Probe card assembly and kit, and methods of making same

• US 6,615,485 B2
• Filed: 12/27/2001
• Issued: 09/09/2003
• Est. Priority Date: 11/16/1993
• Status: Expired due to Fees

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Grube, Gary William, Khandros, Igor Yan, Eldridge, Benjamin Niles, Mathieu, Gaetan L.
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US10/034,543
• Publication Number:
  US 20020080588A1
• Time in Patent Office: 621 Days
• Field of Search: 298/43, 298/42, 298/74, 228/179, 439/56, 439/66, 439/591
• US Class Current: 29/843
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: C23C 18/31 Coating with metals
• CPC Class Codes: C23C 18/32 Coating with nickel, cobalt or mixtures thereof with phosphorus or boron C23C18/50 takes precedence
• CPC Class Codes: C25D 21/02 Heating or cooling
• CPC Class Codes: C25D 5/12 at least one layer being of nickel or chromium
• CPC Class Codes: C25D 5/605 Surface topography of the layers, e.g. rough, dendritic or nodular layers
• CPC Class Codes: C25D 7/0607 Wires
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/0675 Needle-like
• CPC Class Codes: G01R 1/06761 related to layers
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/4889 Connection or disconnection of other leads to or from wire-like parts, e.g. wires
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/76897 Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step self-aligned silicidation on field effect transistors H01L29/665
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05023 : the whole internal layer protruding from the surface
• CPC Class Codes: H01L 2224/05085 : with additional elements, e.g. vias arrays, interposed between the stacked layers
• CPC Class Codes: H01L 2224/05556 : in side view
• CPC Class Codes: H01L 2224/05568 : the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05599 : Material
• CPC Class Codes: H01L 2224/1134 : Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13099 : Material
• CPC Class Codes: H01L 2224/16145 : the bodies being stacked
• CPC Class Codes: H01L 2224/45015 : being circular
• CPC Class Codes: H01L 2224/45144 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48 : of an individual wire connector
• CPC Class Codes: H01L 2224/49109 : outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73203 : Bump and layer connectors
• CPC Class Codes: H01L 2224/81801 : Soldering or alloying
• CPC Class Codes: H01L 2224/85201 : Compression bonding
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06527 : Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06555 : Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/12 : Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/72 : Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20757 : larger or equal to 70 microns less than 80 microns
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01R 12/52 : connecting to other rigid printed circuits or like structures
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/0397 : Tab forming integral conductive tabs H05K3/4092
• CPC Class Codes: H05K 2201/068 : wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/1031 : Surface mounted metallic connector elements
• CPC Class Codes: H05K 2201/10318 : Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 2201/10719 : Land grid array [LGA]
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/10757 : Bent leads
• CPC Class Codes: H05K 2201/10878 : Means for retention of a lead in a hole
• CPC Class Codes: H05K 2201/10909 : Materials of terminal, e.g. of leads or electrodes of components
• CPC Class Codes: H05K 2201/10946 : Leads attached onto leadless component after manufacturing the component
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/308 : Adaptations of leads connectors to printed circuits H01R12/00
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: H05K 3/3426 : characterised by the leads
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/4015 : using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: H05K 3/4092 : Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: H05K 7/1069 : with spring contact pieces
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49004 : including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49147 : Assembling terminal to base
• CPC Class Codes: Y10T 29/49149 : by metal fusion bonding
• CPC Class Codes: Y10T 29/49204 : Contact or terminal manufacturing
• CPC Class Codes: Y10T 29/49208 : by assembling plural parts
• CPC Class Codes: Y10T 29/4921 : with bonding
• CPC Class Codes: Y10T 29/49211 : of fused material
• CPC Class Codes: Y10T 29/49213 : Metal
• CPC Class Codes: Y10T 29/49222 : forming array of contacts or terminals

Abstract

A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer'"'"'s range of adjustment, by virtue of the interposer'"'"'s inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Claims

1. A method of producing a tested semiconductor device comprising:

providing a probe card assembly, said probe card assembly including a probe card having a plurality of electrical contacts, a probe substrate having a plurality of elongate, resilient probe elements, and a compliant interconnection structure electrically connecting ones of said electrical contacts with ones of said probe elements;

providing a plurality of semiconductor devices, each of said semiconductor devices including electrical contact pads;

bringing said probe elements into contact with said electrical contact pads of said semiconductor device; and

testing said semiconductor devices.

2. The method of claim 1, wherein said compliant interconnection element is disposed between said probe card and said probe substrate.

3. The method of claim 1, wherein said plurality of semiconductor devices are in wafer form.

4. The method of claim 1, wherein said method of producing a tested semiconductor device further comprises the step of dicing said wafer to singulate said semiconductor devices.

5. The method of claim 2, wherein said compliant interconnection structure comprises of elongate interconnection elements extending from opposing surfaces of said interconnection structure.

6. The method of claim 5, each of said plurality of elongate interconnection elements is disposed such that said elongate element passes through an opening in said compliant interconnection structure, opposite ends of said elongate interconnection element being spaced from said opposing surfaces of said interconnect structure.

7. The method of claim 5, wherein said plurality of elongate interconnection elements exert forces against said probe card and said probe substrate.

8. The method of claim 7, wherein said forces are spring forces.

9. The method of claim 5, wherein said elongate interconnection elements are resilient.

10. The method of claim 9, wherein each of said elongate interconnect elements comprises a core of a first material and a coating of a second material, wherein said second material is more resilient than said first material.

11. The method of claim 5, wherein each of said elongate interconnect elements comprises a precursor of a first material and a coating of a second material.

12. The method of claim 1, wherein said compliant interconnection structure comprises a first plurality of interconnection elements extending from one surface of said interconnection structure and a second plurality of interconnection structures extending from an opposing surface aid interconnection structure.

13. The method of claim 12, wherein said first plurality of interconnection elements have different mechanical characteristics from said second plurality of interconnection elements.

14. The method of claim 13, wherein said second plurality of interconnection structures are rigid.

15. The method of claim 5, wherein said compliant interconnection structure is demountable.

16. The method of claim 2, wherein said probe card includes a plurality of interconnection element structures, ones of said plurality of interconnection element structures extending from ones of said plurality of electrical contacts, said plurality of interconnection element structures contacting said compliant interconnection structure.

17. The method of claim 2, wherein said probe substrate includes a plurality of interconnection element structures, said plurality of interconnection element structures contacting said compliant interconnection structure.

18. The method of claim 1 further comprising aligning tips of said probe elements by altering an orientation of said probe substrate with respect to said probe card.

19. The method of claim 18 wherein said altering comprises moving a moveable element disposed so as to affect an orientation of said probe substrate with respect to said probe card.

20. The method of claim 19, wherein said moveable element is threaded.

21. The method of claim 18, wherein said moveable element comprises a screw.

22. The method of claim 21, wherein said screw comprises a differential screw.

23. The method of claim 19, wherein moving said moveable element in a first direction causes at least a portion of said probe substrate to move toward said probe card.

24. The method of claim 23, wherein moving said moveable element in a second direction allows at least a portion of said probe substrate to move away from said probe card.

25. The method of claim 18, further comprising moving a plurality of said moveable elements.

26. The method of claim 19, wherein said altering comprises actuating a servo mechanism disposed to alter a position of said probe substrate with respect to said probe card.

27. The method of claim 19, wherein said altering comprises actuating a piezoelectric actuator disposed to alter a position of said probe substrate with respect to said probe card.

28. The method of claim 19, wherein said aligning comprises aligning said tips with an alignment plate.

29. The method of claim 1, wherein said probe substrate comprises a space transformer.

30. The method of claim 1, wherein each of said probe elements comprises a first material and a second material, wherein said second material is more resilient than said first material.

31. The method of claim 28, wherein said screw comprises a differential screw.

32. A method of producing a tested semiconductor device comprising:

providing a probe card comprising a plurality of electrical contacts;

providing a probe substrate moveably affixed to said probe card and comprising a plurality of elongate, resilient probe elements, ones of said elongate resilient probe elements being in electrical communication with ones of said electrical contacts;

aligning tips of said probe elements by altering an orientation of said probe substrate with respect to said probe card;

providing a semiconductor device;

bringing said tips into contact with said semiconductor device; and

testing said semiconductor device.

33. The method of claim 32, wherein said altering comprises moving a moveable element disposed so as to affect an orientation of said probe substrate with respect to said probe card.

34. The method of claim 33, wherein said moveable element is threaded.

35. The method of claim 33, wherein said moveable element comprises a screw.

36. The method of claim 33, wherein moving said moveable element in a first direction causes at least a portion of said probe substrate to move toward said probe card.

37. The method of claim 36, wherein moving said moveable element in a second direction allows at least a portion of said probe substrate to move away from said probe card.

38. The method of claim 32, further comprising moving a plurality of said moveable elements.

39. The method of claim 32, wherein said altering comprises actuating a servo mechanism disposed to alter a position of said probe substrate with respect to said probe card.

40. The method of claim 32, wherein said altering comprises actuating a piezoelectric actuator disposed to alter a position of said probe substrate with respect to said probe card.

41. The method of claim 32, wherein said probe substrate comprises a space transformer.

42. The method of claim 32, wherein said probe elements comprise a core of a first material and a coating of a second material, wherein said second material is more resilient than said first material.

43. The method of claim 32, wherein said aligning comprises aligning said tips with an alignment plate.