High density stackable and flexible substrate-based semiconductor device modules

• US 6,617,671 B1
• Filed: 06/10/1999
• Issued: 09/09/2003
• Est. Priority Date: 06/10/1999
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Akram, Salman
• Primary Examiner(s): Williams, Alexander O.
• Application Number:
  US09/329,586
• Time in Patent Office: 1,552 Days
• Field of Search: 257/734, 257/737, 257/738, 257/777-781, 257/686, 257/685, 257/723, 257/730, 257/774, 257/680, 257/691, 361/719, 361/744, 361/749, 361/414, 361/813, 361/790, 361/735, 361/792, 361/777, 361/760, 361/720, 361/783, 361/772, 361/690, 361/704, 174/15.1, 174/254, 165/80.2, 165/80.3
• US Class Current: 257/668
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly

Abstract

A flexible carrier substrate assembly or module that facilitates stacking of multiple carrier substrates bearing semiconductor dice for high density electronic systems. After the dice are placed on the flexible substrate, a flexible support frame may be applied to the flexible substrate. The support frame includes conductive paths therethrough to connect to circuit traces running from the dice on the substrate to the substrate perimeter to interconnect superimposed carrier substrates. The flexible carrier substrates may be bent to a radius of any given curvature to conform to various non-planar regular and irregular surfaces. Furthermore, since the frame as well as the substrate may be flexible, multiple, flexible substrate assemblies may be stacked one on top of another wherein an upper assembly has a different radius than a lower module and any intermediate assemblies have progressively differing radii from bottom to top position.

Claims

1. A semiconductor device module, comprising:

a flexible carrier substrate having a surface portion carrying conductive traces thereon;

at least one semiconductor device connected to at least some of said conductive traces; and

a flexible support frame attached to said flexible carrier substrate, said flexible support frame including a plurality of conductive paths therethrough for providing electrical coupling of said at least one semiconductor device to circuitry external to said flexible carrier substrate.

2. The module according to claim 1, wherein said flexible carrier substrate exhibits a first radius of curvature.

3. The module according to claim 1, further comprising a second flexible carrier substrate having a surface mounted to said flexible support frame.

4. The module according to claim 3, wherein said flexible carrier substrate exhibits a first radius of curvature and said second flexible carrier substrate exhibits a second radius of curvature.

5. The module according to claim 3, wherein said second flexible Y carrier substrate has at least one semiconductor device attached to a surface thereof.

6. The module according to claim 3 wherein said flexible carrier substrate is shaped in a non-planar configuration and said second flexible carrier substrate substantially conforms to a shape of said flexible carrier substrate.

12. The module according to claim 3, wherein at least one of said flexible carrier substrate and said second flexible carrier substrate is configured to include a substantially 90°

arcuate section.

13. The module according to claim 1, wherein said flexible carrier substrate is configured to include a substantially 90°

arcuate section.

14. The module according to claim 1, wherein said flexible carrier substrate has sufficient flex to form at least a substantially 90°

arcuate bend.

15. The module according to claim 14, wherein said flexible support frame has sufficient flex to conform with said flexible carrier substrate.

16. The semiconductor device module of claim 1, wherein the flexible support frame is attached to the flexible carrier substrate at least along a substantial majority of a peripheral edge of the flexible carrier substrate.

17. The semiconductor device module of claim 3, further comprising a second flexible support frame attached to the second flexible carrier substrate, and a third flexible carrier substrate mounted on the second flexible support frame in a laminate manner.

7. A semiconductor device module, comprising:

a flexible carrier substrate having a surface portion carrying conductive traces thereon;

at least one semiconductor device connected to said conductive traces; and

a flexible support attached to said flexible carrier substrate along an outer perimeter edge thereof, said flexible support having at least one substantially vertical conductive path therethrough to provide electrical coupling of said conductive traces to circuitry external to said flexible carrier substrate.

8. The semiconductor device module according to claim 7, wherein said at least one conductive path is selected from the group comprising plated through holes, conductively-filled vias and preformed conductive elements.

9. A semiconductor device module, comprising:

a flexible carrier substrate having a surface portion carrying conductive traces thereon;

at least one semiconductor device connected to said conductive traces using tape automated bonding; and

a flexible support attached to said flexible carrier substrate, said support having at least one conductive path for providing electrical coupling of said conductive traces to circuitry external to said flexible carrier substrate.

10. A semiconductor device module, comprising:

a flexible carrier substrate having a surface portion carrying conductive traces thereon;

at least one semiconductor device connected to said conductive traces in a flip chip arrangement; and

a flexible support attached to said substrate to support a second substrate thereon, said support having a plurality of conductive paths therethrough for providing electrical coupling of said conductive traces to said second substrate.

11. A semiconductor device module, comprising:

a flexible substrate having a surface portion carrying conductive traces thereon;

at least one semiconductor device connected to said conductive traces; and

a pliable support, attached to said substrate, to support a second substrate, said pliable support having conductive paths for providing electrical coupling of said conductive traces to said second substrate and wherein said pliable support is curable to a rigid condition.