Method for making a light-emitting panel

• US 6,612,889 B1
• Filed: 10/27/2000
• Issued: 09/02/2003
• Est. Priority Date: 10/27/2000
• Status: Expired due to Term

• Current Assignee: Leidos, Inc. (Leidos Holdings, Inc.)
• Original Assignee: Science Applications International Corporation
• Inventors: Johnson, Roger Laverne, Green, Albert Myron, George, Edward Victor, Drobot, Adam Thomas, Wyeth, Newell Convers
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US09/697,344
• Time in Patent Office: 1,040 Days
• Field of Search: 445/24
• US Class Current: 445/24
• CPC Class Codes: A61L 2/10 Ultraviolet radiation
• CPC Class Codes: A61L 9/20 Ultraviolet radiation
• CPC Class Codes: G02B 6/0033 Means for improving the coupling-out of light from the light guide
• CPC Class Codes: G02B 6/0036 2-D arrangement of prisms, protrusions, indentations or roughened surfaces
• CPC Class Codes: G02B 6/0065 Manufacturing aspects; Material aspects
• CPC Class Codes: H01J 11/18 containing a plurality of independent closed structures for containing the gas, e.g. plasma tube array [PTA] display panels
• CPC Class Codes: H01J 17/16 Vessels; Containers
• CPC Class Codes: H01J 17/49 Display panels, e.g. with crossed electrodes , e.g. making use of direct current display panels making use of alternating current H01J11/00
• CPC Class Codes: H01J 2217/49285 Associated optical means
• CPC Class Codes: H01J 61/305 Flat vessels or containers
• CPC Class Codes: H01J 65/046 the field being produced by using capacitive means around the vessel
• CPC Class Codes: H01J 9/185 of flat panel display devices, e.g. by using spacers
• CPC Class Codes: H01J 9/241 the vessel being for a flat panel display H01J9/261 takes precedence; flat discharge lamps H01J9/248

Abstract

An improved light-emitting panel having a plurality of micro-components sandwiched between two substrates is disclosed. Each micro-component contains a gas or gas-mixture capable of ionization when a sufficiently large voltage is supplied across the micro-component via at least two electrodes. An improved method of manufacturing a light-emitting panel is also disclosed, which uses a web fabrication process to manufacturing light-emitting displays as part of a high-speed, continuous inline process.

Claims

1. A web fabrication process for manufacturing a plurality of light-emitting panels, the process comprising the steps of:

providing a first substrate;

disposing a plurality of micro-components on the first substrate;

disposing a second substrate over the first substrate such that the plurality of micro components are sandwiched between the first substrate and the second substrate; and

dicing the first substrate and the second substrate to form individual light-emitting panels.

2. The process of claim 1, wherein the first substrate, the second substrate or the first substrate and the second substrate are provided as rolls of material.

3. The process of claim 1, wherein the first substrate comprises a plurality of sockets.

4. The process of claim 1, further comprising the step of disposing at least two electrodes on the first substrate, the second substrate, or at least one electrode on each of the first substrate and the second substrate.

5. The process of claim 4, wherein each light-emitting panel comprises the at least two electrodes, wherein the at least two electrodes are adhered to only the first substrate, only the second substrate, or at least one electrode is adhered to each of the first substrate and the second substrate, and wherein the at least two electrodes are arranged so that voltage supplied to the at least two electrodes causes one or more micro-components to emit radiation.

6. The process of claim 4, wherein each light-emitting panel comprises the at least two electrodes and wherein the two electrodes are arranged so that voltage supplied to the at least two electrodes causes one or more micro-components to emit radiation throughout the field of view of the individual light-emitting panel without crossing the at least two electrodes.

7. The process of claim 1, further comprising the steps of forming a plurality of sockets in the first substrate and wherein the step of disposing a plurality of micro-components on the first substrate further comprises at least partially disposing at least one micro-component of the plurality of micro-components in each socket of the plurality of sockets.

8. The process of claim 7, wherein the first substrate comprises a plurality of material layers and wherein the step of forming a plurality of sockets in the first substrate comprises the steps of selectively removing a plurality of portions of the material layers to form a plurality of cavities.

9. The process of claim 7, wherein the step of forming a plurality of sockets in the first substrate comprises the steps of patterning the first substrate with a plurality of cavities.

10. The process of claim 9, further comprising the steps of disposing at least one material layer on the first substrate so that the at least one material layer conforms to the shape of each socket of the plurality of sockets and disposing at least one electrode between the first substrate and the at least one material layer.

11. The process of claim 9, further comprising the steps of disposing a plurality of material layers on the first substrate so that the plurality of material layers conform to the shape of each socket of the plurality of sockets and disposing at least one electrode within the plurality of material layers.

12. The process of claim 7, wherein the step of providing a first substrate comprises the step of forming a first substrate by disposing a plurality of material layers and wherein the step of forming a plurality of sockets in the first substrate further comprises the step of selectively removing a plurality of portions of the material layers to form a plurality of cavities.

13. The process of claim 12, further comprising the step of disposing at least one electrode on the first substrate, the second substrate, or the first substrate and the second substrate.

14. The process of claim 13, wherein the at least one electrode is sandwiched between two material layers of the plurality of material layers.

15. The process of claim 1, further comprising the step of disposing at least one enhancement material in, or proximate to, each socket.

16. The process of claim 15, wherein the at least on enhancement material is selected from a group consisting of transistors, integrated-circuits, semiconductor devices, inductors, capacitors, resistors, control electronics, drive electronics, diodes, pulse-forming networks, pulse compressors, pulse transformers, and tuned-circuits.

17. The process of claim 16, wherein the step of disposing the at least one enhancement material in or proximate to each socket comprises the steps of:

suspending the at least one enhancement material in liquid; and

flowing the liquid over the first substrate such that the at least one enhancement material settles in each socket.

18. The process of claim 16, wherein the sockets are of a corresponding shape to the at least one enhancement material and wherein the at least one enhancement material self-aligns in each socket.

19. The process of claim 16, further comprising the step of disposing a plurality of control electronics or drive electronics on the first substrate, the second substrate, or the first substrate and the second substrate.

20. The process of claim 16, wherein the web fabrication process is performed as a continuous high-speed inline process.