Pretreatment process for a surface texturing process

• US 6,613,204 B2
• Filed: 02/07/2001
• Issued: 09/02/2003
• Est. Priority Date: 04/24/1995
• Status: Expired due to Fees

• Current Assignee: SI Diamond Technology, Inc. (Nano Magic, Inc.)
• Original Assignee: SI Diamond Technology, Inc. (Nano Magic, Inc.)
• Inventors: Xie, Chenggang, Eichman, Dean Joseph
• Primary Examiner(s): MCDONALD, RODNEY GLENN
• Application Number:
  US09/778,430
• Publication Number:
  US 20010047931A1
• Time in Patent Office: 937 Days
• Field of Search: 204/298.04, 204/298.25, 204/298.26, 451/36, 451/38, 451/75, 451/119, 451/158, 451/173
• US Class Current: 204/298.04
• CPC Class Codes: C23C 14/028 Physical treatment to alter the texture of the substrate surface, e.g. grinding, polishing
• CPC Class Codes: C23C 14/22 characterised by the process of coating

Abstract

Before submitting a sample, including a first material layered upon a substrate, to an ion milling process, whereby a second material is sputtered onto the surface of the first material and the sample is then submitted to an etching process, an irregularity is formed on the surface of the first material. The overall process results in the formation of cones, or micro-tip structures, which may then be layered with a layer of low work function material, such as amorphous diamond. The irregularity in the surface of the first material may be formed by polishing, sandblasting, photolithography, or mechanical means such as scratching.

Claims

1. A system for surface texturing a first material, said system comprising:

means for depositing said first material on a substrate;

means for producing irregularities across an area of a surface of said deposited first material to increase uniformity of sites for forming structures;

means for sputtering a second material onto a surface of said first material, wherein said substrate includes a layer of a third material on which said first material has been deposited;

means for etching said first material; and

a mass spectrometer for monitoring an electromagnetic spectrum originated at a location of said first material for detecting a predetermined amount of said third material.

2. The system as recited in claim 1, wherein said sputtering means includes a first ion beam originating from a first ion beam source, said first ion beam bombarding a target of said second material, and wherein said etching means includes a second ion beam originating from a second ion beam source.

3. The system as recited in claim 1, further comprising:

means for growing microtips at the surface irregularities.

4. A system for surface texturing a first material, said system comprising:

means for depositing said first material on a substrate;

means for producing irregularities across an area of a surface of said deposited first material to increase uniformity of sites for forming structures, wherein said means for producing irregularities across the area of the surface of said deposited first material further comprises a means for polishing said surface with a polishing solution;

means for sputtering a second material onto a surface of said first material; and

means for etching said first material.

5. The system as recited in claim 4, wherein said polishing means further comprises a polishing machine coupled to said substrate, and a polishing pad on which said surface is polished.

6. The system as recited in claim 4, further comprising:

means for growing microtips at the surface irregularities.

7. A system for surface texturing a first material, said system comprising:

means for depositing said first material on a substrate;

means for producing irregularities across an area of a surface of said deposited first material to increase uniformity of sites for forming structures, wherein said means for producing irregularities across the area of the surface of said deposited first material further comprises a means for sandblasting said surface;

means for sputtering a second material onto a surface of said first material; and

means for etching said first material.

8. The system as recited in claim 7, further comprising:

means for growing micro tips at the surface irregularities.

9. A system for surface texturing a first material, said system comprising:

means for depositing said first material on a substrate;

means for producing irregularities across an area of a surface of said deposited first material to increase uniformity of sites for forming structures, wherein said means for producing irregularities across the area of the surface of said deposited first material further comprises means for depositing a strip of a third material on said substrate prior to depositing said first material on said substrate resulting in a production of a stepped surface on said first material;

means for sputtering a second material onto a surface of said first material;

means for etching said first material.

10. The system as recited in claim 9, further comprising:

means for growing microtips at the surface irregularities.

11. A system for surface texturing a first material, said system comprising:

means for depositing said first material on a substrate;

means for producing irregularities across an area of a surface of said deposited first material to increase uniformity of sites for forming structures, wherein said means for producing irregularities across the area of the said deposited first material further comprises a means for scratching said surface;

means for sputtering a second material onto a surface of said first material; and

means for etching said first material.

12. The system as recited in claim 11, further comprising:

means for growing microtips at the surface irregularities.