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Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof

  • US 6,613,442 B2
  • Filed: 12/29/2000
  • Issued: 09/02/2003
  • Est. Priority Date: 12/29/2000
  • Status: Expired due to Term
First Claim
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1. A coated component of semiconductor processing equipment comprising:

  • (a) a surface;

    (b) an optional first intermediate coating on said surface;

    (c) an optional second intermediate coating on said first intermediate coating or on said surface; and

    (d) a boron nitride/yttria composite containing coating over said surface that forms an outer erosion resistant surface, the boron nitride/yttria composite containing coating including a cubic phase, a hexagonal phase or mixtures thereof, the boron nitride/yttria composite containing coating being exposed to plasma and/or corrosive gases in the equipment.

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