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Method to achieve continuous hydrogen saturation in sparingly used electroless nickel plating process

  • US 6,616,967 B1
  • Filed: 04/15/2002
  • Issued: 09/09/2003
  • Est. Priority Date: 04/15/2002
  • Status: Active Grant
First Claim
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1. A method for forming metallurgical connections between wires containing gold and bond pads positioned on integrated circuits having copper interconnecting metallization, comprising the steps of:

  • placing a nickel bath into a state of hydrogen saturation by plating a sufficient surface of dummy material and by maintaining the bath in hydrogen saturation by placing a plating specimen of sufficient size metal in the nickel bath before the following steps of;

    activating the surface of said copper interconnecting surface, depositing seed metal, plating a layer of nickel barrier metal that resists copper diffusion by electroless deposition in said nickel bath that is in continuous hydrogen saturation; and

    plating a layer of bondable metal by electroless or immersion deposition.

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