Boron nitride/yttria composite components of semiconductor processing equipment and method of manufacturing thereof
First Claim
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1. A coated component of semiconductor processing equipment comprising:
- (a) a surface;
(b) an optional first intermediate coating on said surface;
(c) an optional second intermediate coating on said first intermediate coating or on said surface; and
(d) a boron nitride/yttria composite containing coating over said surface that forms an outer erosion resistant surface, the boron nitride/yttria composite containing coating including a cubic phase, a hexagonal phase or mixtures thereof, the boron nitride/yttria composite containing coating being exposed to plasma and/or corrosive gases in the equipment.
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Abstract
A corrosion resistant component of semiconductor processing equipment such as a plasma chamber includes a boron nitride/yttria composite containing surface and process for manufacture thereof.
86 Citations
15 Claims
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1. A coated component of semiconductor processing equipment comprising:
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(a) a surface;
(b) an optional first intermediate coating on said surface;
(c) an optional second intermediate coating on said first intermediate coating or on said surface; and
(d) a boron nitride/yttria composite containing coating over said surface that forms an outer erosion resistant surface, the boron nitride/yttria composite containing coating including a cubic phase, a hexagonal phase or mixtures thereof, the boron nitride/yttria composite containing coating being exposed to plasma and/or corrosive gases in the equipment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 13, 15)
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12. A coated component of semiconductor processing equipment, comprising:
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a surface;
an optional first intermediate coating on the surface;
an optional second intermediate coating on the first intermediate coating or on the surface; and
a boron nitride/yttria composite containing coating over the surface that forms an outer erosion resistant surface, wherein boron nitride or yttria forms a continuous matrix phase in the boron nitride/yttria composite containing coating, and the boron nitride/yttria composite containing coating is exposed to plasma and/or corrosive gases in the equipment.
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14. A coated component of semiconductor processing equipment, comprising:
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a surface;
an optional first intermediate coating on the surface;
an optional second intermediate coating on the first intermediate coating or on the surface; and
a boron nitride/yttria composite containing coating formed on one of the first intermediate coating and the second intermediate coating and not formed on the surface, the boron nitride/yttria composite containing coating forming an outer erosion resistant surface and being exposed to plasma and/or corrosive gases in the equipment.
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Specification