Method and apparatus for wireless transfer of chemical-mechanical planarization measurements

• US 6,612,900 B2
• Filed: 08/07/2001
• Issued: 09/02/2003
• Est. Priority Date: 08/31/1998
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Moore, Scott E.
• Primary Examiner(s): NGUYEN, GEORGE BINH MINH
• Application Number:
  US09/924,063
• Publication Number:
  US 20010049252A1
• Time in Patent Office: 756 Days
• Field of Search: 457/5, 457/6, 457/41, 457/285-289, 457/9-11, 438/692-693
• US Class Current: 451/5
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 49/00 Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation B24B33/06, B24B37/005 take precedence; if applicable to other machine tools, B23Q15/00 - B23Q17/00 take precedence
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portion of the planarizing machine. The apparatus further comprises a display spaced apart from the sensor and a wireless communication link coupled between the sensor and the display to transmit a signal from the sensor to the display. The wireless communication link may include an infrared link, a radio link, an acoustic link, or an inductive link. The sensor may measure force, pressure, temperature, pH, electrical resistance or other planarizing parameters. The sensor may also detect light reflected from a reflective surface of a substrate that is used to calibrate the planarizing machine.

Claims

1. An apparatus for transmitting signals from a planarizing device, the planarizing device having a support, a platen assembly connected to the support, and a carrier movable relative to the platen assembly and the support to remove material from a semiconductor substrate positioned between the carrier and the platen assembly, the apparatus comprising:

a first sensor being a force sensor coupled to the carrier, the carrier being further comprised of a mounting member removably coupled to the support structure, and an engaging member to engage the semiconductor substrate, the force sensor being connected between the mounting member and the engaging member to generate a signal corresponding to a force transmitted therebetween;

a second sensor connected to the semiconductor substrate, wherein the semiconductor substrate has a conductive material on a surface thereof and the second sensor includes an ohm meter, adjacent to the force sensor, coupled to the conductive material to detect a change signal in resistance of the conductive material when a portion of the conductive material is removed during planarization of the semiconductor substrate

a display spaced apart from the first and second sensors; and

a wireless communication link coupled between the first and second sensors and the display to transmit the signals from the first and second sensors to the display.

2. The apparatus of claim 1 wherein the electrical device includes a display.

3. The apparatus of claim 1 wherein the electrical device includes a feedback device to change the value of the selected property.

4. The apparatus of claim 1 wherein the force sensor includes a steady state force sensor.

5. The apparatus of claim 1 wherein the force sensor is configured to measure a varying force.

6. The apparatus of claim 1 wherein the display is generally fixed relative to the support.

7. The apparatus of claim 1 wherein the communication link includes a first inductive coil attached to one of the platen assembly and the carrier, the communication link further including a second inductive coil spaced apart from the first inductive coil, the first inductive coil moving relative to the second inductive coil while the semiconductor substrate is planarized.

8. The apparatus of claim 1 wherein the communication link includes a transmitting transducer attached to one of the platen assembly and the carrier, the communication link further including a receiving transducer spaced apart from the transmitting transducer, the transmitting transducer being movable relative to the receiving transducer while the semiconductor substrate is planarized, further comprising a controller coupled to the planarizing device to change the value of the selected property when the value differs from a selected value.

9. The apparatus of claim 8 wherein the selected property includes a force transmitted by the carrier to the semiconductor substrate and the controller includes a force controller coupled to the carrier to vary the force on the semiconductor substrate.

10. The apparatus of claim 1, further comprising a power supply attached to the carrier and coupled to the sensor to supply power thereto.

11. The apparatus of claim 1 further comprising

a multiplexer coupled to the first and second sensors and the communication link to sequentially transmit the first and second signals to the communication link.

12. The apparatus of claim 1 wherein the communication link includes a plurality of wireless transmitting transducers connected to the sensor and at least one wireless receiver spaced apart from the wireless transmitting transducers, the wireless transmitting transducers moving relative to the wireless receiving transducer when the semiconductor substrate is planarized.

13. The apparatus of claim 1 wherein the signal is an analog signal and the communication link includes a wireless analog transmitting transducer and a wireless analog receiving transducer spaced apart from the wireless analog transmitting transducer.

14. The apparatus of claim 1 wherein the signal is a digital signal and the communication link includes a wireless digital transmitting transducer and a wireless digital receiving transducer spaced apart from the wireless digital transmitting transducer.

15. The apparatus of claim 1, further comprising a memory device coupled to the sensor to receive the first and second sensors signals and store the sensor signals for a selected period of time.