Multi-level electronic package and method for making same

• US 6,618,267 B1
• Filed: 09/22/1998
• Issued: 09/09/2003
• Est. Priority Date: 09/22/1998
• Status: Expired due to Term

• Current Assignee: Google LLC (Alphabet Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Dalal, Hormazdyar M., Gaudenzi, Gene Joseph
• Primary Examiner(s): Vigushin, John B.
• Application Number:
  US09/158,616
• Time in Patent Office: 1,813 Days
• Field of Search: 361/761, 361/764, 361/767, 361/803, 361/807, 361/816, 361/818, 361/820, 361/768, 361/804, 257/686, 257/700, 257/737, 257/777, 257/778, 439/66, 439/70, 324/754, 324/755, 324/758, 228/180.22
• US Class Current: 361/767
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2225/107 Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/165 Containers
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15331 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1627 stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards

Abstract

A multi-level package, and method for making same, that offers a small size with compartmentalized areas that allow for radiation shielding is disclosed. In its simplest embodiment, the invention comprises two cards and an interposer interposed between the two cards. The interposer preferably has an opening, and the combination of the interposer'"'"'s opening and the two cards form a cavity. The cavity allows for a high amount of components to be packed into a small, three-dimensional space. The interposer supports can act like a Faraday shield. The two cards and interposer can be multi-layered and support any type of chip or package connection on each side of each card or interposer, including through-hole, surface mount, and direct-chip attachment connections. Finally, pick-up plates or heat sinks can be attached to the package.

Claims

1. A package for containing electronic components, the package comprising:

a first circuitized card;

a second circuitized card;

an interposer interposed between the first and second circuitized cards, the interposer having an opening the opening in the interposer and the first and second circuitized card forming a cavity for containing at least one electronic component wherein the first circuitized card has a bottom surface and there Is at least one component mounted to the bottom surface, wherein the interposer, first circuitized card, and second circuitized card are circuitized multi-layer organic laminate cards, wherein the first circuitized card and interposer electrically and physically connected through a ball grid array and the interposer and the second circuitized card are electrically and physically connected through a ball grid array.

2. The package of claim 1 wherein the interposer, first circuitized card and second circuitized card act as a Faraday shield for electronic components placed inside the cavity.

3. The package of claim 2 wherein the interposer has at least one connection to at least one ground.

4. The package of claim 3 wherein the at least one connection is a multiplicity of connections to the at least one ground, the distance between a connection and its closest neighboring connection being approximately equal.

5. The package of claim 1 wherein the opening is square and is in the approximate center of the interposer.

6. The package of claim 1 wherein the first circuitized card has a top surface and there is at least one component mounted to the top surface.

7. The package of claim 1 wherein the second circuitized card has a top surface and there is at least one component mounted to the top surface.

8. The package of claim 1 wherein the second circuitized card has a bottom surface and there is at least one component mounted to the bottom surface.

9. The package of claim 1 wherein the second circuitized card has a bottom surface and the bottom surface has a ball grid array allowing connection to a system board.

10. The package of claim 1 wherein the first circuitized card has a top surface, the second circuitized card has a top surface and a bottom surface, and there is at least one component on the top surface of the first circuitized card, and there is at least one component on the top surface of the second circuitized card.

11. The package of claim 1 wherein at least one component is mounted to the first circuitized card and wherein the at least one component is attached to a heat sink or pick-up plate.

12. The package of claim 1 wherein the cavity contains at least one component.

13. The package of claim 12 wherein the at least one component inside the cavity is attached to a bottom surface of the first circuitized card or a top surface of the second circuitized card and wherein the at least one component is attached to the bottom surface of the first circuitized card or the top surface of the second circuitized card through surface mount attachment, direct chip attachment or through-hole attachment.

14. The package of claim 1 wherein the first circuitized card has a top surface and there is at least one component attached to the top surface of the first circuitized card through surface mount attachment, direct chip attachment or through-hole attachment.

15. A package for containing electronic components, the package comprising:

a first circuitized card having a top and bottom surface;

a second circuitized card having a top and bottom surface;

an interposer having an opening, a top surface, and a bottom surface, the interposer being electrically connected to the first circuitized card and the second circuitized card through a first and second set of connections, the first set of connections being interposed between the bottom surface of the first circuitized card and the top surface of the interposer, the second set of connections being interposed between the bottom surface of the interposer and the top surface of the second circuitized card, wherein (a) the bottom surface of the second circuitized card has a third set of connections for attaching the second circuitized card to a system card, (b) the opening in the interposer, the bottom surface of the first circuitized card, and the top surface of the second circuitized card form a cavity for containing at least one electronic component, (c) the Interposer, first circuitized card, and second circuitized card are circuitized multi-layer organic laminate cards, and (d) each set of connections of the first, second and third sets of connections is a ball grid array.

16. The package of claim 15 wherein the cavity contains at least one electronic component.

17. The package of claim 16 wherein the at least one component inside the cavity is attached to a bottom surface of the first circuitized card or a top surface of the second circuitized card and wherein the at least one component is attached to the bottom surface of the first circuitized card or the top surface of the second circuitized card through surface mount attachment, direct chip attachment or through-hole attachment.

18. The package of claim 16 wherein the first circuitized card has a top surface and there is at least one component attached to the top surface of the first circuitized card through surface mount attachment, direct chip attachment or through-hole attachment.

19. The package of claim 15 wherein the interposer acts as a Faraday shield for electronic components placed inside the cavity.

20. The package of claim 19 wherein the interposer has at least one connection to at least one ground.

21. The package of claim 20 wherein the at least one connection is a multiplicity of connections to the at least one ground, the distance between a connection and its closest neighboring connection being approximately equal.

22. The package of claim 15 wherein the opening is square or rectangular and is in the approximate center of the interposer.

23. The package of claim 15 wherein there is at least one electronic component mounted to the top surface of the first circuitized card.

24. The package of claim 15 wherein there is at least one electronic component mounted to the bottom surface of the first circuitized card.

25. The package of claim 15 wherein there is at least one electronic component mounted to the top surface of the second circuitized card.

26. The package of claim 15 wherein the interposer has at least one electronic component on its surface.

27. The package of claim 15 further comprising a third circuitized card and a second interposer having a second opening, wherein the third circuitized card, the second circuitized card, and the second opening in the second interposer define a second cavity for containing at least one electronic component, wherein the third circuitized card is electrically connected to the second interposer through a fourth set of connections, and wherein the second interposer is electrically connected to the second circuitized card through a fifth set of connections.

28. A package for containing electronic components, the package comprising:

a first circuitized card having a top and bottom surface;

a second circuitized card having a top and bottom surface;

an interposer having an opening a top surface, and a bottom surface, the interposer being electrically connected to the first circuitized card and the second circuitized card through a first and second set of connections, the first set of connections being interposed between the bottom surface of the first circuitized card and the top surface of the interposer, the second set of connections being interposed between the bottom surface of the interposer and the top surface of the second circuitized card, wherein (a) the bottom surface of the second circuitized card has a third set of connections for attaching the second circuitized card to a system card, (b) the opening in the interposer, the bottom surface of the first circuitized card, and the top surface of the second circulitized card form a cavity for containing at least one electronic component, (c) the Interposer, first circuitized card, and second circuitized card are circuitized multi-layer organic laminate cards, and (d) said interposer has at least one electronic component on its surface.