Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system therefor

• US 6,616,759 B2
• Filed: 09/06/2001
• Issued: 09/09/2003
• Est. Priority Date: 09/06/2001
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Yamamato, Hideyuki, Tanaka, Junichi, Shiraishi, Daisuke, Ikuhara, Shoji, Kitsunai, Hiroyuki, Masuda, Toshio, Kagoshima, Akira
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): STEVENSON, ANDRE C
• Application Number:
  US09/946,732
• Publication Number:
  US 20030045009A1
• Time in Patent Office: 733 Days
• Field of Search: 438/14, 438/689, 702/85, 219/497, 364/572
• US Class Current: 118/63
• CPC Class Codes: G05B 13/048 using a predictor
• CPC Class Codes: G05B 19/41865 characterised by job scheduling, process planning, material flow
• CPC Class Codes: G05B 2219/31357 Observer based fault detection, use model
• CPC Class Codes: G05B 2219/32058 Execute program as function of deviation from predicted state, result
• CPC Class Codes: G05B 23/024 Quantitative history assessment, e.g. mathematical relationships between available data; Functions therefor; Principal component analysis [PCA]; Partial least square [PLS]; Statistical classifiers, e.g. Bayesian networks, linear regression or correlation analysis; Neural networks
• CPC Class Codes: H01L 21/67276 Production flow monitoring, e.g. for increasing throughput program-control systems per se G05B19/00, e.g. total factory control G05B19/418
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A method and system are provided for controlling and/or monitoring a semiconductor processing apparatus while predicting its processing results. The system includes a sensor for monitoring a processing state of the processing apparatus, a sensed data storage unit for preserving sensed data sent from the sensor, an input device for inputting measured values for processing results of semiconductor devices processed by the processing apparatus, a processing result measured value storage unit for preserving the inputted processing result measured values, a model equation generation unit for generating a model equation from preserved sensed data and processing result measured values, a model equation storage unit for preserving the generated model equation, a model equation based prediction unit for predicting processing results from the preserved model equation and the sensed data, and a process recipe control unit for controlling processing conditions of the processing apparatus from predicted processing results.

Claims

1. A semiconductor plasma processing apparatus for processing a semiconductor wafer, comprising:

a sensor for monitoring a processing state of said semiconductor plasma processing apparatus;

processing result input means for inputting externally measured values for processing results of a semiconductor wafer processed by said semiconductor processing apparatus in a pre-trial;

a model equation generation unit which generates a model equation for predicting a processing result using sensed data acquired by said sensor as an explanatory variable, based on said sensed data and said externally measured values;

a processing result prediction unit for predicting a processing result based on said model equation and said sensed data; and

a process recipe control unit for comparing said predicted processing result with a pre-set value to control a processing condition of said semiconductor plasma processing apparatus such that a deviation between said predicted processing result and said pre-set value is corrected.

6. A semiconductor plasma processing apparatus according to claim 1, further comprising:

a sensed data storage unit for preserving said sensed data; and

a processing result measured value storage unit for preserving a processing result inputted by said processing result input means,

wherein said model equation generation unit generates said model equation based on the sensed data and the measured value preserved in said respective storage units associated therewith, and preserves the generated model equation in a model equation storage unit.

7. A semiconductor plasma processing apparatus according to claim 1, further comprising:

a principal component extraction unit for extracting a principal component based on said sensed data acquired by said sensor; and

a fault detection unit for detecting a fault in processing based on variations in the principal component extracted by said extraction unit,

wherein said semiconductor plasma processing apparatus stops the processing when said fault detection unit detects a fault if said model equation generation unit has not generated a model equation.

8. A semiconductor plasma processing apparatus according to claim 1, wherein said model equation generation unit generates a model equation using a PLS method (Partial Least Square Method).

2. A semiconductor plasma processing apparatus for processing a semiconductor wafer, comprising:

a sensor for monitoring a processing state of said semiconductor plasma processing apparatus;

processing result input means for inputting externally measured values for processing results of a semiconductor wafer processed by said semiconductor processing apparatus in a pre-trial;

a model equation generation unit which generates a model equation for predicting a processing result using sensed data acquired by said sensor as an explanatory variable, based on said sensed data and said externally measured values;

a processing result prediction unit for predicting a processing result based on said model equation and said sensed data; and

a process recipe control unit for comparing said predicted processing result with a pre-set value to control a processing condition of said semiconductor plasma processing apparatus such that a deviation between said predicted processing result and said pre-set value is corrected;

wherein said model equation generation unit generates a model equation using robust regression.

3. A semiconductor plasma processing apparatus for processing a semiconductor wafer, comprising:

a sensor for monitoring a processing state of said semiconductor plasma processing apparatus;

processing result input means for inputting externally measured values for processing results of a semiconductor wafer processed by said semiconductor processing apparatus in a pre-trial;

a model equation generation unit which generates a model equation for predicting a processing result using sensed data acquired by said sensor as an explanatory variable, based on said sensed data and said externally measured values;

a processing result prediction unit for predicting a processing result based on said model equation and said sensed data; and

a process recipe control unit for comparing said predicted processing result with a pre-set value to control a processing condition of said semiconductor plasma processing apparatus such that a deviation between said predicted processing result and said pre-set value is corrected;

wherein said model equation generation unit generates a model equation using principal component robust regression.

4. A semiconductor plasma processing apparatus for processing a semiconductor wafer, comprising:

a sensor for monitoring a processing state of said semiconductor plasma processing apparatus;

processing result input means for inputting externally measured values for processing results of a semiconductor wafer processed by said semiconductor processing apparatus in a pre-trial;

a model equation generation unit which generates a model equation for predicting a processing result using sensed data acquired by said sensor as an explanatory variable, based on said sensed data and said externally measured values;

a processing result prediction unit for predicting a processing result based on said model equation and said sensed data; and

a display unit for displaying said predicted value or a deviation of said predicted value from a pre-set value.

5. A semiconductor processing apparatus for processing a semiconductor wafer, comprising:

a sensor for monitoring a processing state of said semiconductor processing apparatus;

processing result input means for inputting measured values for processing results of a semiconductor wafer processed by said semiconductor processing apparatus;

a model equation generation unit relying on sensed data acquired by said sensor and said measured values to generate a model equation for predicting a processing result using said sensed data as an explanatory variable;

a processing result prediction unit for predicting a processing result based on said model equation and said sensed data;

a process recipe control unit for comparing said predicted processing result with a previously set value to control a processing condition of said semiconductor processing apparatus such that a deviation between said predicted processing result and said previously set value is corrected;

a principal component extraction unit for extracting a principal component based on said sensed data acquired by said sensor; and

a fault detection unit for detecting a fault in processing based on variations in the principal component extracted by said extraction unit;

wherein said semiconductor plasma processing apparatus stops the processing when said fault detection unit detects a fault if said model equation generation unit has not generated a model equation; and

wherein said model equation generation unit generates a model equation using a PLS method (Partial Least Square method).

9. A semiconductor plasma processing apparatus for processing a semiconductor wafer, comprising:

a sensor for monitoring a processing state of said semiconductor plasma processing apparatus;

a model equation holding unit which receives and holds a model equation for predicting a processing result using sensed data acquired by said sensor as an explanatory variable, which is generated based on said sensed data and measured values, said measured values being externally measured values for processing results of a semiconductor wafer processed by said semiconductor plasma processing apparatus in a pre-trial;

a processing result prediction unit coupled to said model equation holding unit and said sensor, for predicting a processing result based on said model equation and said sensed data; and

a process recipe control unit for comparing said predicted processing result with a pre-set value to control a processing condition of said semiconductor plasma processing apparatus such that a deviation between said predicted processing result and said pre-set value is corrected.