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Electronic device encapsulated directly on a substrate

  • US 6,617,786 B1
  • Filed: 04/04/2000
  • Issued: 09/09/2003
  • Est. Priority Date: 12/10/1996
  • Status: Expired due to Term
First Claim
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1. An electronic device, comprising:

  • a printed circuit board; and

    a plurality of encapsulated light emitting devices, each of the light emitting devices having been separately formed and mounted directly on the printed circuit board, wherein each of the light emitting devices consists of a single light emitting element and is separately and fully encapsulated by an encapsulating material molded onto and mechanically bonded to an area of the printed circuit board local to each individual light emitting device, and wherein the encapsulating material is a thermoplastic resin covering less than the entire surface of the printed circuit board and encapsulating each individual light emitting device and all of its electrical contacts.

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