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Shielded semiconductor leadframe package

  • US 6,614,102 B1
  • Filed: 05/04/2001
  • Issued: 09/02/2003
  • Est. Priority Date: 05/04/2001
  • Status: Active Grant
First Claim
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1. A semiconductor chip package comprising:

  • a plurality of leadframe portions;

    a semiconductor die mounted on at least one of the leadframe portions;

    a shield element attached to at least one of the leadframe portions; and

    a package mold surrounding the semiconductor die and the shield element;

    wherein the leadframe portions comprise a plurality of leads, and wherein a surface of at least one of the leads is exposed at a lower surface of the package mold;

    wherein the leadframe portions further comprise a die pad, and wherein a surface of the die pad is exposed at the lower surface of the package mold.

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