Method and system for manufacturing electronic packaging units

• US 6,612,890 B1
• Filed: 11/20/2000
• Issued: 09/02/2003
• Est. Priority Date: 10/15/1998
• Status: Expired due to Fees

• Current Assignee: Interplex Industries, Inc. (Interplex Holdings Pte. Ltd.)
• Original Assignee: Handy & Harman Limited (Steel Partners Holdings LP)
• Inventors: Radloff, Robert Peter
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US09/714,992
• Time in Patent Office: 1,016 Days
• Field of Search: 445/24, 264/645, 264/272.14, 264/277, 174/52.4, 257/691, 257/692, 257/700, 438/26, 361/820, 361/806
• US Class Current: 445/24
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/49537 Plurality of lead frames mounted in one device
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method and system for fabricating electronic packaging units which include a molded body and a plurality of electrically conductive leads protruding therefrom. The packaging units are made by overlaying lead frames having leads and then depositing molding material on the leads. The packaging units are manufactured in an assembly line process which includes a feeder to feed the lead frames and a molder to deposit the molding material.

Claims

1. An automated method of fabricating electronic packaging units comprising the steps of providing a first substantially planar lead frame defining a first aperture and at least one first lead extending into the aperture;

providing a second heat sink lead frame segment defining a second aperture and including at least one second lead extending into said second lead frame aperture, wherein the second lead is provided with at least one hole extending therethrough;

overlaying the first lead frame segment and the second heat sink lead frame segment and positioning the first and second leads apart from each other by a distance defining a space; and

riveting the first and second lead frame segments together with a deposit of flowable molding material into the space defined by the predetermined distance between the first lead and the second heat sink lead, the molding material flowing though the at least one hole in the second heat sink lead frame portion, thereby forming said molded body, wherein the molded body is structured to expose contact surfaces for each of the first lead and second lead.

2. The method of claim 1 wherein the second lead further includes an edge portion having raised step portions.

3. The method of claim 2 wherein the edge is provided with a notch.

4. The method of claim 3 wherein, during the deposit of the flowable molding material, the material flows around the step portions of the second lead frame heat sink portion to facilitate the fixing of the second lead frame portion within the molded body.

5. The method of claim 2 wherein, during the deposit of the flowable molding material, the material flows around the step portions of the second lead frame heat sink portion to facilitate the fixing of the second lead frame portion within the molded body.

6. The method of claim 5 wherein the first lead is substantially rectangular and includes a side provided with a flared portion.

7. The method of claim 1 wherein the first lead is substantially rectangular and includes a side provided with a flared portion.

8. The method of claim 1 wherein the space between the first and second leads is bounded by the flared portion of the first lead and the through holes and step portions of the second lead.

9. The method of claim 1 wherein the first and second leads are positioned in an overlapping arrangement.

10. The method of claim 9 wherein the electronic device is selected from the group consisting of a semiconductor and a microchip.

11. The method of claim 1 wherein the first and second leads are positioned in an tiered arrangement.

12. The method of claim 1 wherein the first and second lead frame segments include with side rails having guide holes positioned therein.

13. The method of claim 1 further comprised of the step of forming the molded body into a substantially rectangular shape defining a central cavity having a bottom cavity surface comprising the heat sink second lead and wherein the body includes a terraced sidewall arrangement which is comprised of the exposed contact surface of the first lead, the first lead having an end which extends out of the package, and wherein the central cavity is dimensioned to receive an electronic device.

14. The method of claim 1 further comprised of the steps of providing a feeder that includes feed pins, engaging holes provided in each of the first lead frame segment and the second heat sink segment with the feeder pins, moving the feeder pins to feed the lead frame segments to a molder, depositing a flowable molding material from the molder onto the lead frame segments, and hardening the molding material.

15. The method of claim 1 wherein the first lead and the second lead are each provided with arms extending from the side portions prongs which extend in a direction substantially perpendicular to the first lead and the second lead.

16. The method of claim 15 further comprised of the steps of providing a feeder that includes feed pins, engaging holes provided in each of the first lead frame segment and the second heat sink segment with the feeder pins, moving the feeder pins to feed the lead frame segments to a molder, depositing a flowable molding material from the molder onto the lead frame segments, and hardening the molding material.

17. An electronic packaging unit comprising a first substantially planar lead frame defining a first aperture and at least one first lead extending into the aperture, a second heat sink lead frame segment which includes a second lead defining a second aperture and including at least one second lead extending into said second lead frame aperture, wherein the second lead is provided with at least one hole extending therethrough;

the first lead and the second heat sink lead positioned in an overlaying arrangement in which the first and second leads are spaced apart from each other;

a molded body including a hardened molding material that, when deposited in a flowable state, enters the space between the first lead and the second heat sink lead, and flows though the at least one hole in the second heat sink lead frame portion, thereby fixing the first and second leads within the molded body, wherein the molded body is structured to expose contact surfaces for each of the first lead and second lead.

18. The electronic packaging unit of claim 17 wherein the second lead further includes an edge portion having raised step portions.

19. The electronic packaging unit of claim 18 wherein the edge is provided with a notch.

20. The electronic packaging unit of claim 19 wherein, during the deposit of the flowable molding material, the material flows around the step portions of the second lead to facilitate the fixing of the second lead frame portion within the molded body.

21. The electronic packaging unit of claim 20 wherein, during the deposit of the flowable molding material, the material flows around the step portions of the second lead frame heat sink portion to facilitate the fixing of the second lead frame portion within the molded body.

22. The electronic packaging unit of claim 17 wherein the first lead is substantially rectangular and includes a side provided with a flared portion.

23. The electronic packaging unit of claim 22 wherein the first lead is substantially rectangular and includes a side provided with a flared portion.

24. The electronic packaging unit of claim 17 wherein the space between the first and second leads is bounded by the flared portion of the first lead and the through holes and step portions of the second lead.

25. The electronic packaging unit of claim 17 wherein the first and second leads are positioned in an overlapping arrangement.

26. The electronic packaging unit of claim 17 wherein the first and second leads are positioned in a tiered arrangement.

27. The electronic packaging unit of claim 17 wherein the first and second lead frame segments include side rails having guide holes positioned therein.

28. The electronic packaging unit of claim 17 wherein the molded body has a substantially rectangular shape defining a central cavity having a bottom cavity surface comprising the heat sink second lead and wherein the body includes terraced sidewall arrangement which is comprised of the exposed contact surface of the first lead, the first lead having an end which extends out of the package, and wherein the central cavity is dimensioned to receive an electronic device.

29. The electronic packaging unit of claim 28 wherein the electronic device is selected from the group consisting of a semiconductor, and a microchip.

30. The electronic packaging unit of claim 17 wherein the first lead and the second lead are each provided with arms extending from the side portions to prongs which extend in a direction substantially perpendicular to the first lead and the second lead, wherein the prongs extend beyond the molded body.