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Modular electronics enclosure

  • US 6,618,250 B2
  • Filed: 08/30/2001
  • Issued: 09/09/2003
  • Est. Priority Date: 08/30/2001
  • Status: Expired due to Term
First Claim
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1. An electronics enclosure comprising:

  • a mounting bracket adapted to mount to a support structure;

    a heat absorption module acting as a heat sink adapted to mount to the mounting bracket; and

    a housing containing electronic circuitry comprising electronic components and adapted to mount alternatively to either the mounting bracket or the heat absorption module.

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