Electrical and fluid interconnect

• US 6,616,469 B2
• Filed: 03/08/2002
• Issued: 09/09/2003
• Est. Priority Date: 03/12/2001
• Status: Expired due to Fees

• Current Assignee: Tyco Electronics Logistics AG (TE Connectivity Limited)
• Original Assignee: Tyco Electronics Logistics AG (TE Connectivity Limited)
• Inventors: Goodwin, Jonathan, Amaral, Donald P. Jr.
• Primary Examiner(s): Bradley, P. Austin
• Assistant Examiner(s): Hammond, Briggitte R.
• Application Number:
  US10/094,152
• Publication Number:
  US 20020127900A1
• Time in Patent Office: 550 Days
• Field of Search: 439/196, 439/485, 439/519, 361/699, 361/698, 361/689, 165/86.4, 165/80.4, 165/104.33, 622/592
• US Class Current: 439/196
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20636 within sub-racks for removing heat from electronic boards

Abstract

The present invention provides an electrical and fluid interconnect for providing electrical connection between one or more circuits or electrical devices and a mateable circuit board or substrate, and for providing fluid coupling of a cooling fluid to permit fluid flow in relation to the electrical circuits or devices when mated to the circuit board or substrate. The fluid connector has a valve which in the absence of mating pressure is in a closed or off position. When mated to a fluid connector which is part of or coupled to the latch assembly, the valve is opened to permit fluid to flow.

Claims

1. An interconnect apparatus comprising:

a substrate having at least one cooling channel for flow of cooling fluid;

a valved fluid connector for coupling to a source of cooling fluid and in valved fluid coupling relationship with the substrate cooling channel;

a socket for receiving an electronic device;

a mounting plate engageable with the electronic device seated in the socket, the mounting plate having at least one cooling channel;

a fluid passage in fluid communication between the fluid connector and the mounting plate cooling channel; and

a latch assembly for seating the electronic device in the socket and operative during seating of the device in the socket to open the valve of the fluid connector to allow cooling fluid to flow through the cooling channels of the substrate and the mounting plate.

2. The interconnect apparatus of claim 1 further including:

a second valved fluid connector in valved fluid coupling relationship with the substrate cooling channel;

a second fluid passage in fluid communication between the second fluid connector and the mounting plate cooling channel; and

a second latch assembly operative to maintain the electronic device in seated position in the socket and to open the valve of the second fluid connector to permit flow of cooling fluid.

3. The interconnect apparatus of claim 2 further including a backplane having the socket thereon;

and wherein the electronic device includes a circuit board mountable on the socket.

4. An electrical and fluid interconnect apparatus for providing electrical connection between at least one electrical device and a mateable circuit board and cooling of the at least one electrical device mated to the circuit board, the interconnect apparatus comprising:

a valved fluid connector for coupling to a source of cooling fluid and in fluid coupling with a device mount engageable with the device;

the valve of the fluid connector being closed in the absence of a mated electrical device and open when the device is mated to the circuit board; and

a latch assembly connectable to the fluid connector and operative to seat the device on the circuit board in electrical connection therebetween and to open the valve of the fluid connector to allow the flow of cooling fluid through the device mount when the device is mated to the circuit board.

5. An interconnect apparatus for providing electrical connection between at least one electrical device and a mateable mounting, and cooling of the at least one electrical device mated to the mounting, the interconnect apparatus comprising:

a source of cooling fluid;

a fluid connector having a valve for coupling to the source of cooling fluid;

a cooling element engageable with the electrical device when mated to the mounting and in fluid coupling relationship with the valve of the fluid connector; and

a latch assembly connectable to the fluid connector and operative to maintain the device on the mounting in electrical connection thereon and to open the valve of the fluid connector to allow the flow of cooling fluid through the cooling element.