Method for forming a dielectric zone in a semiconductor substrate
First Claim
1. A method for forming a dielectric zone in a region of a semiconductor substrate, which comprises the steps of:
- forming a first trench and a second trench in the region of the semiconductor substrate resulting in a web being formed between the first trench and the second trench;
providing a first dielectric layer in an upper region of the first and second trenches and forming a first cavity in a lower region of the first trench below the upper region of the first trench and terming a second cavity in a lower region of the second trench below the upper region of the second trench;
providing a first dielectric layer in the first trench and the second trench;
removing the web, a third trench thereby being produced;
wherein the first, second, and third trenches have an aspect ratio of greater than 1; and
providing a second dielectric layer in an upper region of the third trench and forming a third cavity contiguous with the first cavity in a lower region of the third trench below the upper region of the third trench.
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Abstract
A method for forming a dielectric zone in a region of a semiconductor substrate is described. A first trench and a second trench are formed in the region of the semiconductor substrate resulting in a web being formed between the first trench and the second trench. Afterward, a first dielectric layer is deposited in the first trench and the second trench. The web is subsequently removed, a third trench thereby being produced in the semiconductor substrate. Afterwards, a second dielectric layer is formed in the third trench. The first dielectric layer and the second dielectric layer together form a dielectric zone in the semiconductor substrate, on which it is advantageously possible to dispose components with substrate decoupling.
67 Citations
9 Claims
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1. A method for forming a dielectric zone in a region of a semiconductor substrate, which comprises the steps of:
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forming a first trench and a second trench in the region of the semiconductor substrate resulting in a web being formed between the first trench and the second trench;
providing a first dielectric layer in an upper region of the first and second trenches and forming a first cavity in a lower region of the first trench below the upper region of the first trench and terming a second cavity in a lower region of the second trench below the upper region of the second trench;
providing a first dielectric layer in the first trench and the second trench;
removing the web, a third trench thereby being produced;
wherein the first, second, and third trenches have an aspect ratio of greater than 1; and
providing a second dielectric layer in an upper region of the third trench and forming a third cavity contiguous with the first cavity in a lower region of the third trench below the upper region of the third trench. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification