Frame structure

• US 6,614,405 B1
• Filed: 05/25/2000
• Issued: 09/02/2003
• Est. Priority Date: 11/25/1997
• Status: Expired due to Fees

• Current Assignee: Pulse Finland Oy (Yageo Corporation)
• Original Assignee: Filtronic LK Oy
• Inventors: Lohtander, Kari, Pesonen, Kalevi, Mikkonen, Esa
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): Dinh, Trinh Vo
• Application Number:
  US09/579,095
• Time in Patent Office: 1,195 Days
• Field of Search: H01/Q.124, H01/Q.142, 343/702, 343/700.MS, 343/841, 343/846, 343/872, 455/90, 455/128, 361/829
• US Class Current: 343/872
• CPC Class Codes: H01Q 1/1207 for fastening a rigid aerial element
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H05K 7/142 Spacers not being card guides

Abstract

The invention relates to frame structures, particularly to mobile stations and other small-sized portable devices operating at high frequencies. The frame structure according to the invention is formed by extrusion, whereby the fixing means required for fastening components are formed into it during the extrusion. Such fixing means are preferably pin-like projections which can be compressed to a rivet fixing the component. Such fixing means can also be strip-like fixing edges which are bent over the component edges. With such fixing means it is possible to form at the same time both a mechanical fixing and a good electrical contact between the component and the frame structure. During the extrusion it is also possible to fasten to the frame structure parts made of other materials, such as fixing means of other types or other components, such as antennas.

Claims

1. A frame for an electronic device, comprising:

an extruded frame structure having a generally planar base with particular dimensions and upstanding sides extending from the base, said frame structure supporting substantially all elements of the device;

at least one extruded fixing means for fastening a planar component of the electronic device to the frame structure by shaping of said fixing means, the planar dimensions of the component being smaller than the planar dimensions of the base, said fixing means having been extruded in one piece with said frame structure during the same extrusion process that formed the frame structure, and axes of said fixing means being essentially perpendicular to the base and extending from the upstanding sides of the frame structure; and

wherein also an electrical contact between the frame structure and said component is provided by shaping said fixing means.

2. The frame structure according to claim 1, wherein said fixing means is a clamping edge and said shaping is bending of said clamping edge.

3. The frame structure according to claim 1, wherein said fixing means is a projection and said shaping is flattening the end of said projection.

4. The frame structure according to claim 1, wherein at least one component is fastened to the frame structure during the extrusion.

5. The frame structure according to claim 1, further comprising an antenna radiator having been formed in one piece with the frame structure.

6. A device comprising:

an extruded frame structure having a generally planar base with particular dimensions and upstanding sides extending from the base, said frame structure supporting substantially all elements of the device;

at least one extruded fixing means for fasting a planar component of the device to the frame structure by shaping of said fixing means, the planar dimensions of the component being smaller than the planar dimensions of the base, said fixing means having been extruded in one piece with said frame structure during the same extrusion process that formed the frame structure, and

axes of said fixing means being essentially perpendicular to the base and extending from the upstanding sides of said frame structure, and wherein also an electrical contact between the frame structure and said component is provided by shaping said fixing means.

7. The device according to claim 6 comprising second components in addition to said at least one first component, wherein at least one second component is between the frame structure and said at least one first component, and the frame structure and said at least one first component form a RF shield for at least one second component.

8. The device according to claim 6, wherein at least one of said at least one first component is a printed circuit board.

9. The device according to claim 8, wherein said frame structure comprises at least one partition, which divides a space between the frame structure and the printed circuit board into at least two parts, at least one of which is an RF shielded space.

10. The device according to claim 6, wherein at least one first component is an antenna.

11. The device according to claim 6, wherein the device is a mobile communication means.

12. The device according to claim 6, said frame structure comprises a radiator which is formed during the extrusion and which forms an integral body with the frame structure.

13. A method to manufacture an electronic device, comprising the steps of,

(a) extruding a frame structure of the device and extruding a fixing means in said frame structure in the same extrusion step and as one piece,

(b) fixing a component to the frame structure by said fixing means;

(c) substantially supporting all elements of the device on said frame structure;

(d) dimensioning said frame structure whereby the planar dimensions of said components are smaller than the planar dimensions of said frame structure; and

(e) forming an electrical contact between said component and the frame structure by shaping said fixing means.

14. The method according to claim 13, wherein said fixing means is a clamping edge, whereby the method comprises a step in which at least one component is fixed to the frame structure by bending said clamping edge.

15. The method according to claim 13, wherein said fixing means is a projection, whereby the method comprises a step in which at least one component is fixed to the frame structure by shaping the end of said projection.

16. The method according to claim 13, wherein said component is fixed in such a way at least partly in-order to form an RF shield for components between said component and the frame structure.

17. The method according to claim 13, wherein said component is fixed in such a way at least partly in order to stiffen the combined structure.