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Method for making projected contact structures for engaging bumped semiconductor devices

  • US 6,613,662 B2
  • Filed: 08/23/2001
  • Issued: 09/02/2003
  • Est. Priority Date: 03/26/1997
  • Status: Expired due to Term
First Claim
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1. A method of making at least one projection body for engaging bumped semiconductor devices, said method comprising:

  • providing a carrier substrate;

    forming at least one masking block on said carrier substrate;

    etching said carrier substrate to form at least one projection body thereon;

    forming a second mask over said at least one projection body, said second mask being shorter and narrower than said at least one masking block; and

    etching said carrier substrate to further define said at least one projection body.

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