Conductive hardening resin for a semiconductor device and semiconductor device using the same

• US 6,613,829 B2
• Filed: 01/23/2002
• Issued: 09/02/2003
• Est. Priority Date: 01/23/2001
• Status: Expired due to Term

• Current Assignee: Renesas Electronics Corporation, Sumitomo Bakelite Company Limited
• Original Assignee: NEC Electronics Corporation (Renesas Electronics Corporation), Sumitomo Bakelite Company Limited
• Inventors: Oonami, Kazuto, Fukuizumi, Akira
• Primary Examiner(s): NILAND, PATRICK DENNIS
• Application Number:
  US10/052,633
• Publication Number:
  US 20020098625A1
• Time in Patent Office: 587 Days
• Field of Search: 524/439, 524/548, 524/556, 524/560, 524/561, 524/612
• US Class Current: 524/439
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/0603 Bonding areas having different sizes, e.g. different heights or widths
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/37011 comprising apertures or cavities
• CPC Class Codes: H01L 2224/371 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/37147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/3754 Coating
• CPC Class Codes: H01L 2224/40095 Kinked
• CPC Class Codes: H01L 2224/40245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48624 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/73221 Strap and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/838 Bonding techniques
• CPC Class Codes: H01L 2224/84385 Shape, e.g. interlocking features
• CPC Class Codes: H01L 2224/8485 : using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/49524 : the additional leads being a tape carrier or flat leads
• CPC Class Codes: H01L 23/49562 : for devices being provided for in H01L29/00
• CPC Class Codes: H01L 24/33 : of a plurality of layer connectors
• CPC Class Codes: H01L 24/37 : of an individual strap connector
• CPC Class Codes: H01L 24/40 : of an individual strap connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/84 : using a strap connector
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01011 : Sodium [Na]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01026 : Iron [Fe]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/351 : Thermal stress

Abstract

Conductive hardening resin for a semiconductor device of the present invention contains metal powder for providing electric conduction between electrodes positioned on the front of a semiconductor chip and a wiring material including lead terminals via a conductive plate. The resin has a modulus of elasticity of 2.0×10⁹ Pa or below when hardened. The resin prevents the contact resistance of the metal plate, lead terminals and semiconductor chip from increasing in the event of temperature cycling tests and a pressure cooker tests. Further, the resin frees the metal plate and chip from peel-off and corrosion, respectively.

Claims

1. A conductive hardening resin containing metal powder for providing electric conduction between electrodes positioned on a front of a semiconductor chip, which is included in a semiconductor device, and a wiring material including lead terminals via a conductive plate, said resin having a modulus of elasticity of 2.0×

10⁹ Pa or below when hardened.

2. The resin as claimed in claim 1, wherein an Na ion concentration, a Cl ion concentration and a P ion concentration are less than 2 ppm, less than 3 ppm and less than 0.1 ppm, respectively.

3. The resin as claimed in claim 1, wherein pH is between 5.0 and 8.0 as measured by a method that dilutes a hardened sample with pure water by 20 times.

4. The resin as claimed in claim 3, wherein an Na ion concentration, a Cl ion concentration and a P ion concentration are less than 2 ppm, less than 3 ppm and less than 0.1 ppm, respectively.

5. The resin as claimed in claim 1, wherein pH is between 5.0 and 8.0 as measured by a method that dilutes a hardened sample with pure water by 20 times.

6. The resin as claimed in claim 5, wherein an Na ion concentration, a Cl ion concentration and a P ion concentration are less than 2 ppm, less than 3 ppm and less than 0.1 ppm, respectively.

7. The resin as claimed in claim 1, wherein said resin comprises either one of epoxy resin and acrylic resin.

8. The resin as claimed in claim 1, wherein pH is between 5.0 and 8.0 as measured by a method that dilutes a hardened sample with pure water by 20 times.

9. The resin as claimed in claim 8, wherein an Na ion concentration, a Cl ion concentration and a P ion concentration are less than 2 ppm, less than 3 ppm and less than 0.1 ppm, respectively.

10. The resin as claimed in claim 1, wherein said metal power comprises silver powder.

11. The resin as claimed in claim 10, wherein said resin comprises either one of epoxy resin and acrylic resin.

12. The resin as claimed in claim 1, wherein pH is between 5.0 and 8.0 as measured by a method that dilutes a hardened sample with pure water by 20 times.

13. The resin as claimed in claim 12, wherein an Na ion concentration, a Cl ion concentration and a P ion concentration are less than 2 ppm, less than 3 ppm and less than 0.1 ppm, respectively.