Sensor usable in ultra pure and highly corrosive environments

• US 6,612,175 B1
• Filed: 07/20/2000
• Issued: 09/02/2003
• Est. Priority Date: 07/20/2000
• Status: Expired due to Term

• Current Assignee: Entegris Incorporated
• Original Assignee: NT International, Inc. (Entegris Incorporated)
• Inventors: Diaz, Jorge Andrés Diaz, Peterson, Tom, Cucci, Gerald R.
• Primary Examiner(s): Lefkowitz, Edward
• Assistant Examiner(s): JENKINS, JERMAINE L
• Application Number:
  US09/620,007
• Time in Patent Office: 1,139 Days
• Field of Search: 737/08, 735/79, 737/20, 737/15, 737/23, 737/25, 737/21, 737/18, 735/143.2, 735/143.6, 735/141.6, 737/24, 374/118, 361/283.1, 361/283.4
• US Class Current: 73/708
• CPC Class Codes: G01L 19/04 Means for compensating for effects of changes of temperature , i.e. other than electric compensation
• CPC Class Codes: G01L 19/0681 Protection against excessive heat
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/0054 integral with a semiconducting diaphragm

Abstract

A sensor operable at temperatures in excess of 400° C. is described. The sensor of the present invention operates without fluid fill, is non-porous, non-contaminating, and has no exterior exposed metallic components. The sensor includes a non-porous, impermeable sensing diaphragm that may be positioned in direct contact with fluids in an ultra-pure environment. The non-porous surface may be comprised of a layer of single crystal sapphire that is glassed to a backing plate. The sensor of the present invention is suitable for use in a chemically inert pressure transducer module for sensing pressures and/or temperatures in process fluids and may be molded directly into the high temperature plastic housing of the pressure transducer module.

Claims

1. A sensor having a non-porous outer surface, said sensor comprising:

a backing plate having an inner and outer surface;

a non-porous diaphragm having an inner and outer surface, wherein the diaphragm is comprised of a material adapted to be chemically inert and non-contaminating when exposed to an ultra pure chemical process;

a sensing element disposed over the inner surface of the diaphragm; and

glass layer that is bonded by glassing to the inner surface of the backing plate and the inner surface of said non-porous diaphragm proximate an outside periphery thereof, thereby bonding said backing plate and said non-porous diaphragm and enclosing said sensing element within said backing plate, wherein at least one of pressure and temperature near said non-porous diaphragm is detectable by said sensing element, wherein said glass layer has both a high bond strength and a high melt temperature that is at or above 700°

C.

2. The sensor as recited in claim 1, said glass layer having a thickness dimension, wherein when the non-porous diaphragm flexes to a desired maximum flexure, a portion of the inner surface of the diaphragm engages an inner surface of the backing plate.

3. The sensor as recited in claim 2, wherein the backing plate and non-porous diaphragm are constructed of materials having similar thermal expansion rates.

4. The sensor as recited in claim 1, wherein the backing plate and non-porous diaphragm are constructed of materials having similar thermal expansion rates.

5. The sensor as recited in claim 1, wherein the backing plate and non-porous diaphragm are constructed of materials having similar thermal expansion rates.

6. The sensor as recited in claim 1, wherein said backing plate includes apertures extending therethrough, said apertures being adapted for receiving electrical leads coupled to said sensing element.

7. The sensor as recited in claim 6, further including a silicon layer positioned between the non-porous diaphragm and the backing plate, wherein said sensing element is formed thereon.

8. The sensor as recited in claim 7, further including bond pads between said glass layer and said non-porous diaphragm.

9. The sensor as recited in claim 8, further including windows formed in said glass layer providing access to said bond pads.

10. The sensor as recited in claim 9, therein said electrical leads are brazed to said bond pads.

11. The sensor as recited in claim 9, wherein the silicon layer does not extend into the window formed in said glass layer.

12. The sensor as recited in claim 1, wherein said sensing element detects an absolute pressure.

13. The sensor as recited in claim 1, wherein said sensing element detects an absolute pressure.

14. The sensor as recited in claim 1, further including an aperture extending through said backing plate to allow detection of gauge pressure.

15. The sensor as recited in claim 1, further including an aperture extending through said backing plate to allow detection of gauge pressure.

16. The sensor as recited in claim 1, further including an epitaxially deposited silicon layer on a sapphire diaphragm between the backing plate and the diaphragm, wherein said sensing element is formed thereon.

17. The sensor as recited in claim 16, wherein said sensing element includes a piezoresistive sensing element.

18. The sensor as recited in claim 16, further including a chemically resistant layer positioned between the silicon layer and the backing plate, wherein said chemically resistant layer acts as an electrical insulator.

19. The sensor as recited in claim 16, further including bond pads between said glass layer and said non-porous diaphragm.

20. The sensor as recited in claim 19, further including windows formed in said glass layer providing access to said bond pads.

21. The sensor as recited in claim 19, wherein said bond pads comprise a titanium layer and a diffusion barrier.

22. The sensor as recited in claim 1, wherein said sensing element includes a piezoresistive sensing element.

23. The sensor as recited in claim 1, further including a metalization layer between the non-porous diaphragm and the backing plate to block EMI/RFI from affecting the sensing element.

24. The sensor as recited in claim 1, further including a chemically resistant polymer adjacent to at least a portion of an outer edge of said non-porous diaphragm and said backing plate.

25. The sensor as recited in claim 1, wherein the non-porous diaphragm is comprised of a material selected from the group consisting of sapphire and diamond.

26. The sensor as recited in claim 1, wherein said sensing element includes a capacitive sensing element.

27. The sensor as recited in claim 1, further comprising:

electrical leads coupled to the sensing element that extend through the backing plate;

bond pads disposed between said glass layer and said non-porous diaphragm; and

windows formed in said glass layer providing access to said bond pads, wherein said electrical leads are brazed to said bond pads.

28. The sensor as recited in claim 1, further comprising a primary seal member disposed on a periphery of the surface of the diaphragm.

29. The sensor as recited in claim 28, wherein the primary seal member is L-shaped so as to extend along from the periphery of the diaphragm surface to the side of the sensor.

30. The sensor as recited in claim 28, further comprising a secondary seal member disposed along the side of the backing plate and spaced from the primary seal member.

31. The sensor as recited in claim 1, wherein the surface of the non-porous diaphragm is coated with a material selected from the group consisting of epoxy, PTFE, PVDF, Paralyne, PEEK, and urethane, wherein the coating is applied to at least a portion of an outer edge of said non-porous diaphragm and said backing plate.

32. A sensor having a non-porous outer surface, said sensor comprising:

a backing plate having an inner and outer surface;

a non-porous diaphragm having an inner and outer surface;

means for sensing at least one of temperature and pressure, said sensing means disposed over the inner surface of the diaphragm; and

a glass layer, selected from a glass material having a melt temperature above 700°

C., that is bonded by glassing to the inner surface of the backing plate and the inner surface of said non-porous diaphragm proximate an outside periphery thereof, thereby bonding said backing plate and said non-porous diaphragm, said glass layer having thickness dimension, wherein when the non-porous diaphragm flexes to a desired maximum flexure, a ported of the inner surface of the diaphragm engages an inner surface of the backing plate, wherein at least one of temperature and pressure near said non-porous diaphragm is detectable by said sensing means.

33. The sensor as recited in claim 32, wherein said glass layer includes a borosilicate glass material.

34. The sensor as recited in claim 33, further including an aperture extending through said backing plate to allow detection of gauge pressure.

35. The sensor as recited in claim 33, wherein said sensing means detects an absolute pressure.

36. The sensor as recited in claim 32, wherein the backing plate and non-porous diaphragm are constructed of materials having similar thermal expansion rates.

37. The sensor as recited in claim 32, wherein the backing plate and non-porous diaphragm are constructed of materials having similar thermal expansion rates.

38. The sensor as recited in claim 32, wherein said backing plate includes apertures extending therethrough, said apertures being adapted for receiving electrical leads coupled to said sensing means.

39. The sensor as recited in claim 38, further including a silicon layer positioned between the non-porous diaphragm and the backing plate, wherein said sensing means is formed thereon.

40. The sensor as recited in claim 39, further including bond pads between said glass layer and said non-porous diaphragm.

41. The sensor as recited in claim 40, further including windows formed in said glass layer providing access to said bond pads.

42. The sensor as recited in claim 41, wherein said electrical leads are brazed to said bond pads.

43. The sensor as recited in claim 41, wherein the silicon layer does not extend into the window formed in said glass layer.

44. The sensor as recited in claim 32, wherein said sensing means detects an absolute pressure.

45. The sensor as recited in claim 32, further including an aperture extending through said backing plate to allow detection of gauge pressure.

46. The sensor as recited in claim 32, further including a silicon layer positioned between the non-porous diaphragm and the backing plate, wherein said sensing means is formed thereon.

47. The sensor as recited in claim 46, wherein said sensing means includes a piezoresistive sensing element.

48. The sensor as recited in claim 46, further including a silicon nitride layer positioned between the silicon layer and the backing plate, said silicon nitride layer acts as an electrical insulator.

49. The sensor as recited in claim 46, further including bond pads between said glass layer and said non-porous diaphragm.

50. The sensor as recited in claim 49, further including windows formed in said glass layer providing access to said bond pads.

51. The sensor as recited in claim 49, wherein said bond pads comprise a titanium layer and a diffusion barrier.

52. The sensor as recited in claim 32, wherein said sensing means includes a piezoresistive sensing element.

53. The sensor as recited in claim 32, further including a metalization layer between the non-porous diaphragm and the backing plate to block EMI/RFI from affecting the sensing means.

54. The sensor as recited in claim 32, further including a coating selected from the group consisting of epoxy, PTFE, PVDF, Paralyne, PEEK, and urethane, wherein the coating is applied to at least a portion of an outer edge of said non-porous diaphragm and said backing plate.

55. The sensor as recited in claim 54, wherein the coating is applied to the entire surface of the diaphragm.

56. The sensor as recited in claim 32, wherein the non-porous diaphragm is comprised of a material selected from the group consisting of sapphire and diamond.

57. The sensor as recited in claim 32, said sensing means includes a capacitive sensing element.

58. A pressure sensor having a non-porous outer surface, said pressure sensor comprising:

a backing plate having an inner and outer surface and including apertures extending therethrough, said apertures being adapted for receiving electrical leads therethrough;

a non-porous diaphragm having an inner and outer surface;

a sensing element disposed over the inner surface of the diaphragm, said electrical leads coupled to said sensing element;

a metallization layer between the non-porous diaphragm and the backing plate, wherein said metallization layer blocks EMI(RFI from affecting the sensing element; and

a glass layer disposed between the inner surface of the backing plate and the inner surface of said non-porous diaphragm proximate an outside periphery thereof, thereby joining said backing plate and said non-porous diaphragm, wherein a pressure near said non-porous diaphragm is detectable by said sensing element.

59. The pressure sensor as recited in claim 58, wherein the non-porous diaphragm is comprised of a chemically inert material.

60. The pressure sensor as recited in claim 59, wherein said glass layer includes a borosilicate glass material.

61. The pressure sensor as recited in claim 59, wherein the backing plate and non-porous diaphragm are constructed of materials having similar thermal expansion rates.

62. The pressure sensor as recited in claim 59, wherein said sensing element detects an absolute pressure.

63. The pressure sensor as recited in claim 59, further including an aperture extending through said backing plate to allow detection of gauge pressure.

64. The pressure sensor as recited in claim 58, said glass layer having a thickness dimension, wherein when the non-porous diaphragm flexes to a desired maximum flexure, a portion of the inner surface of the diaphragm engages an inner surface of the backing plate.

65. The pressure sensor as recited in claim 64, wherein the backing plate and non-porous diaphragm are constructed of materials having similar thermal expansion rates.

66. The pressure sensor as recited in claim 58, wherein the backing plate and non-porous diaphragm are constructed of materials having similar thermal expansion rates.

67. The pressure sensor as recited in claim 58, wherein said sensing element detects an absolute pressure.

68. The pressure sensor as recited in claim 58, further including an aperture extending through said backing plate to allow detection of gauge pressure.

69. The pressure sensor as recited in claim 58, further including a silicon layer positioned between the non-porous diaphragm and the backing plate, wherein said sensing element is formed thereon.

70. The pressure sensor as recited in claim 69, wherein said sensing element includes a piezoresistive sensing element.

71. The pressure sensor as recited in claim 69, wherein said metalization layer is comprised of a metal selected from the group consisting of niobium, tungsten, iridium, molybdenum, tantalum, platinum, and palladium.

72. The pressure sensor as recited in claim 69, further including bond pads between said glass layer and said non-porous diaphragm.

73. The pressure sensor as recited in claim 72, further including windows formed in said glass layer providing access to said bond pads.

74. The pressure sensor as recited in claim 73, wherein said electrical leads arc brazed to said bond pads.

75. The pressure sensor as recited in claim 73, wherein the silicon layer does not extend into the window formed in said glass layer.

76. The pressure sensor as recited in claim 72, wherein said bond pads comprise a titanium layer and a diffusion barrier.

77. The pressure sensor as recited in claim 58, wherein said sensing element includes a piezoresistive sensing element.

78. The pressure sensor as recited in claim 58 further including an epoxy applied to at least a portion of an outer edge of said non-porous diaphragm and said backing plate.

79. The pressure sensor as recited in claim 58, wherein the non-porous diaphragm is comprised of sapphire.

80. The pressure sensor as recited in claim 58, wherein said sensing element includes a capacitive sensing element.

81. The pressure sensor as recited in claim 58, wherein said glass layer is selected from a glass having a melt temperature above 700°

C.

82. The sensor as recited in claim 58, wherein the surface of the non-porous diaphragm is coated with a material selected from the group consisting of epoxy, PTFE, PVDF, Paralyne, PEEK, and urethane, wherein the coating is applied to at least a portion of an outer edge of said non-porous diaphragm and said backing plate.

83. A pressure sensor having a non-porous outer surface, said pressure sensor comprising:

a backing plate having an inner and outer surface;

a non-porous diaphragm having an inner and outer surface;

a sensing element disposed over the inner surface of the diaphragm;

a silicon layer positioned between said non-porous diaphragm and the backing plate, wherein said sensing element is formed thereon;

a metalization layer between the silicon layer and the backing plate, wherein said metallization layer blocks affects of EMI/RFI on the sensing element; and

a glass layer disposed between the inner surface of the backing plate and the inner surface of said non-porous diaphragm, wherein a pressure near said non-porous diaphragm is detectable by said sensing element.

84. The pressure sensor as recited in claim 83, wherein the non-porous diaphragm is comprised of a chemically inert material.

85. The pressure sensor as recited in claim 84, wherein said glass layer includes a borosilicate glass material.

86. The pressure sensor as recited in claim 84, wherein the backing plate and non-porous diaphragm are constructed of materials having similar thermal expansion rates.

87. The pressure sensor as recited in claim 84, wherein said sensing element detects an absolute pressure.

88. The pressure sensor as recited in claim 84, further including an aperture extending through said backing plate to allow detection of gauge pressure.

89. The pressure sensor as recited in claim 83, said glass layer having a thickness dimension, wherein when the non-porous diaphragm flexes to a desired maximum flexure a portion of the inner surface of the diaphragm engages an inner surface of the backing plate.

90. The pressure sensor as recited in claim 87, wherein the backing plate and non-porous diaphragm are constructed of materials having similar thermal expansion rates.

91. The pressure sensor as recited in claim 87, rein the backing plate and non-porous diaphragm are constructed of materials having similar thermal expansion rates.

92. The pressure sensor as recited in claim 83, wherein said backing plate includes apertures extending therethrough, said apertures being adapted for receiving electrical leads coupled to said sensing element.

93. The pressure sensor as recited in claim 83, wherein said sensing element detects an absolute pressure.

94. The pressure sensor as recited in claim 83, further including an aperture extending through said backing plate to allow detection of gauge pressure.

95. The pressure sensor as recited in claim 83, wherein said sensing element includes a piezoresistive sensing element.

96. The pressure sensor as recited in claim 83, wherein said metalization layer is comprised of a metal selected from the group consisting of niobium, tungsten, iridium, molybdenum, tantalum, platinum, and palladium.

97. The pressure sensor as recited in claim 83, further including bond pads between said glass layer and said non-porous diaphragm.

98. The pressure sensor as recited in claim 97, further including windows formed in said glass layer providing access to said bond pads.

99. The pressure sensor as recited in claim 98, further including bond pads between said glass layer and said non-porous diaphragm.

100. The pressure sensor as recited in claim 98, wherein said electrical leads are brazed to said bond pads.

101. The pressure sensor as recited in claim 98, wherein the silicon layer does not extend into the window formed in said glass layer.

102. The pressure sensor as recited in claim 97, wherein said bond pads comprise a titanium layer and a diffusion barrier.

103. The pressure sensor as recited in claim 83, further including an epoxy applied to at least a portion of an outer edge of said non-porous diaphragm and said backing plate.

104. The pressure sensor as recited in claim 83, wherein the non-porous diaphragm is comprised of a material selected from the group consisting of sapphire and diamond.

105. The pressure sensor as recited in claim 83, wherein said sensing element includes a capacitive sensing element.

106. The pressure sensor as recited in claim 83, wherein said glass layer is selected from a glass having a melt temperature above 700°

C.

107. A sensor having a non-porous outer surface, said sensor comprising:

a backing plate having an inner and outer surface;

a non-porous diaphragm having an inner and outer surface, wherein the diaphragm is comprised of a material adapted to be chemically inert and non-contaminating when exposed to an ultra pure chemical process;

a conductive layer formed on at least a portion of the inner surface of the diaphragm; and

a glass layer that is bonded by glassing to the inner surface of the backing plate and the inner surface of said non-porous diaphragm proximate an outside periphery thereof, thereby bonding said backing plate and said non-porous diaphragm and enclosing said conductive layer within said backing plate, wherein said glass layer has both a high bond strength and high melt temperature at or above 700°

C.

108. The sensor as recited in claim 107, wherein the backing plate and non-porous diaphragm are constructed of materials having similar thermal expansion rates.

109. The sensor as recited in claim 107, wherein said backing plate includes apertures extending therethrough, said apertures being adapted for receiving electrical leads coupled to said conductive layer.

110. The sensor as recited in claim 109, further including bond pads between said glass layer and said non-porous diaphragm.

111. The sensor as recited in claim 110, further including windows formed in said glass layer providing access to said bond pads.

112. The sensor as recited in claim 111, wherein said electrical leads are brazed to said bond pads.

113. The sensor as recited in claim 112, wherein said conductive layer does not extend into said windows.

114. The sensor as recited in claim 110, wherein said bond pads comprise a titanium layer and a diffusion barrier.

115. The sensor as recited in claim 107, further including an aperture extending through said backing plate to allow detection of gauge pressure.

116. The sensor as recited in claim 107, wherein said conductive layer is comprised of silicon.

117. The sensor as recited in claim 107, wherein said sensor includes a piezoresistive sensing element.

118. The sensor as recited in claim 107, wherein said sensor includes a capacitive sensing element.

119. The sensor as recited in claim 107, further including a silicon nitride layer positioned between the conductive layer and the backing plate, said silicon nitride layer acts as an electrical insulator.

120. The sensor as recited in claim 107, further including a metalization layer between the non-porous diaphragm and the backing plate to block EMI/RFI from affecting the sensor.

121. The sensor as recited in claim 107, further including a chemically resistant polymer selected from the group consisting of an epoxy, elastomeric seal, gasket seal, PTFE, PDVF, Paralyne, PEEK, and urethane, wherein the chemically resistant polymer is adjacent to at least a portion of an outer edge of said non-porous diaphragm and said backing plate.

122. The sensor as recited in claim 107, wherein the non-porous diaphragm is comprised of a material selected from the group consisting of sapphire and diamond.

123. The sensor as recited in claim 122, wherein said conductive layer forms a Wheatstone bridge.

124. The sensor as recited in claim 123, wherein sensing elements of the Wheatstone bridge are oriented relative to a projected C-axis of the sapphire diaphragm.

125. The sensor as recited in claim 107, wherein a sensing region of said non-porous diaphragm has a reduced thickness.

126. The sensor as recited in claim 107, wherein said non-porous diaphragm includes an annular groove formed therein.

127. The sensor as recited in claim 107, wherein a thickness dimension of said non-porous diaphragm is dependent upon a diameter of said diaphragm.

128. The sensor as recited in claim 107, wherein a thickness dimension of said non-porous diaphragm is dependent upon a distance between the inner surface of said diaphragm and the inner surface of said backing plate.

129. A method of forming a sensor having a non-porous outer surface, the method comprising:

providing a non-porous diaphragm having an inner and an outer surface, wherein the diaphragm is selected from the group consisting of sapphire and diamond;

forming a sensing element over the inner surface of the non-porous diaphragm;

positioning a backing plate having an inner and an outer surface over at least a portion of the inner surface of the diaphragm and over the sensing element; and

using a glass material layer to bond the inner surface of the backing plate to the inner surface of the diaphragm proximate to an outside periphery of the diaphragm so as to enclose the sensing element, wherein the glass material layer has both a high bond strength and a high melt temperature that is at or above 700°

C.

130. The method of claim 129, further comprising the step of bonding the sensing element to an electrical lead via a multiple layer bond pad disposed on the inner surface of the diaphragm.

131. The method of claim 130, further comprising the step of forming an aperture in the backing plate to access the electrical lead.

132. The method of claim 131, further comprising the step of brazing the electrical lead to the bond pad.

133. The method of claim 130, further comprising the step of forming the sensor within a housing and positioning the sensor to expose at least a portion of the outer surface of the diaphragm through a window in the housing.

134. The method of claim 129, further comprising the step of forming a metallization layer between the diaphragm and the backing plate, wherein the metallization layer is adapted to block EMI/RFI from the sensing element.

135. The method of claim 129, further comprising the step of forming a chemically resistant polymer over at least a portion of an outer edge of the diaphragm and a portion of the outer surface of the backing plate.

136. The method of claim 135, further comprising:

forming the polymer with carbon powder to form a conductive polymer; and

depositing a conductive ink layer on the backing plate that is electrically connected to the conductive epoxy.

137. The method of claim 129, wherein the step of providing the diaphragm includes forming the diaphragm with a sensing region having a reduced thickness.

138. The method of claim 129, further comprising the step of forming a bond pad between the glass layer and the diaphragm.

139. The method of claim 138, further comprising the step of forming windows in the glass layer to provide an electrical lead access to the bond pad.

140. The method of claim 139, further comprising the step of forming a silicon layer between the diaphragm and the backing plate and under the sensing element.

141. The method of claim 129, wherein the step of positioning the backing plate includes forming the backing plate as a single member.

143. The method of claim 129, wherein the step of providing the diaphragm includes forming the diaphragm with a thickness as a function of a diameter of the diaphragm.

144. The method of claim 129, further comprising the step of forming a groove in the outer surface of the diaphragm adjacent a glass bond and between the diaphragm and the backing plate.

145. The sensor as recited in claim 129, further comprising the step of coating the surface of the diaphragm with a material selected from the group consisting of epoxy, PTFE, PVDF, Paralyne, PEEK, and urethane, wherein the coating is applied to at least a portion of an outer edge of said non-porous diaphragm and said backing plate.

142. The method of claim 142, further comprising the step of forming a Wheatstone bridge from the conductive layer.

146. A method of forming a sensor having a non-porous outer surface, the method comprising:

providing a non-porous diaphragm having an inner and an outer surface, wherein the diaphragm is selected from the group consisting of sapphire and diamond;

forming a conductive layer on at least a portion of the inner surface of the diaphragm;

positioning a backing plate having an inner and an outer surface over the inner surface of the diaphragm and over the conductive layer; and

using a glass material to bond the inner surface of the backing plate to the inner surface of the diaphragm proximate to an outside periphery of the diaphragm, wherein the glass material layer has both a high bond strength and a high melt temperature that is at or above 700°

C.

147. A temperature sensor having a non-porous outer surface, said temperature sensor comprising

a backing plate having an inner and outer surface;

a non-porous, chemically inert diaphragm having an inner and outer surface, the chemically inert diaphragm selected from a group of materials consisting of sapphire and diamond;

a sensing element disposed over the inner surface of the diaphragm; and

a glass layer that is bonded by glassing to the inner surface of the backing plate and the inner surface of said non-porous diaphragm proximate an outside periphery thereof, thereby bonding said backing plate and said non-porous diaphragm and enclosing said sensing element within said backing plate, the sensing element detecting a temperature change of said non-porous diaphragm as a function of the thickness and conductivity of the chemically inert materials of the diaphragm, wherein the glass layer has both a high bond strength and a high melt temperature that is at or above 700°

C.

148. A pressure transducer module having therein a sensor with a non-porous outer surface, said the module comprising:

a pressure and temperature sensor that includes;

a backing plate having an inner and outer surface;

a non-porous, chemically inert diaphragm having an inner and outer surface, the chemically inert diaphragm comprised of a material selected from a group consisting of sapphire and diamond;

a sensing element disposed over the inner surface of the diaphragm;

a glass layer that is bonded by glassing to the inner surface of the backing plate and the inner surface of said non-porous diaphragm proximate an outside periphery thereof, thereby bonding said backing plate and said non-porous diaphragm and enclosing said sensing element within said backing plate, wherein at least one of pressure and temperature near said non-porous diaphragm is detectable by said sensing element, and wherein the glass layer has both a high bond strength and a high melt temperature that is at or above 700°

C.; and

a chemically inert housing adapted to seal the sensor and expose a portion of the diaphragm surface.

149. The transducer as recited in claim 148, wherein the sensor further comprises a primary seal member disposed on a periphery of the surface of the diaphragm and a secondary seal member disposed along the side of the backing plate and spaced from the primary seal member, the primary and secondary seal members adapted to be in contact with the housing and disposed on either side of a vent in the housing, the vent extending from the outside of the housing to between the seal members and adapted to facilitate the passage of fluids and relieve any pressure between the seal members.

150. A sensor having a non-porous outer surface, said sensor comprising:

a backing plate having an inner and outer surface;

a sapphire diaphragm having an inner and outer surface, wherein the outer surface includes a coating, the coating being selected from the group consisting of epoxy, PTFE, PVDF, Paralyne, PEEK, and urethane;

a sensing element disposed over the inner surface of the diaphragm;

a glass layer that is bonded by glassing to the inner surface of the backing plate and the inner surface of said sapphire diaphragm proximate an outside periphery thereof, thereby bonding said backing plate and said diaphragm and enclosing said sensing element within said backing plate, wherein at least one of pressure near said diaphragm is detectable by said sensing element, wherein said glass layer has both a high bond strength and a high melt temperature that is at or above 700°

C.