Integrated circuit inductors

• US 6,612,019 B2
• Filed: 05/31/2001
• Issued: 09/02/2003
• Est. Priority Date: 07/09/1999
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Ahn, Kie Y., Forbes, Leonard
• Primary Examiner(s): Nguyen, Viet Q.
• Application Number:
  US09/871,454
• Publication Number:
  US 20010023530A1
• Time in Patent Office: 824 Days
• Field of Search: 296/04, 296/05, 296/06, 296/07, 257/528, 257/531, 257/541
• US Class Current: 29/604
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 37/00 Fixed inductances not covered by group H01F17/00
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: Y10S 257/924 with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49037 Using reference point/surface to facilitate measuring
• CPC Class Codes: Y10T 29/49069 Data storage inductor or core
• CPC Class Codes: Y10T 29/49071 by winding or coiling
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49075 including permanent magnet or core

Abstract

The invention relates to an inductor comprising a plurality of interconnected conductive segments interwoven with a substrate. The inductance of the inductor is increased through the use of coatings and films of ferromagnetic materials such as magnetic metals, alloys, and oxides. The inductor is compatible with integrated circuit manufacturing techniques and eliminates the need in many systems and circuits for large off chip inductors. A sense and measurement coil, which is fabricated on the same substrate as the inductor, provides the capability to measure the magnetic field or flux produced by the inductor. This on chip measurement capability supplies information that permits circuit engineers to design and fabricate on chip inductors to very tight tolerances.

Claims

1. An inductor comprising:

a perforated substrate; and

a triangular coil having an inductance of at least 0.3 nanohenrys interlaced with the perforated substrate.

2. The inductor of claim 1, wherein the perforated substrate is silicon carbide.

3. The inductor of claim 1, further comprising:

at least one test lead attached to the coil.

4. The inductor of claim 3, wherein the pair of test lead is capable of being decoupled from the coil using a laser.

5. An inductor comprising:

a perforated substrate;

a triangular coil interlaced with the perforated substrate; and

a test lead attached to the triangular coil.

6. The inductor of claim 5, wherein the perforated substrate comprises gallium arsenide.

7. The inductor of claim 6, wherein the test lead comprises a laser detachable test lead.

8. An inductor comprising:

a perforated substrate;

a rectangular coil interlaced with the perforated substrate; and

a pair of test leads attached to the rectangular coil.

9. The inductor of claim 8, wherein the perforated substrate comprises germanium.

10. The inductor of claim 9, wherein the pair of test leads comprise a pair of laser detachable test leads.

11. An inductor comprising:

a perforated silicon carbide substrate;

a circular coil interlaced with the perforated silicon carbide substrate; and

at least one test lead attached to the circular coil.

12. The inductor of claim 11, wherein the circular coil comprises gold.

13. The inductor of claim 11, wherein the circular coil comprises copper diffused into the silicon carbide substrate.

14. An inductor comprising:

a perforated silicon carbide substrate;

a circular coil interlaced with the perforated silicon carbide substrate; and

a test lead attached to the circular coil.

15. The inductor of claim 14, wherein the circular coil comprises aluminum.

16. The inductor of claim 15, wherein the test lead comprises a laser detachable test lead.

17. An inductor comprising:

a perforated substrate;

a circular coil interlaced with the perforated substrate; and

a test lead attached to the circular coil.

18. The inductor of claim 17, wherein the perforated substrate comprises silicon.

19. The inductor of claim 18, wherein the test lead comprises a laser detachable test lead.

20. An inductor comprising:

a perforated germanium substrate including a plurality of perforations;

a rectangular coil laced through the plurality of perforations; and

a pair of test leads attached to the rectangular coil.

21. The inductor of claim 20, wherein each of the plurality of perforations has a rectangular shape.

22. The inductor of claim 21, wherein the rectangular coil has an inductance of more than about 0.3 nanohenrys.

23. The inductor of claim 21, wherein, the pair of test leads comprises a pair of laser detachable test leads.

24. The inductor of claim 20, wherein each of the plurality of perforations has a substantially circular shape.