat transfer relationship with said semiconductor laser medium to maintain said laser at said reduced temperature with enhanced performance, heat produced by said laser operation when said laser is pumped is transferred to said refrigeration means to thereby enhance photon emission.

2. A photon emitter as in claim 1, wherein said enhancement occurs at a cryogenic temperature provided by said refrigeration means.

3. A photon emitter as in claim 1, further comprising a semiconductor driver circuit connected to and in operation driving said laser, said semiconductor driver circuit being cooled to a reduced temperature by said refrigeration means, said semiconductor driver circuit having enhanced performance at said reduced temperature.

4. A photon emitter as in claim 3, further comprising a power supply and a control signal generator connected to and in operation energizing said driver circuit.

5. A photon emitter as in claim 3, further comprising a thermally insulated container enclosing said laser and driver circuit.

6. A photon emitter as in claim 4, further comprising a thermally insulated container enclosing said laser and driver circuit.

7. A photon emitter as in claim 6, further comprising radiation transmission means for receiving in said insulated container radiation output of said laser and delivering said radiation output outside said container.

8. A photon emitter as in claim 7, further comprising radiation transmission means for receiving in said insulated container radiation output of said laser and delivering said radiation output outside said container.

9. A photon emitter as in claim 6, wherein said refrigeration means includes one of a liquid and gaseous refrigerant, said laser and driver circuit respectively being one of submerged for cooling in said refrigerant and mounted for heat exchange on a heat conductor that is cooled by said refrigerant.

10. A photon emitter as in claim 9, wherein said container includes a vapor vent for release of heated refrigerant.

11. A photon emitter as in claim 10, wherein said liquid cryogenic refrigerant is one of nitrogen and helium, and said gaseous refrigerant is one of nitrogen, mixed-gas refrigerants, and gas derived from heated salid material.

12. A photon emitter as in claim 6, wherein said radiation transmission means includes at least one of fiber optic cables, optical wave guides, and light pipes transmitting radiation from said laser.

13. A photon emitter as in claim 6, wherein said semiconductor driver circuit includes at least one of cryo-MOSFETS and cryo-CMOS integrated circuits having enhanced performance at cryogenic temperatures.

14. A photon emitter as in claim 13, wherein said semiconductor driver circuit is integrated with an alternating current to direct current converter, said converter including at least one of cryo-MOSFETS and cryo-CMOS integrated circuits having enhanced performance at cryogenic temperatures.

15. A photon emitter as in claim 14, wherein said semiconductor driver circuit is integrated with an direct current to direct current converter, said converter including at least one of cryo-MOSFETS and cryo-CMOS integrated circuits having enhanced performance at cryogenic temperatures.

16. A photon emitter as in claim 4, wherein said driver circuit includes integrated circuits, said integrated circuits being mounted on a heat conductor for efficient removal of heat from said integrated circuits by said refrigeration means.

17. A photon emitter as in claim 4, wherein said semiconductor driver circuit includes at least one of cryo-MOSFETS and cryo-CMOS integrated circuits having enhanced performance at cryogenic temperatures.

18. A photon emitter as in claim 18, wherein said semiconductor driver circuit is integrated with a power converter, said converter including at least one of cryo-MOSFETS and cryo-CMOS integrated circuits, said converter integrated circuits providing one of alternating current to direct current conversion and direct current to direct current conversion, and having enhanced performance at cryogenic temperatures.